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Curing reaction characteristics and phase behaviors of biphenol type epoxy resins with phenol novolac resins |
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| Authors: | Shao-ping Ren Yan-xun Lan You-dao Ling Man-geng Lu |
| Institution: | a Guangdong Key Laboratory of Polymer Materials for Electronics, Guangzhou 510650, PR China b Guangzhou Institute of Chemistry Chinese Academy of Sciences, Guangzhou 510650, PR China c Graduate School of the Chinese Academy of Science, Beijing 100039, PR China |
| Abstract: | Diglycidyl ether of 4,4′-dihydroxybiphenol (BPDGE) is a liquid crystalline epoxy. The biphenyl epoxy (diglycidyl ether of 3,3′,5,5′-tetramethyl-4,4′-biphenyl, TMBPDGE) has found great applications in plastic encapsulated semiconductor packaging. Phenol novolac (PN) was used as curing agent. The reaction kinetics of BPDGE/PN and TMBPDGE/PN systems in the presence of triphenylphosphine (TPP) were characterized by an isoconversional method under dynamic conditions using differential scanning calorimetry (DSC) measurements. The results showed that the curing of epoxy resins involves different reaction stages and the values of activation energy are dependent on the degree of conversion. The effects of curing temperature on their phase structure have been investigated with polarized optical microscopy and Wide-angle X-ray diffraction. With proper curing process, BPDGE showed a nematic phase when cured with PN. |
| Keywords: | Liquid crystalline epoxy resin Curing kinetics Phase behaviors |
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