水热法制备Nd3+-介孔TiO2/GO复合材料及光催化性能研究

采用水热法首先制备稀土Nd3+掺杂介孔TiO2,进而复合氧化石墨烯(GO)合成了系列Nd3+-介孔TiO2/GO复合材料.通过X射线衍射(XRD)、透射电镜(TEM)、孔结构分析(BJH与BET)、X射线光电子能谱(XPS)和紫外-可见漫反射(UV-vis)等测试手段对样品的微观结构、形貌、样品表面各元素价态及谱学性质进行表征,并以甲基橙模拟污染物测试其光催化性能.结果表明,所制样品均为锐钛矿结构TiO2,晶粒尺寸在3~4 nm之间;从UV-vis测试结果分析可知,与Nd3+-介孔TiO2和TiO2/GO相比,稀土Nd3+和GO的协同效应更能有效减小TiO2半导体禁带宽度,从而增加其对可见光的吸收.此外,不同光照射下光催化降解甲基橙的实验表明,所制备样品均有较强的紫外及可见光光催化性能,其中系列Nd3+-介孔TiO2/GO复合体系可见光光催化性能更为显著.     

Formation of 10-30 nm SiO2/Si structure with a uniform thickness at ∼120 °C by nitric acid oxidation method

Silicon dioxide (SiO₂) layers with a thickness more than 10 nm can be formed at ∼120 °C by direct Si oxidation with nitric acid (HNO₃). Si is initially immersed in 40 wt.% HNO₃ at the boiling temperature of 108 °C, which forms a ∼1 nm SiO₂ layer, and the immersion is continued after reaching the azeotropic point (i.e., 68 wt.% HNO₃ at 121 °C), resulting in an increase in the SiO₂ thickness. The nitric acid oxidation rates are the same for (1 1 1) and (1 0 0) orientations, and n-type and p-type Si wafers. The oxidation rate is constant at least up to 15 nm SiO₂ thickness (i.e., 1.5 nm/h for single crystalline Si and 3.4 nm/h for polycrystalline Si (poly-Si)), indicating that the interfacial reaction is the rate-determining step. SiO₂ layers with a uniform thickness are formed even on a rough surface of poly-Si thin film.     

Nitric acid oxidation of Si (NAOS) method for low temperature fabrication of SiO2/Si and SiO2/SiC structures

We have developed low temperature formation methods of SiO₂/Si and SiO₂/SiC structures by use of nitric acid, i.e., nitric acid oxidation of Si (or SiC) (NAOS) methods. By use of the azeotropic NAOS method (i.e., immersion in 68 wt% HNO₃ aqueous solutions at 120 °C), an ultrathin (i.e., 1.3-1.4 nm) SiO₂ layer with a low leakage current density can be formed on Si. The leakage current density can be further decreased by post-metallization anneal (PMA) at 200 °C in hydrogen atmosphere, and consequently the leakage current density at the gate bias voltage of 1 V becomes 1/4-1/20 of that of an ultrathin (i.e., 1.5 nm) thermal oxide layer usually formed at temperatures between 800 and 900 °C. The low leakage current density is attributable to (i) low interface state density, (ii) low SiO₂ gap-state density, and (iii) high band discontinuity energy at the SiO₂/Si interface arising from the high atomic density of the NAOS SiO₂ layer.For the formation of a relatively thick (i.e., ≥10 nm) SiO₂ layer, we have developed the two-step NAOS method in which the initial and subsequent oxidation is performed by immersion in ∼40 wt% HNO₃ and azeotropic HNO₃ aqueous solutions, respectively. In this case, the SiO₂ formation rate does not depend on the Si surface orientation. Using the two-step NAOS method, a uniform thickness SiO₂ layer can be formed even on the rough surface of poly-crystalline Si thin films. The atomic density of the two-step NAOS SiO₂ layer is slightly higher than that for thermal oxide. When PMA at 250 °C in hydrogen is performed on the two-step NAOS SiO₂ layer, the current-voltage and capacitance-voltage characteristics become as good as those for thermal oxide formed at 900 °C.A relatively thick (i.e., ≥10 nm) SiO₂ layer can also be formed on SiC at 120 °C by use of the two-step NAOS method. With no treatment before the NAOS method, the leakage current density is very high, but by heat treatment at 400 °C in pure hydrogen, the leakage current density is decreased by approximately seven orders of magnitude. The hydrogen treatment greatly smoothens the SiC surface, and the subsequent NAOS method results in the formation of an atomically smooth SiO₂/SiC interface and a uniform thickness SiO₂.     

