Modeling the Effect of Injection Molding Process Parameters on Warpage Using Neural Network Theory

A back propagation artificial neural network (BPANN) prediction model for warpage of injection-molded polypropylene was developed based on an orthogonal design method. The BPANN model was trained by the input and output data obtained from the moldflow software platform simulations. It is proved that the BPANN model can predict the warpage with reasonable accuracy. Utilizing the BPANN model, the effects of the process parameters, packing pressure (Pp), melt temperature (T_me), mold temperature (T_mo), packing time (t_p), cooling time (t_c), and fill pressure (p_f), on the warpage were investigated. The most important process parameter affecting the warpage was Pp, and the second most important was T_me. The rest of the process parameters, T_mo, t_p, t_c, and p_f, were found to be relatively less influential. Warpage increased with elevating T_mo. In contrast, an increase in Pp and T_me caused the warpage to decrease.     

Warpage prediction of optical media

The warpage of injection–compression‐molded optical media, such as compact discs and digital video discs, due to asymmetric cooling during production is predicted. Thermally induced stress is calculated with a nonisothermal compressible flow simulation with a viscoelastic constitutive model. A finite element analysis is formulated with axisymmetric plate elements based on Kirchhoff thin‐plate theory to simulate the warpage of the disc due to the asymmetric thermal stress and gravity after demolding. Simulation results of warpage for compact‐disc‐recordable moldings are compared with experimental observations under different processing conditions, such as the melt temperature, mold temperature, and packing pressure, with an optical grade of polycarbonate. The comparison shows that the simulation well predicts the effects of various processing conditions. Both the simulation and experiment indicate that of the processing conditions, the mold temperature has the greatest effect on warpage. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 859–872, 2003     

翘曲度对锗烯的电子结构及光学性质的影响

本文采用基于密度泛函理论的第一性原理方法研究不同翘曲度下锗烯的电子结构及光学性质,分析翘曲度对电子结构及光学性质的影响。采用六种不同的近似方法对锗烯的几何结构进行优化,得到最稳定的结构体系,在此基础上选取不同的翘曲度,并对翘曲度的稳定性进行论证得到三种较稳定的翘曲结构。通过翘曲度的调节打开锗烯的带隙,并且通过调节翘曲度实现锗烯带隙在间接带隙和直接带隙之间的转化,通过分析态密度解释了能带结构的调控机制,以及翘曲度对锗烯光学性质的影响。研究表明翘曲度能够有效地调控锗烯的电子结构和光学性质,提高光电子利用效率。     

IGBT模块封装中大面积基板连接的应力翘曲分析

模拟绝缘栅双极型晶体管(IGBT)模块中用烧结银对直接覆铜(DBC)基板与铜底板进行大面积连接的过程，发现大面积基板连接会产生很大的翘曲与严重的残余应力．增加铜底板厚度使其刚度增大，能有效改善基板连接的翘曲问题．基板连接的最大残余应力产生于DBC上铜层与陶瓷层连接的角点处，随DBC铜层厚度的增加而增加，随陶瓷层厚度的增加而减小，与焊层厚度关系不大．其主要原因是各层材料厚度变化对结构整体热膨胀系数的改变程度不同，而DBC铜层与陶瓷层之间热失配程度最严重．结构厚度改变对连接层应力大小影响不大，但增加底板厚度会恶化连接层的应力分布，不利于模块长期可靠性．采用DBC下沉法和反向预翘曲法可以在控制连接层残余应力的条件下有效降低IGBT模块因烧结引起的翘曲，不会降低模块的可靠性．     

利用具有相位跳跃技术的阴影摩尔图测量电子组装元件的热翘曲

Phase-stepping technique is applied to the analysis of fringe patterns of shadow moiré of electronic packages.Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased.Thermally induced warpage of electronic packages is successfully measured in real-time as the sample is driven through a simulated reflow process.The paper discusses the technique of phase stepping,noise filtering and its application to the shadow moiré method.Applications of the technology are presented.     

基于Taguchi试验设计方法的注塑成型翘曲优化

应用Taguchi试验设计方法,选用正交表L9（34）进行正交试验设计和方差分析,对注塑流动过程进行CAE模拟分析,研究了熔体温度、模具温度、保压压力和保压时间等因素对制品翘曲影响的显著性和贡献度.并根据上述试验得到的影响度排名,将最重要因素的水平进行密化,通过混合水平正交试验设计,获取各因素最佳水平组合,对注塑工艺参数进行优化,大大提高了注塑产品质量.     

Construction of Pre-Deformed Shapes for Rapid Tooling in Injection Molding

The major issues in the development of injection molding technology include the progress in CAE and the developments in tool design methodology such as rapid tooling. The applicability of rapid tooling in injection molding was examined using unbalanced cooling to analyze the warpage and shrinkage. Moldflow Plastics Insight simulation software was used for the deformation calculations with different mold thermal conductivities. It can be concluded that the decreasing mold thermal conductivity will dramatically increase the volumetric shrinkage and the warpage as well. Because of these effects, it is of fundamental importance to compensate for the shrinkage and warpage, so in the paper a new design methodology is suggested for rapid tooling, which is based on the pre-deformed model.     

三层薄板的热屈曲测量及特征反演

The paper presents a new study on a tri-layer thin plate.Shadow moiré implemented with an advanced phase unwrapping technique is employed to obtain actual flexural deformation of a real-life plate sample subjected to thermal loads.An analytical model is re-formulated to provide the plate with global closed-form solutions of the plate deflection as well as the interfacial stress and strain.With the measurements and the solutions available,an inverse iterative approach is developed to evaluate and maximize th...     

Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state

The warpage of plastic‐encapsulated IC packages after molding is believed to be induced by thermal and cure shrinkage of epoxy molding compound (EMC). To study the warpage behaviors of EMC, the amount of cure‐induced shrinkage needs to be understood. Volume shrinkage behaviors induced by cure reaction of EMC in isothermal and isobaric states were studied with a differential scanning calorimeter (DSC) and a pressure–temperature‐controlled dilatometer. The results show that higher pressure induce more volume shrinkage under fixed temperature but the difference of volume shrinkage under different pressure levels doesn't obey the principle of linearity. It is observed that the amount of chemical volume shrinkage at 145 °C is higher than those under three other temperatures: 160, 175, and 190 °C. The chemical volume shrinkage of EMC is found to be very process dependent. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 2392–2398, 2005     

电子封装中材料的几何尺寸对翘曲的影响

电子器件的封装技术是制约集成电路发展的关键环节之一。封装中各材料（基底、粘结层、芯片及封装材料）的几何尺寸、材料性能的差异引起的翘曲问题严重影响芯片的可靠性和焊接性能。本文采用数值分析方法，并考虑玻璃态转化温度（Tg）对材料性能（弹性模量和热膨胀系数）的影响，研究了尺寸变化对芯片翘曲的影响。分析表明基底与芯片厚度比和封装材料与芯片厚度比的变化对翘曲的影响较大，基底与芯片面积比和粘结层与芯片高度比的变化对整体翘曲的影响较小，本文结果为进一步封装设计提供理论依据。