工作气压对磁控溅射ITO薄膜性能的影响

工作气压在ITO薄膜的制备过程中是一个重要的工艺参数,直接决定着薄膜的性能.本文利用射频磁控溅射方法,采用氧化铟锡陶瓷靶材,在衬底温度为175℃,工作气压范围为0.45～1.0 Pa条件下,制备了氧化铟锡透明导电薄膜.研究了工作气压对其微观结构、表面形貌和光电特性的影响.在衬底温度为175℃、纯氩气中制备的氧化铟锡薄膜电阻率为3.04 ×10-4 Ω·cm、可见光波段(400～800 nm)透过率为91.9;,适合用作异质结太阳电池的前电极和减反射膜.     

Direct growth of graphene on gallium nitride by using chemical vapor deposition without extra catalyst

Graphene on gallium nitride(GaN) will be quite useful when the graphene is used as transparent electrodes to improve the performance of gallium nitride devices. In this work, we report the direct synthesis of graphene on GaN without an extra catalyst by chemical vapor deposition. Raman spectra indicate that the graphene films are uniform and about 5–6 layers in thickness. Meanwhile, the effects of growth temperatures on the growth of graphene films are systematically studied, of which 950℃ is found to be the optimum growth temperature. The sheet resistance of the grown graphene is 41.1Ω/square,which is close to the lowest sheet resistance of transferred graphene reported. The mechanism of graphene growth on GaN is proposed and discussed in detail. XRD spectra and photoluminescence spectra indicate that the quality of GaN epi-layers will not be affected after the growth of graphene.     

量子垒高度对深紫外LED调制带宽的影响

AlGaN基深紫外LED由于具有高调制带宽和小芯片尺寸,在紫外光通信领域受到越来越多的关注.本研究通过改变生长AlGaN量子垒层的Al源流量,生长了三种具有不同量子垒高度的深紫外LED,研究了量子垒高度对深紫外LED光电特性和调制特性的影响.研究发现,随着量子垒高度的增加,深紫外LED的光功率出现先增加后减小的趋势,量...     

Characterization of Thick GaN Films Directly Grown on Wet-Etching Patterned Sapphire by HVPE

Thick GaN films of high quality are directly grown on wet-etching patterned sapphire in a vertical hydride vapour phase epitaxy reactor. The optical and structural properties of GaN films are studied using scanning electronic microscopy and cathodoluminescence. Test results show that initial growth of hydride vapour phase epitaxy GaN occurs not only on the mesas but also on the two asymmetric sidewalls of the V-shaped grooves without selectivity. After the two-step coalescence near the interface, the GaN films near the surface keep on growing along the direction perpendicular to the long sidewall. Based on Raman results, GaN of the coalescence region in the grooves has the maximum residual stress and poor crystalline quality over the whole GaN film, and the coalescence process can release the stress. Therefore, stress-free thick GaN films are prepared with smooth and crack-free surfaces by this particular growth mode on wet-etching patterned sapphire substrates.