基于碳化硅衬底的宽禁带半导体外延

宽禁带半导体具备禁带宽度大、电子饱和飘移速度高、击穿场强大等优势,是制备高功率密度、高频率、低损耗电子器件的理想材料。碳化硅(SiC)材料具有热导率高、化学稳定性好、耐高温等优点,在SiC衬底上外延宽禁带半导体材料,对充分发挥宽禁带半导体材料的优势,并提升宽禁带半导体电子器件的性能具有重要意义。得益于SiC衬底质量持续提升及成本不断降低,基于SiC衬底的宽禁带半导体电子市场占比呈现逐年增加的态势。在SiC衬底上外延生长高质量的宽禁带半导体材料是提高宽禁带半导体电子器件性能及可靠性的关键瓶颈。本文综述了近年来国内外研究者们在SiC衬底上外延SiC、氮化镓(GaN)、氧化镓(Ga₂O₃)所取得的研究进展,并展望了SiC衬底上宽禁带半导体外延的发展及应用前景。     

GaN单晶衬底上同质外延界面杂质的研究

氮化镓单晶衬底上的同质外延具有显著的优势,但是二次生长界面上的杂质聚集一直是困扰同质外延广泛应用的难题,特别是对电子器件会带来沟道效应,对激光器应用会影响谐振腔中的光场分布。本文通过金属有机化合物化学气相沉积(MOCVD)生长的原位处理,实现了界面杂质聚集的有效抑制。研究发现,界面上的主要杂质是C、H、O和Si,其中C、H、O可以通过原位热清洗去除;界面Si聚集的问题主要是由衬底外延片保存过程中暴露空气带来的,其次是氮化镓衬底中Si背底浓度,在外延过程中,生长载气对氮化镓单晶衬底不稳定的N面造成刻蚀,释放的杂质元素会对二次生长界面产生影响,本文较系统地阐明了界面杂质的形成机制,并提出了解决方案。     

Epitaxial Crystallization of Linear Polyethylene in Blends with Isotactic Polypropylene

The structure and morphology of extrusion-oriented ribbons of polypropylene/polyethylene blends is described. The blends with 20%, 30%, and 40% of oriented isotactic polypropylene fibrils show homo- and heteroepitaxial structures. Partial mutual solubility of the blend components influenced the melting and crystallization behavior.     

一种新的量子点形成机制:表面原子的向上扩散运动

在Al(110)表面的同质外延生长中，实验上观察到许多由特殊小面围成的较大的量子点．这些长方盒形的量子点要比外延膜的平均厚度至少高十倍以上，密度泛函理论的研究发现，动力学过程是导致形成具有特定小面量子点的主要原因，其关键机制是表面原子的向上扩散运动。     

Optical microscopic, synchrotron X-ray topographic and reticulographic study of homoepitaxial CVD diamond

Surface topography and crystal-lattice perfection of homoepitaxial layers deposited by microwave plasma CVD on (0 0 1) and near-(0 0 1) facets polished on HPHT synthetic diamond are described. Optical micrographic techniques included birefringence, Nomarski and 2-beam interference. The synchrotron X-ray experiments comprised Laue topography plus a recently developed sensitive misorientation-measuring technique, reticulography. Two special circumstances enhanced information yield from the experiments. First, the substrate crystal was unusually strain-free and had a very low dislocation content. Second, epilayer growth had taken place in two stages, depositing thicknesses of 10 μm and 30–34 μm, respectively. This double deposition complicated the observations, but added features of scientific and practical interest. Epilayer cracking finally present had occurred almost entirely before the second growth stage. With assistance from quantitative data provided by reticulography, the X-ray diffraction properties of the substrate and epilayers are analysed. Lattice misorientations on the untreated lower surface of the substrate were only 1 arcsec except close to growth-sector boundaries and dislocation outcrops. The final epilayer growth surface above areas where cracking in the first epilayer was absent or sparse exhibited near-perfect-crystal diffraction behaviour.     

STM observation of pit formation and evolution during the epitaxial growth of Si on Si(001) surface

Pit formation and surface morphological evolution in Si(001) homoepitaxy are investigated by using scanning tunneling microscopy. Anti-phase boundary is found to give rise to initial generation of pits bound by bunched D B steps. The terraces break up and are reduced to a critical nucleus size with pit formation. Due to anisotropic kinetics, a downhill bias diffusion current, which is larger along the dimer rows through the centre area of the terrace than through the area close to the edge, leads to the prevalence of pits bound by {101} facets. Subsequent annealing results in a shape transition from {101}-faceted pits to multi-faceted pits.     

Quasi-homoepitaxial GaN-based blue light emitting diode on thick GaN template

The high power GaN-based blue light emitting diode (LED) on an 80-μ-thick GaN template is proposed and even realized by several technical methods like metal organic chemical vapor deposition (MOCVD), hydride vapor-phase epitaxial (HVPE), and laser lift-off (LLO). Its advantages are demonstrated from material quality and chip processing. It is investigated by high resolution X-ray diffraction (XRD), high resolution transmission electron microscope (HRTEM), Rutherford back-scattering (RBS), photoluminescence, current-voltage and light output-current measurements. The width of (0002) reflection in XRD rocking curve, which reaches 173" for the thick GaN template LED, is less than that for the conventional one, which reaches 258". The HRTEM images show that the multiple quantum wells (MQWs) in 80-μm-thick GaN template LED have a generally higher crystal quality. The light output at 350 mA from the thick GaN template LED is doubled compared to traditional LEDs and the forward bias is also substantially reduced. The high performance of 80-μm-thick GaN template LED depends on the high crystal quality. However, although the intensity of MQWs emission in PL spectra is doubled, both the wavelength and the width of the emission from thick GaN template LED are increased. This is due to the strain relaxation on the surface of 80-μm-thick GaN template, which changes the strain in InGaN QWs and leads to InGaN phase separation.