| Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface |
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| 引用本文： | 刘梅 张建刚 吕曜 夏善红. Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface[J]. 中国物理快报, 2006, 23(1): 42-44 |
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| 作者姓名： | 刘梅 张建刚 吕曜 夏善红 |
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| 作者单位： | State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080 |
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| 基金项目： | Supported by the National Natural Science Foundation of China under Grant No 90207006. |
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| 摘 要： | ![]()
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| 关 键 词： | 自装配 硅衬底 液-液界面 三维微结构 微电子学 |
| 收稿时间： | 2005-09-29 |
| 修稿时间： | 2005-09-29 |
Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface |
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| LIU Mei, ZHANG Jian-Gang, LV Yao, XIA Shan-Hong. Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface[J]. Chinese Physics Letters, 2006, 23(1): 42-44 |
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| Authors: | LIU Mei ZHANG Jian-Gang LV Yao XIA Shan-Hong |
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| Abstract: | ![]()
We report a new approach for the self-assembly of cuboid micro-parts onto Si substrates to construct three-dimensional microstructures. To perform assembly, the Si substrates are prepared with a deep cavity array as binding sites. An aggregate composed of hundreds of uniformly aligned micro-parts is formed at the C10F18-H2O interface. The micro-parts are arranged by passing the substrate through the aggregate of micro-parts, thus the micro-parts are left on the substrate, and then the substrate is vibrated ultrasonically in the solution, making it possible for the micro-parts to fall into the cavities on the substrate. Finally the substrate is pulled out of the solution after assembly. This technique could give a high yield of up to 70%, providing a new method for micro-assembly. |
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