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In the present work, the effect of Ni doping on the microstructures and properties of Zn-20 Sn high temperature lead-free solder has been investigated. Interestingly,Ni was present as the form of Ni-Zn compounds in the microstructure of Zn-20 Sn-xNi alloy.When the Ni-doping amount was 0.2~0.4 wt.%, the presence of δ phase was found, and when the doping amoun was 0.8 wt.%, the presence of γ phase was observed. With the increase of Ni content, the liquidus temperature increased but the solidus temperature did not change obviously. In addition, the microhardness and electrical resistivities of Zn-20 Sn-xNi solder increased gradually. And the spreading area and shear strength increased firstly but decreased afterwards. When the content of Ni was 0.4 wt.%, the spreading area and shear strength of solder reached to be maximum. After the addition of 0.4 wt.% Ni, the microstructure of the interfacial intermetallic compound(IMC) layer of the interface didn't change, but the total thickness of the IMC layer reduced. The δ-phase was embedded in the grain boundary of ε-Cu Zn5, which hindered the diffusion of atoms. The thickness of IMC layer at the interface reduced, which led to the improvement of the shear strength of the interface.  相似文献   
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用脉冲电沉积方法制备了纳米晶N i-Co-Fe-P合金镀层.采用X射线衍射(XRD),透射电镜(TEM),扫描电镜(SEM),能谱分析(EDS)等方法研究了合金镀层的微观组织结构和成份.采用显微硬度计和摩擦磨损试验机测试合金镀层的显微硬度和摩擦磨损性能.结果表明:纳米晶N i-40.41%Co-6.16%Fe-1.63%P合金镀层的晶粒尺寸为8.3 nm,显微硬度和耐磨性明显高于不含P的N i-Co-Fe镀层;适当温度退火可以提高镀层的硬度及耐磨性;镀层的耐磨性与其硬度成正相关,且随着硬度的提高,镀层的磨损机理由磨粒磨损和黏着磨损共同作用转变为磨粒磨损主导.  相似文献   
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