棒状PANI/TiO2纳米复合材料的制备及光催化性能研究

通过共混法和原位氧化聚合法成功制备了棒状聚苯胺/TiO2纳米复合材料,通过SEM、XRD、FT-IR、TGA、TEM、紫外-可见漫反射光谱等测试对其进行表征.并以罗丹明B溶液为模拟污染物,在可见光条件下,棒状PANI/TiO2纳米复合材料的催化降解效率与纯PANI和TiO2相比明显提高.另外,对两种不同方法合成的PANI/TiO2纳米复合材料的光催化性能进行对比,结果表明原位氧化聚合法制得的复合材料,由于TiO2在复合材料中的均匀分布及其与PANI的协同效应,光催化降解率可达91.11;.     

Synthesis and thermal decomposition of Cr–urea complex

In this work, Cr–urea complex ([Cr(NH₂CONH₂)₆](NO₃)₃) was synthesized by direct solid-state reaction of chromium nitrate and urea, and its thermal decomposition reaction was studied for the first time to explore the possibilities of using the complex as precursor to nanosized chromium oxide. The formation of [Cr(NH₂CONH₂)₆](NO₃)₃ is confirmed from infrared spectroscopy and elemental analysis. Thermogravimetric and differential thermal analysis of the compound show a three-stage thermal decomposition in the temperature range from 190 to 430 °C. The result of X-ray diffraction (XRD) shows that the [Cr(NH₂CONH₂)₆](NO₃)₃ decompose at ~300 °C into α-Cr₂O₃ nanopowder with an average crystallite size of 33 nm.     

Nitric acid method for fabrication of gate oxides in TFT

We have developed low temperature formation methods of SiO₂ layers which are applicable to gate oxide layers in thin film transistors (TFT) by use of nitric acid (HNO₃). Thick (>10 nm) SiO₂ layers with good thickness uniformity (i.e., ±4%) can be formed on 32 cm × 40 cm substrates by the two-step nitric acid oxidation method in which initial and subsequent oxidation is performed using 40 and 68 wt% (azeotropic mixture) HNO₃ aqueous solutions, respectively. The nitric acid oxidation of polycrystalline Si (poly-Si) thin films greatly decreases the height of ridge structure present on the poly-Si surfaces. When poly-Si thin films on 32 cm × 40 cm glass substrates are oxidized at azeotropic point (i.e., 68 wt% HNO₃ aqueous solutions at 121 °C), ultrathin (i.e., 1.1 nm) SiO₂ layers with a good thickness uniformity (±0.05 nm) are formed on the poly-Si surfaces. When SiO₂/Si structure fabricated using plasma-enhanced chemical vapor deposition is immersed in 68 wt% HNO₃, oxide fixed charge density is greatly decreased, and interface states are eliminated. The fixed charge density is further decreased by heat treatments at 200 °C, and consequently, capacitance-voltage characteristics which are as good as those of thermal SiO₂/Si structure are achieved.     

Properties of thick SiO2/Si structure formed at 120 °C by use of two-step nitric acid oxidation method

Thick (i.e., ∼10 nm) SiO₂/Si structure has been formed at 121 °C by immersion of Si in relatively low concentration HNO₃ followed by that in 68 wt.% HNO₃ (i.e., two-step nitric acid (HNO₃) oxidation method of Si, NAOS) and spectroscopic properties and electrical characteristics of the NAOS SiO₂ layers are investigated. The SiO₂ thickness strongly depends on the concentration of HNO₃ aqueous solutions employed in the initial oxidation, and it becomes the largest at the HNO₃ concentration of 40 wt.%. The MOS diodes with the ∼9 nm SiO₂ layer formed by the NAOS method possess a relatively low leakage current density (e.g., 10⁻⁸ A/cm² at the forward bias of 1 V) and it is further decreased by more than one order of magnitude by post-metallization annealing (PMA) in hydrogen at 250 °C. The good leakage characteristic is attributable to atomically flat SiO₂/Si interfaces and high atomic density of 2.30-2.32 × 10²² atoms/cm³ of the NAOS SiO₂ layers. High-density interface states are present in as-prepared SiO₂ layers and they are eliminated by PMA in hydrogen.     

