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The Ni/4H-SiC Schottky barrier diodes (SBDs) and transfer length
method (TLM) test patterns of Ni/4H-SiC Ohmic contacts were
fabricated, and irradiated with 1~MeV electrons up to a dose of
3.43× 1014~e/cm-2. After radiation, the forward
currents of the SBDs at 2~V decreased by about 50%, and the
reverse currents at -200~V increased by less than 30%. Schottky
barrier height (φ B ) of the Ni/4H-SiC SBD increased
from 1.20~eV to 1.21~eV under 0~V irradiation bias, and decreased
from 1.25~eV to 1.19~eV under -30~V irradiation bias. The
degradation of φ B could be explained by the variation
of interface states of Schottky contacts. The on-state resistance
(Rs) and the reverse current increased with the dose, which
can be ascribed to the radiation defects in bulk material. The
specific contact resistance (\rhoc) of the Ni/SiC Ohmic
contact increased from 5.11× 105~Ωega.cm2 to 2.97× 10-4~Ωega.cm2. 相似文献
2.
对制备的Ni/4H-SiC肖特基势垒二极管(SBD)进行了γ射线辐照试验,并在辐照过程中对器件分别加0和-30?V偏压.经过1?Mrad(Si)总剂量的γ射线辐照后,不同辐照偏压下的Ni/4H-SiC肖特基接触的势垒高度和理想因子没有退化,SiC外延层中的少子寿命也没有退化.辐照后器件的反向电流下降,这是由于器件表面的负界面电荷增加引起的.研究表明,辐照偏压对Ni/4H-SiC SBD的辐照退化效应没有明显的影响.
关键词:
碳化硅
肖特基
辐照效应
偏压 相似文献
3.
High energy electron radiation effect on Ni and Ti/4H-SiCSchottky barrier diode at room temperature 下载免费PDF全文
This paper reports that Ni and Ti/4H-SiC Schottky barrier diodes
(SBDs) were fabricated and irradiated with 1~MeV electrons up to a
dose of 3.43×1014~e/cm2. After radiation, the Schottky
barrier height φ B of the Ni/4H-SiC SBD increased from
1.20~eV to 1.21~eV, but decreased from 0.95~eV to 0.94~eV for the
Ti/4H-SiC SBD. The degradation of φ B could be
explained by interface states of changed Schottky contacts. The
on-state resistance RS of both diodes increased with the
dose, which can be ascribed to the radiation defects. The reverse
current of the Ni/4H-SiC SBD slightly increased, but for the Ti/4H-SiC
SBD it basically remained the same. At room temperature,
φ B of the diodes recovered completely after one week,
and the RS partly recovered. 相似文献
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