InGaAs单光子探测器传感检测与淬灭方式

针对InGaAs单光子雪崩光电二极管(SPAD)的光电感应特性,研究了基于门控主动式淬灭的SPAD动态偏置控制和电路实现的策略.采用门控主动淬灭控制可降低淬灭时间,有效抑制暗计数和后脉冲效应.接口感应检测电路采用标准互补金属氧化物半导体(CMOS)工艺进行制造,而SPAD则采用非标准CMOS工艺.利用铟柱互连混合封装工艺实现SPAD与感应接口电路的协同工作.在低温-30?C的条件下,实现了SPAD光触发雪崩电流信号的提取和快速淬灭.研究了感应电阻和临界检测电压对传感检测电性能的影响,并采用简单电路结构实现状态检测,实测得到的SPAD恢复时间、传输延时分别为575,563 ps,淬灭时间为1.88 ns,满足纳秒级精度传感检测应用的需要.     

参数共振微扰法在Boost变换器混沌控制中的实现及其优化

参数共振微扰法是一种简单的非反馈混沌控制方法，它十分适合非自治系统的混沌控制.研究了这种方法在电流模式控制Boost变换器混沌控制中的应用，并通过对扰动相位进行优化 ，达到最优的混沌控制结果.同时对参数共振微扰法及其优化方法在Boost变换器混沌控制中的作用进行了理论分析，推导并计算了各种电路参数变化对有效的混沌控制所需的扰动的影响. 关键词： Boost变换器 混沌 混沌控制 参数共振微扰法     

Impact of STI indium implantation on reliability of gate oxide

The impacts of shallow trench isolation(STI)indium implantation on gate oxide and device characteristics are studied in this work.The stress modulation effect is confirmed in this research work.An enhanced gate oxide oxidation rate is observed due to the enhanced tensile stress,and the thickness gap is around 5%.Wafers with and without STI indium implantation are manufactured using the 150-nm silicon on insulator(SOI)process.The ramped voltage stress and time to breakdown capability of the gate oxide are researched.No early failure is observed for both wafers the first time the voltage is ramped up.However,a time dependent dielectric breakdown(TDDB)test shows more obvious evidence that the gate oxide quality is weakened by the STI indium implantation.Meanwhile,the device characteristics are compared,and the difference between two devices is consistent with the equivalent oxide thickness(EOT)gap.