Nickel(II) Complexes Bearing 4-Arylimino-1,2,3-trihydroacridines: Synthesis,Characterization, and Ethylene Oligomerization

Nickel(II) complexes have attracted much attention as a new generation of olefin catalysts since the α-diiminonickel complex was discovered as a highly efficient procatalyst for ethylene polymerization. A series of novel 4-arylimino-1,2,3-trihydroacridylnickel(II) dihalide complexes was synthesized in a one-pot reaction of 2,3-dihydroacridine-4-one and different anilines with nickel(II) chloride or nickel(II) bromide 1,2-dimethoxyethane complex. The complexes were characterized by infrared spectroscopy and elemental analysis. The molecular structures of the representative complexes 4-(2,6-diisopropylphenylimino)-1,2,3-trihydroacridylnickel(II) dichloride (C3), 4-(2,4,6-trimethylphenylimino)-1,2,3-trihydroacridylnickel dichloride(II) (C4), and 4-(2,4,6-trimethylphenylimino)-1,2,3-trihydroacridylnickel(II) dibromide (C9) were confirmed by single-crystal X-ray crystallography, revealing a distorted tetrahedral geometry around the nickel(II) of C3 and distorted trigonal bipyramidal geometry for C4 and C9. With the activation of trimethylaluminium (TMA), all nickel(II) complexes exhibited good activity for ethylene oligomerization, and oligomer products ranged from butene (C₄) to hexadecene (C₁₆).     

Formation of atomically smooth SiO2/SiC interfaces at ∼120 °C by use of nitric acid oxidation method

Conventional thermal oxidation of SiC requires heating at ∼1100 °C. In the present study, we have developed a method of oxidizing SiC at low temperatures (i.e., ∼120 °C) to form relatively thick silicon dioxide (SiO₂) layers by use of nitric acid. When 4H-SiC(0 0 0 1) wafers are immersed in 40 wt% HNO₃ at the boiling temperature of 108 °C and the boiling is kept for 5 h after reaching the azeotropic point (i.e., 68 wt% HNO₃ at 121 °C), 8.1 nm thick SiO₂ layers are formed on the SiC substrates. High resolution transmission electron microscopy measurements show that the SiO₂/SiC interface is atomically flat and the SiO₂ layer is uniform without bunching. When SiC is immersed in an azeotropic mixture of HNO₃ with water from the first, the SiO₂ thickness is less than 0.3 nm. The metal-oxide-semiconductor (MOS) diodes with the SiO₂ layer formed by the nitric acid oxidation method possess a considerably low leakage current density.     

Thermal transformation of water-dispersible magnetite nanoparticles

This paper presents a study on rapid hardening behaviors of β-C₂S by accelerated carbonation curing. β-C₂S cubes compacted at various molding pressures were subjected to different CO₂ concentration for accelerated carbonation curing. The CO₂ uptake and microstructure changes were analyzed by thermogravimetric analysis (TG), QXRD, FT-IR and MAS-NMR. The results indicated that CO₂ uptake was affected by molding pressure and CO₂ concentration seriously. TG analysis indicated that the carbonation reaction was rapid in the first hour. The carbonation degree reached 21.6% and giving a compressive strength of 85.7 MPa after 6 h carbonation in 99.9% CO₂ concentration. And it showed a much less carbonation degree in 20.0% CO₂. Calcite, vaterite and amorphous silica-rich phase formed in the carbonation progress. The FT-IR and NMR analysis indicated β-C₂S was decalcified to C–S–H gel and further decalcified to formation of an amorphous silica gel composed of Q ³ and Q ⁴ silicate tetrahedral. The chain length of C–S–H gel increased from to 2.67 to 6.36 with prolonged carbonation time, showing a lower C/S ratio and higher polymerization and also resulting in a lower C–S–H content.