退火温度对Li:ZnO薄膜紫外发射性能影响

利用溶胶-凝胶法在Si衬底上制备不同退火温度的Li∶ZnO薄膜。借助X射线衍射(XRD)、X射线光电子谱(XPS)、扫描电镜(SEM)和光致发光(PL)谱研究样品结晶质量、成分、表面形貌和发光特性。结果表明:所有样品均高度c轴择优取向生长;随退火温度升高,样品结晶性变好,紫外发射增强。LiOH在退火温度超过700℃分解,使Li、H进入到ZnO晶格,在ZnO薄膜中形成LiZn-H复合缺陷,这种复合缺陷使H被困在ZnO薄膜中,形成H施主,显著提高ZnO薄膜紫外发光强度,抑制ZnO薄膜绿光发射。     

退火温度对Cu:ZnO薄膜绿光发射的影响

利用溶胶-凝胶法在Si衬底上制备了不同退火温度的Cu:ZnO薄膜.利用X射线衍射(XRD)、X射线光电子能谱(XPS)、扫描电子显微镜和光致发光谱研究了样品的晶格结构、表面形貌、成分及其发光特性.结果表明:所有样品均具有高度的c轴择优取向,随着退火温度的升高,样品的结晶质量变好,样品的表面都被晶粒覆盖,强而稳定的绿光发射被观察到.绿光强度随退火温度的升高先增加后减小,发光中心位置不随退火温度的变化而改变,这样的绿光发射强而稳定.XRD和XPS结果表明,随退火温度的升高Cu2+还原为Cu+,导致Cu:ZnO薄膜形成的缺陷是VZn,所以绿光发射是由VZn引起的.Cu2+还原为Cu+时,Cu:ZnO薄膜中VZn浓度增加,使绿光发射强度增大.当退火温度超过800?C时,Cu2+的还原能力变差,绿光发射强度减弱.     

Effect of Silane Flow Rate on Structure and Corrosion Resistance of Ti-Si-N Thin Films Deposited by a Hybrid Cathodic Arc and Chemical Vapour Process

Ti-Si-N thin flms with different silicon contents are deposited by a cathodic arc technique in an Ar＋N2＋SiH4 mixture atmosphere. With the increase of silane flow rate, the content of silicon in the Ti-Si-N films varies from 2.0 at. % to 12.2 at. %. Meanwhile, the cross-sectional morphology of these films changes from an apparent columnar microstructure to a dense fine-grained structure. The x-ray diffractometer （XRD） and x-ray photoelectron spectroscopy （XPS） results show that the Ti-Si-N film consists of TiN crystallites and SiNx amorphous phase. The corrosion resistance is improved with the increase of silane flow rate. Growth defects in the films produced play a key role in the corrosion process, especially for the local corrosion. The porosity of the films decreases from 0.13%to 0.00032% by introducing silane at the flow rate of 14sccm.