| Affiliation: | 1. MBE Lab, IMM-Instituto de Microelectrónica de Madrid (CNM-CSIC), Isaac Newton 8, PTM, E-28760 Tres Cantos, Madrid, Spain;2. Department of Physics, Columbia University, New York, NY, USA;3. Electrical Engineering Department, Princeton University, NJ, USA;4. Department of Applied Physics and Applied Mathematics, Columbia University, New York, NY, USA;5. School of Physics, Exeter University, Exeter, UK;6. Department of Mechanical Engineering, Columbia University, New York, NY, USA;7. Department of Electrical Engineering and Department of Mechanical Engineering, Columbia University, New York, NY, USA;8. Advanced Materials Laboratory, National Institute for Materials, Science, 1-1 Namiki, Tsukuba 305-0044, Japan;1. Institute of Electronics, National Taiwan University, Taipei, Taiwan;2. Research Center for Applied Sciences, Academia Sinica, 128 Sec. 2, Academia Road, Nankang, Taipei 11529 Taiwan;3. Institute of Optoelectronic Sciences, National Taiwan Ocean University, Keelung, Taiwan;4. College of Photonics, National Chiao-Tung University, Tainan, Taiwan;1. Graduate Institute of Electronics Engineering, National Taiwan Univeristy, Taipei, Taiwan, ROC;2. Research Center for Applied Science, Academia Sinica, Nankang, Taipei, Taiwan, ROC;3. Institute of Display, National Chiao-Tung University, Hsinchu, Taiwan, ROC;1. Department of Mechanical and Manufacturing Engineering, University of Cyprus, 1678 Nicosia, Cyprus;2. Department of Mechanical Engineering, Khalifa University of Science, Technology & Research, Abu Dhabi, United Arab Emirates;1. Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH 45433, United States;2. Wyle Laboratories, Inc., 2601 Mission Point Blvd., Dayton, OH 45431, United States;3. University of Dayton Research Institute, University of Dayton, Dayton, OH 45469, United States |
