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六面顶压机高压腔体温度场的数值模拟
引用本文:刘芳,刘永刚,谢鸿森.六面顶压机高压腔体温度场的数值模拟[J].高压物理学报,2012,26(2):135-140.
作者姓名:刘芳  刘永刚  谢鸿森
作者单位:中国科学院地球化学研究所;中国科学院研究生院
基金项目:国家自然科学基金(40974052);中国科学院知识创新工程重要方向项目(KZCX2-YW-Q08-3-4)
摘    要: 以有限元法为分析手段,在模型和边界条件适当简化的条件下,对六面顶压机高压腔体的温度场进行了数值模拟计算,得出了腔体内的温度分布。在此基础上通过调整模型参数,定性讨论了样品组装设计中组装材料、加热器形状以及导电金属环厚度对温度场的影响。数值模拟结果表明:用氧化锆替代叶蜡石作为堵头和保温材料可以提高样品区的温度,降低功率的消耗并减小样品区的温度梯度;与圆筒形加热器组装相比,中间厚两端薄的变圆筒形加热器组装能提供更高的样品中心温度和较小的温度梯度;使用导电金属环的加热组装时,适当增加金属环的厚度有利于获得较理想的温度分布。研究结果对优化高压实验的样品组装设计、改善温度梯度及保护设备具有一定的参考价值。

关 键 词:六面顶压机  温度场  样品组装设计  数值模拟

Numerical Simulation of Temperature Field in Sample Assembly of Cubic Press
LIU Fang,LIU Yong-Gang,XIE Hong-Sen.Numerical Simulation of Temperature Field in Sample Assembly of Cubic Press[J].Chinese Journal of High Pressure Physics,2012,26(2):135-140.
Authors:LIU Fang  LIU Yong-Gang  XIE Hong-Sen
Institution:1(1.Institute of Geochemistry,Chinese Academy of Sciences,Guiyang 550002,China; 2.Graduate University of Chinese Academy of Sciences,Beijing 100049,China)
Abstract:Numerical simulation for the temperature distribution in sample assembly of cubic press was carried out by using the finite-element method with simplified model and boundary conditions.Based on the adjustment of parameters of the models in simulation,the temperature distribution induced by pressure transmission media,shapes of heater and conductive metal ring were discussed in details.The results indicate that the use of zirconia instead of pyrophyllite as the buffer and thermal insulator can elevate the temperature and at the same time lower the thermal gradient in sample area while reducing power consumption.Different shapes of heater will affect on the temperature distribution.In the case of the metal ring being used in assembly,properly increasing the thickness of the ring will be beneficial to obtain desirable temperature distribution.This work could be a useful reference to optimize the design of sample assembly in cubic press for high temperature and high pressure experiments.
Keywords:cubic press  temperature distribution  sample assembly  numerical simulation
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