首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   2篇
  完全免费   1篇
  物理学   3篇
  2010年   2篇
  2008年   1篇
排序方式: 共有3条查询结果,搜索用时 62 毫秒
1
1.
The sapphire substrates are polished by traditional chemical mechanical polishing (CMP) and ultrasonic flexural vibration (UFV) assisted CMP (UFV-CMP) respectively with different pressures. UFV-CMP combines the functions of traditional CMP and ultrasonic machining (USM) and has special characteristics, which is that ultrasonic vibrations of the rotating polishing head are in both horizontal and vertical directions. The material removal rates (MRRs) and the polished surface morphology of CMP and UFV-CMP are compared. The MRR of UFV-CMP is two times larger than that of traditional CMP. The surface roughness (root mean square, RMS) of the polished sapphire substrate of UFV-CMP is 0.83 Å measured by the atomic force microscopy (AFM), which is much better than 2.12 Å obtained using the traditional CMP. And the surface flatness of UFV-CMP is 0.12 μm, which is also better than 0.23 μm of the traditional CMP. The results show that UFV-CMP is able to improve the MRR and finished surface quality of the sapphire substrates greatly. The material removal and surface polishing mechanisms of sapphire in UFV-CMP are discussed too.  相似文献
2.
High roughness and a greater number of defects were created by lithium niobate (LN; LiNbO3) processes such as traditional grinding and mechanical polishing (MP), should be decreased for manufacturing LN device. Therefore, an alternative process for gaining defect-free and smooth surface is needed. Chemical mechanical planarization (CMP) is suitable method in the LN process because it uses a combination approach consisting of chemical and mechanical effects. First of all, we investigated the LN CMP process using commercial slurry by changing various process conditions such as down pressure and relative velocity. However, the LN CMP process time using commercial slurry was long to gain a smooth surface because of lower material removal rate (MRR). So, to improve the material removal rate (MRR), the effects of additives such as oxidizer (hydrogen peroxide; H2O2) and complexing agent (citric acid; C6H8O7) in a potassium hydroxide (KOH) based slurry, were investigated. The manufactured slurry consisting of H2O2-citric acid in the KOH based slurry shows that the MRR of the H2O2 at 2 wt% and the citric acid at 0.06 M was higher than the MRR for other conditions.  相似文献
3.
介绍了螺旋锥齿轮超声研磨加工的方法,利用声学和超声空化的相关理论分析了超声研齿的材料去除方式,在齿面接触区具有旋转超声加工的特点,在非接触区,超声空化对齿面产生空蚀或者直接激励磨粒撞击和滑擦齿面,引起材料的去除。进行了超声研齿和普通研齿的对比试验,结果表明超声研齿的材料去除率可达到普通研磨的3倍,齿面粗糙度低至Ra0.2μm,水平截距c1.2μm。齿面研磨后的SEM照片证实,齿面质量明显提高。  相似文献
1
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号