Wirkungsquerschnitte für die Anregung von Molekülschwingungen durch schnelle Elektronen

The differential cross section for the excitation of infra-red inactive and — in dipole approximation — infra-red active fundamental vibrations by fast electrons is calculated. The energy loss spectra of CO₂, N₂O, C₂H₄ are measured with 33 keV electrons in the small energy loss range up to 0.5 eV. The experimentally determined “particular” cross sections

$$\sigma = \int\limits_{\vartheta = 0}^{1.1 \cdot 10^{ - 4} } {d\sigma }$$     

Non-Gaussian range profiles in amorphous solids

Range profiles of boron in amorphous silicon exhibit pronounced deviations from Gaussian at energies above about 40 keV due to increasing electronic stopping. A detailed comparison with computed profiles allows a semiempirical determination of the electronic stopping cross section (S_e ≈ E^0.4).     

Implications in the use of sputtering for layer removal: the system Au on Si

Au films deposited on Si substrates have been sputtered by 20 and 100 keV Ar bombardment, respectively. Bombardment-induced intermixing of Au and Si was observed at film thicknesses considerably larger than the projectile range. Due to radiation-enhanced diffusion, the partial sputtering yield of Au from Si-Au alloys decreases with increasing fluence. Complete removal of Au from Si is impossible if Ar ions are used for sputtering.     

Depth profiling by means of sims: Recent progress and current problems

The present state of the art of secondary ion mass spectrometry (SIMS), applied to the in-depth analysis of impurity concentration profiles, is reviewed critically. It is shown that SIMS has reached a level of perfection which is unparalleled by other analytical techniques. There are, however, several effects which may cause deviations of the measured profile from the original dopant distribution. These detrimental effects are due to interaction of primary ions with the residual gas, adsorption and incorporation of residual gases, sputtering yield variations due to the accumulation of probe atoms in the sample, mass interference between molecular ions and the atomic species under study and, last but not least, beam-induced relocation of dopant atoms (“atomic mixing”). Methods for minimizing the respective disturbing effect are discussed.     

The influence of implanted xenon on the sputtering yield of silicon

Following implantation labeling with either 200 or 270 keV Xe⁺ the sputtering yield of silicon bombarded with 20 keV Xe⁺ has been determined in situ by means of the backscattering technique (Y = 3.0 ± 0.3 (atoms/ion)). Yield enhancement by up to 60% was observed in cases where the implantation-induced xenon concentrations exceeded the saturation concentration during sputtering. The effect is attributed to (i) an increase in energy deposition at the surface introduced by pronounced xenon loading of the target and (ii) lowering of the surface binding energy. As a consequence the energy dependence of the xenon sputtering yield of silicon is expected to be strongly affected by the energy dependence of the xenon saturation concentration in silicon. Available experimental data support this idea.     

Experimental and theoretical investigations into the origin of cross-contamination effects observed in a quadrupole-based SIMS instrument

The minimum-detection limits achievable in SIMS analyses are often determined by transport of material from surrounding surfaces to the bombarded sample. This cross-contamination (or memory) effect was studied in great detail, both experimentally and theoretically. The measurements were performed using a quadrupole-based ion microprobe operated at a secondary-ion extraction voltage of less than 200 V (primary ions mostly 8keV O ₂ ⁺ ). It was found that the flux of particles liberated from surrounding surfaces consists of neutrals as well as positive and negative ions. Contaminant species condensing on the bombarded sample could be discriminated from other backsputtered species through differences in their apparent energy spectra and by other means. The apparent concentration due to material deposited on the sample surface was directly proportional to the bombarded area. For an area of 1 mm² the maximum apparent concentration of Si in GaAs amounted to 5 × 10¹⁶atoms/cm³. The rate of contamination decreased strongly with increasing spacing between the bombarded sample and the collector. The intensities of backsputtered ions and neutrals increased strongly with increasing mass of the target atoms (factor of 10 to 50 due to a change from carbon to gold). The effect of the primary ion mass (O ₂ ⁺ , Ne⁺, and Xe⁺) and energy (5–10keV) was comparatively small. During prolonged bombardment of one particular target material, the rate of contamination due to species not contained in the sample decreased exponentially with increasing fluence. In order to explain the experimental results a model is presented in which the backsputtering effect is attributed to bombardment of surrounding walls by high-energy particles reflected or sputtered from the analysed sample. The level of sample contamination is described by a formula which contains only measurable quantities. Cross-contamination efficiencies are worked out in detail using calculated energy spectra of sputtered and reflected particles in combination with the energy dependence of the sputtering yield of the assumed wall material. The experimental findings are shown to be good agreement with the essential predictions of the model.     

Energy dependence of the secondary ion yield of metals and semiconductors

Relative secondary ion yields of 12 metals and 2 semiconductors have been determined under ultrahigh vacuum conditions as a function of the primary argon ion energy between 2 and 15 keV. The ion yields were found to exhibit a strong energy dependence which cannot be accounted for by the energy dependence of the sputtering yield. Very pronounced effects are found with elements for which kinetic ionization is important. The relative secondary ion yields vary by less than two orders of magnitude, aluminium showing the largest and gold the smallest yield. Above about 10 keV the results can be described to within a factor of two by a recently developed ionization model if reasonable assumptions are made with respect to the physical parameters of the bombarded surface.     

On the mechanism of cluster emission in sputtering

The intensity and the energy distribution of Si⁺_n cluster ions emitted from clean silicon have been measured for different target orientations as a function of the primary ion energy (3–30 keV) and the projectile mass (noble gas ion bombardment). The results favour the idea that clusters are emitted as such rather than being produced by vacuum recombination of individually emitted atoms and ions.     

Mechanism of MCs+ formation in Cs based secondary ion mass spectrometry

Quantitative analysis using MCs⁺ secondary ions has long been impossible because sample loading with Cs could not be controlled adequately. Using recently developed, advanced instrumentation, it can be shown that, at low levels of Cs loading, ionization and formation probabilities of MCs⁺ ions arrive at a constant, maximum level. On the basis of results obtained in three independent studies, involving three vastly different methods of controlling the sample loading with Cs, evidence is provided that MCs⁺ ions are emitted as such, independent of the number of atoms sputtered in the same impact event. Taken together, these findings finally pave the way for quantification of secondary ion signals without matrix effects.     

Secondary ion emission from silicon and silicon oxide

The emission of Si⁺, Si²⁺, Si³⁺, Si₂⁺, SiO⁺ and B⁺ from boron doped silicon has been studied at oxygen partial pressures between 2 × 10^?10 and 2 × 10^?5 Torr. Sputtering was done with 2 to 15 keV argon ions at current densities between 3 and $\text{40}\text{μ}\text{A}\text{cm}{}^2$. The relative importance of the different ionization processes could be deduced from a detailed study of the yield variation at varying bombardment conditions. Comparison with secondary ion emission from silicon dioxide allows a rough determination of the composition of oxygen saturated silicon surfaces.