Full-field Thermal Deformation Measurements in a Scanning Electron Microscope by 2D Digital Image Correlation |
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Authors: | N. Li M. A. Sutton X. Li H. W. Schreier |
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Affiliation: | (1) Department of Mechanical Engineering, University of South Carolina, Columbia, SC 29208, USA;(2) Correlated Solutions, 120 Kaminer Way, Columbia, SC 29210, USA |
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Abstract: | ![]() Using recently developed methods for application of a nano-scale random pattern having high contrast during SEM imaging, baseline full-field thermal deformation experiments have been performed successfully in an FEI Quanta SEM using 2D-DIC methods. Employing a specially redesigned commercial heating plate and control system, with modified specimen attachment procedures to minimize unwanted image motions, recently developed distortion correction procedures were shown to be effective in removing both drift and spatial distortion fields under thermal heating. 2D-DIC results from heating experiments up to 125°C on an aluminum specimen indicate that (a) the fully corrected displacement components have nearly random variability and a standard deviation of 0.02 pixels (≈25 nm at 200× and ≈0.5 nm at 10,000×) in each displacement component and (b) the unbiased measured strain fields have a standard deviation ≈150 × 10−6 and a mean value that is in good agreement with independent measurements, confirming that the SEM-DIC based method can be used for both micro-scale and nano-scale thermal strain measurements. |
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Keywords: | Scanning electron microscope Imaging Random pattern application 2D digital image correlation Thermal strain measurement |
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