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A new electrically conductive photoresist has been developed. It is based on the dispersion of silver nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 2‐Mercaptopropionic acid was used as the surfactant to modify the silver nanoflake surface for the dispersion of silver nanoflakes in the polymer. The silver/PSPI nanocomposites showed electrical conductivity at a low silver content of 10 wt %. The electrical conductivity of the silver/PSPI nanocomposites ranged from 10 to 104 S/cm, which was dependent on the silver weight fraction in the resist formulation. Patterns with a resolution of 30 μm were obtained from the silver/PSPI nanocomposites. The silver/PSPI nanocomposites had excellent thermal properties. Their glass transition temperatures were above 360 °C and thermal decomposition temperatures were over 420 °C. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 1575–1583, 2009  相似文献   
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