CuO掺杂对KNN-BNZ无铅压电陶瓷性能的影响

采用传统固相反应法制备了0.97K05Na0.5NbO3-0.03Bi0.5Na0.5ZrO3+xmo1; CuO (0.97KNN-0.03BNZ+xCu)无铅压电陶瓷.研究不同CuO掺量(x=0、0.5、1、2、3和4)对0.97KNN-0.03BNZ陶瓷的显微结构和电学性能的影响.结果表明:CuO的掺入使材料出现“硬化”现象,机械品质因数Qm有明显提高,矫顽场显著增大.CuO的掺入量在3;时,样品的综合性能最佳:压电常数(d33)为137 pC/N,机电耦合系数(kp)为0.30,机械品质因数(Qm)为238,介电损耗(tanδ)为1.5;.另外,从SEM图片中可以看出:0.97KNN-0.03BNZ压电陶瓷材料的平均晶粒尺寸随着CuO掺入量的增加明显增大,这表明CuO有烧结助熔作用,能降低烧成温度.     

Size effect in the melting and freezing behaviors of Al/Ti core-shell nanoparticles using molecular dynamics simulations

The thermal stability of Ti@Al core/shell nanoparticles with different sizes and components during continuous heating and cooling processes is examined by a molecular dynamics simulation with embedded atom method. The thermodynamic properties and structure evolution during continuous heating and cooling processes are investigated through the characterization of the potential energy, specific heat distribution, and radial distribution function(RDF). Our study shows that, for fixed Ti core size, the melting temperature decreases with Al shell thickness, while the crystallizing temperature and glass formation temperature increase with Al shell thickness. Diverse melting mechanisms have been discovered for different Ti core sized with fixed Al shell thickness nanoparticles. The melting temperature increases with the Ti core radius. The trend agrees well with the theoretical phase diagram of bimetallic nanoparticles. In addition, the glass phase formation of Al–Ti nanoparticles for the fast cooling rate of 12 K/ps, and the crystal phase formation for the low cooling rate of 0.15 K/ps. The icosahedron structure is formed in the frozen 4366 Al–Ti atoms for the low cooling rate.