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用密度泛函理论DFT方法,计算研究不对称簇合物(HFGaN3)n (n=1-6)的几何构型、稳定性、IR谱和热力学性质。结果表明,簇合物(HFGaN3)n (n=2-6)的优化构型拥有一个Ga和α−N原子交替的2n元环状结构。通过计算研究(HFGaN3)n (n=1-6)的平均结合能、二阶能量差分和能隙与团簇尺寸关系,发现后两者表现出明显的“奇-偶”振荡现象。对计算获得的IR谱进行归属,获得四个特征区。讨论了团簇尺寸和温度对(HFGaN3)n (n=1-6)热力学函数的影响。由焓变和吉布斯自由能可知,200-800 K温度范围内由单体形成稳定的多聚体(HFGaN3)n (n=2-6)在热力学上有利。 相似文献
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Fabrication and characterization of groove-gate MOSFETs based on a self-aligned CMOS process 总被引:2,自引:0,他引:2 下载免费PDF全文
N and P-channel groove-gate MOSFETs based on a self-aligned CMOS process
have been fabricated and characterized. For the devices with channel length
of 140nm, the measured drain induced barrier lowering (DIBL) was 66mV/V for
n-MOSFETs and 82mV/V for p-MOSFETs. The substrate current of a groove-gate
n-MOSFET was 150 times less than that of a conventional planar n-MOSFET.
These results demonstrate that groove-gate MOSFETs have excellent
capabilities in suppressing short-channel effects. It is worth emphasizing
that our groove-gate MOSFET devices are fabricated by using a simple process
flow, with the potential of fabricating devices in the sub-100nm range. 相似文献
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在"讲一练二考三"新型教学理念的指导下,结合多年非化学专业无机及分析化学课程理论教学和实验教学的经验,针对无机及分析化学理论课和实验课教学的特点和存在的一些问题,阐述了在无机及分析化学课程教学中理论课教学内容和实验课教学内容相结合的实践探索和体会,以及取得的效果。 相似文献
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介绍了氮杂环高分子配合物及其电催化性能,归纳了含氮杂环高分子配合物的结构类型及其在界面上的自组装过程,分析了氮杂环高分子自组装膜表面化学反应的特性。对自组装技术制备超薄层材料及表面改性技术在分子电子器件等方面的应用作了评述。 相似文献
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HOT-CARRIER GENERATION MECHANISM AND HOT-CARRIER EFFECT IMMUNITY IN DEEP-SUB-MICRON GROOVED-GATE PMOSFETS 下载免费PDF全文
Based on the hydrodynamic energy transport model, immunity from the hot-carrier effect in deep-sub-micron grooved-gate p-channel metal-oxide-semiconductor field-effect transistors (PMOSFETs) is analysed. The results show that hot carriers generated in grooved-gate PMOSFETs are much smaller than those in planar ones, especially for the case of channel lengths lying in the deep-sub-micron and super deep-sub-micron regions. Then, the hot-carrier generation mechanism and the reason why grooved-gate MOS devices can suppress the hot-carrier effect are studied from the viewpoint of physical mechanisms occurring in devices. It is found that the highest hot-carrier generating rate is at a medium gate bias voltage in three stress areas, similar to conventional planar devices. In deep-sub-micron grooved-gate PMOSFETs, the hot-carrier injection gate current is still composed mainly of the hot-electron injection current, and the hole injection current becomes dominant only at an extremely high gate voltage. In order to investigate other influences of the hot-carrier effect on the device characteristics, the degradation of the device performance is studied for both grooved-gate and planar devices at different interface states. The results show that the drift of the device electrical performance induced by the interface states in grooved-gate PMOSFETs is far larger than that in planar devices. 相似文献