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物理学   3篇
  2014年   3篇
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Nitrogen plasma passivation(NPP) on(111) germanium(Ge) was studied in terms of the interface trap density,roughness, and interfacial layer thickness using plasma-enhanced chemical vapor deposition(PECVD). The results show that NPP not only reduces the interface states, but also improves the surface roughness of Ge, which is beneficial for suppressing the channel scattering at both low and high field regions of Ge MOSFETs. However, the interfacial layer thickness is also increased by the NPP treatment, which will impact the equivalent oxide thickness(EOT) scaling and thus degrade the device performance gain from the improvement of the surface morphology and the interface passivation. To obtain better device performance of Ge MOSFETs, suppressing the interfacial layer regrowth as well as a trade-off with reducing the interface states and roughness should be considered carefully when using the NPP process.  相似文献   
2.
In this paper, a new equivalent circuit model of GaN-based light emitting diodes (LEDs) is established. The impact of the series resistance to luminous efficacy is simulated using the MATLAB software. GaN-based LEDs with different n- contact electrode materials (LEDs with Ni/Au and LEDs with Cr/Au) are fabricated. By comparing and analyzing the results of performances, we concluded that both the series resistance and the carrier loss could affect the luminous efficacy severely. LEDs with lower series resistance have higher luminous efficacy and its efficiency droop is alleviated simultaneously. To improve luminous efficacy, the fabrication process should be optimized for lower series resistance.  相似文献   
3.
An extensive and complete experimental investigation with a full layout design of the channel direction was carried out for the first time to clarify the orientation dependence of germanium p-channel metal-oxide-semiconductor field-effect transistors (PMOSFETs). By comparison of gate trans-conductance, drive current, and hole mobility, we found that the performance trend with the substrate orientation for Ge PMOSFET is (110)〉(111) ~ (100), and the best channel direction is (110)/[110]. Moreover, the (110) device performance was found to be easily degraded as the channel direction got off from the [ 110] orientation, while (100) and (111) devices exhibited less channel orientation dependence. This experimental result shows good matching with the simulation reports to give a credible and significant guidance for Ge PMOSFET design.  相似文献   
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