Continuous wavelet transform for micro-component profile measurement using vertical scanning interferometry

White-light interferometric techniques have been widely used in three-dimensional (3D) profiling. This paper presents a new method based on vertical scanning interferometry (VSI) for the 3D profile measurement of a micro-component that contains sharp steps. The use of a white-light source in the system overcomes the phase ambiguity problem often encountered in monochromatic interferometry and also reduces speckle noises. A new algorithm based on the continuous wavelet transform (CWT) is used to retrieve the phase of an interferogram. The algorithm accurately determines local fringe peak and improves the vertical resolution of the measurement. The proposed method is highly resistant to noise and is able to achieve high accuracy. A micro-component (lamellar grating) fabricated by sacrificial etching technique is used as a test specimen to verify the proposed method. The measurement uncertainty of the experimental results is discussed.     

固定时间域可变采样间隔的统计控制图

本文从提高统计控制图对过程波动检测能力和方便管理的角度出发 ,对可变采样间隔(VSI)控制图进行改进 ,提出了针对连续过程质量控制应用需要的固定时间域可变采样间隔(VSIFT)控制图。文章详细介绍了VSIFT均值极差控制图、VSIFTEWMA控制图的设计 ,并分别评价了它们对过程异常状态的检测能力     

Investigation of a dual-layer structure using vertical scanning interferometry

This paper proposes a method based on white light vertical scanning interferometry (VSI) to investigate a dual-layer structure. The optical arrangement is based on a modified Michelson interferometer that utilizes a reference beam and two object beams. Each object beam interferes with the reference beam and produces an interferogram. A series of interferograms are obtained on a dual-layer structure and the thickness of each layer is obtained. A continuous wavelet transform (CWT) is used to extract the envelope of each interferogram in order to determine the peak intensity that provides an indication of each layer's boundary. Tests are conducted on a semiconductor wafer and a micro-gear made of polymeric material deposited on a metal substrate. Results show that the proposed method has a good potential for investigating a dual-layer micro-structure.