Hamilton体系下含弱粘接复合材料层合板的灵敏度分析研究

基于径向基点插值函数(RPIM),在Hamilton体系下研究了含弱粘接复合材料层合板的灵敏度分析问题.利用弹簧层模型和修正H-R(Hellinger-Reissner)变分原理,推导了可用于含弱粘接复合材料层合板响应和灵敏度分析的混合控制方程,给出了基于该混合控制方程进行灵敏度分析的解析法(AM)、半解析法(SA)和有限差分法(FD).该混合控制方程的主要优点是可以在进行灵敏度分析过程中避免卷积运算.另外,利用该混合控制方程进行灵敏度分析不仅能够同时得到响应结果和灵敏度系数,而且还考虑了层合板的层间弱粘接问题.     

基于B-样条小波的复合材料层合板灵敏度分析

基于BSWI样条小波有限元方法,将响应和响应的灵敏度系数同时看作状态变量,在Hamilton体系下推导了复合材料层合板响应和响应灵敏度系数的混合控制方程。基于该混合控制方程研究了对称铺层四边固支复合材料层合板的位移响应灵敏度系数在z方向上的分布情况,并将计算结果与有限差分法进行比较。结果表明:材料参数E₁,E₂和G₁₂对位移响应影响明显,其中以E₁对位移响应的影响最大,E₂次之。与经验法相比,半解析法计算结果相对误差小于10^-4,这说明本文的计算方法是正确的,且降低了计算成本和程序实现难度,提高了计算精度。     

Sensitivity analysis of composite laminated plates with bonding imperfection in Hamilton system

Sensitivity analysis of composite laminated plates with bonding imperfection is carried out based on the radial point interpolation method （RPIM） in a Hamilton system. A set of hybrid governing equations of response and sensitivity quantities is reduced using the spring-layer model and the modified Hellinger-Reissner （H-R） variational principle. The analytical method （AM）, the semi-analytical method （SAM）, and the finite difference method （FDM） are used for sensitivity analysis based on the reduced set of hybrid governing equations. A major advantage of the hybrid governing equations is that the convolution algorithm is avoided in sensitivity analysis. In addition, sensitivity analysis using this set of hybrid governing equations can obtain response values and sensitivity coefficients simultaneously, and accounts for bonding imperfection of composite laminated plates.