THE CURING BEHAVIOR OF DIGLYCIDYL-4, 5-EPOXYCYCLOHEXANE-1,2-DICARBOXYLATE

The curing behavior of diglycidyl-4, 5-epoxycyclohexane-1, 2-dicarboxylate with m-phenylenediamine has been studied by using torsional braid analysis. It is shown that the whole curing processproceeds in two stages, that is, curing reaction at temperatures below 100℃mainly occurs at the ali-phatic epoxy rings, whereas a rapid increase in reaction rate of the remaining cycloaliphatic epoxy ringoccurs only at temperatures above 130℃. Between the temperature range from 100℃to 130℃, the"full reaction" of the aliphatic epoxy rings is approximated, while the reaction rate of the cycloaliphaticepoxy ring begins to increase gradually. The maximum glass transition temperature (T_(g∞)) of the systemdoes not emerge before 220℃. The apparent activation energy is 13 .2 kcal/mole.     

4,5-环氧环己烷1,2-二甲酸二缩水甘油酯的固化行为

本文用动态力学扭辨分析法,研究4,5-环氧环己烷1,2-二甲酸二缩水甘油酯与间苯二胺的热固化动态力学行为。结果表明:固化过程分两个阶段进行,低于100℃时,交联反应主要在缩水甘油酯链的环氧基上进行;100—130℃时为酯链环氧基反应趋近完全和酯环环氧基反应速率逐步增大的过渡区;130℃以上固化时,酯环环氧基才明显地参与固化交联反应。从Arrhenius关系曲线求得本固化体系凝胶点前表现反应活化能为13.2kcal/mol。