Fabrication of Ti ohmic contact to n-type 6H-SiC without high-temperature annealing

The effect of surface morphology of 6H-SiC substrate on the ohmic contact properties of Ti/6H-SiC structure is studied. The H-terminated surface on Si-face 6H-SiC is obtained by both dipping SiC into HF acid solution for 15 s and thermal heating SiC in hydrogen atmosphere at 1100 C for 10 min, while the H-terminated surface on C-face 6H-SiC could be obtained only by the latter method. Ti is deposited on Si-face and C-face SiC substrates with H-terminated surfaces and ohmic contact is obtained without high-temperature annealing.     

Band alignment of Ga2O3/6H-SiC heterojunction

A high-quality Ga₂O₃ thin film is deposited on an SiC substrate to form a heterojunction structure. The band alignment of the Ga₂O₃/6H-SiC heterojunction is studied by using synchrotron radiation photoelectron spectroscopy. The energy band diagram of the Ga₂O₃/6H-SiC heterojunction is obtained by analysing the binding energies of Ga 3d and Si 2p at the surface and the interface of the heterojunction. The valence band offset is experimentally determined to be 2.8 eV and the conduction band offset is calculated to be 0.89 eV, which indicate a type-II band alignment. This provides useful guidance for the application of Ga₂O₃/6H-SiC electronic devices.     

11kV大功率SiC光电导开关导通特性

采用高质量半绝缘碳化硅(SiC)单晶材料制作了超快高耐压大功率SiC光电导开关。应用氟化氪准分子脉冲激光器作为激发光源,得到了脉宽为40 ns,上升沿为9.6 ns的超快响应的电脉冲,开关的上升沿存在两个不同阶段。测试开关两端电压从1 kV到10 kV时开关导通的电压波形表明,开关的导通电阻随电压的增加不发生明显变化,开关在导通态时导通电阻在12Ω左右。采用92Ω精密电阻作为负载,计算得到开关两端外加11 kV电压时通过其电流峰值高达159 A,此时峰值功率达到1.4 MW,在此范围内未出现载流子饱和现象。