首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  免费   4篇
物理学   4篇
  2022年   1篇
  2019年   1篇
  2014年   1篇
  2007年   1篇
排序方式: 共有4条查询结果,搜索用时 15 毫秒
1
1.
Co-doped TiO2 thin films are grown on TiN buffered silicon substrates by the pulsed laser deposition method and then hydrogenated. Transmission electron microscopy and high-angle annular dark-field scanning transmission electron microscopy measurements have shown that the TiN buffer layer can suffer a 400℃ deposition temperature and prevent the growth of silicon dioxide on silicon. After that, the room temperature ferromagnetism behaviors are observed in the hydrogenated samples, which are measured by the alternating gradient magnetometer. X- ray photoelectron spectroscopy and x-ray absorption fine structure measurements have revealed the existence of cobalt clusters. According to the material analysis, the magnetic behavior after hydrogenation is suggested to be induced by the enhancement of cobalt dusters.  相似文献   
2.
马群刚  周刘飞  喻玥  马国永  张盛东 《物理学报》2019,68(10):108501-108501
本文通过解析阵列基板栅极驱动(gate driver on array, GOA)电路中发生静电释放(electro-static discharge,ESD)的InGaZnO薄膜晶体管(InGaZnO thin-film transistor, IGZO TFT)器件发现:栅极Cu金属扩散进入了SiN_x/SiO_2栅极绝缘层;源漏极金属层成膜前就发生了ESD破坏;距离ESD破坏区域越近的IGZO TFT,电流开关比越小,直到源漏极与栅极完全短路.本文综合IGZO TFT器件工艺、GOA区与显示区金属密度比、栅极金属层与绝缘层厚度非均匀性分布等因素,采用ESD器件级分析与系统级分析相结合的方法,提出栅极Cu:SiN_x/SiO_2界面缺陷以及这三层薄膜的厚度非均匀分布是导致GOA电路中沟道宽长比大的IGZO TFT发生ESD失效的关键因素,并针对性地提出了改善方案.  相似文献   
3.
In this paper, we propose a novel Schottky barrier MOSFET structure, in which the silicide source/drain is designed on the buried metal (SSDOM). The source/drain region consists of two layers of silicide materials. Two Schottky barriers are formed between the silicide layers and the silicon channel. In the device design, the top barrier is lower and the bottom is higher. The lower top contact barrier is to provide higher on-state current, and the higher bottom contact barrier to reduce the off-state current. To achieve this, ErSi is proposed for the top silicide and CoSi2 for the bottom in the n-channel ease. The 50 nm n-channel SSDOM is thus simulated to analyse the performance of the SSDOM device. In the simulations, the top contact barrier is 0.2e V (for ErSi) and the bottom barrier is 0.6 eV (for CoSi2). Compared with the corresponding conventional Schottky barrier MOSFET structures (CSB), the high on-state current of the SSDOM is maintained, and the off-state current is efficiently reduced. Thus, the high drive ability (1.2 mA/μm at Vds = 1 V, Vgs = 2 V) and the high Ion/Imin ratio (10^6) are both achieved by applying the SSDOM structure.  相似文献   
4.
电容式微机械超声换能器具有宽频带和易于制造二维阵列等优势,已经成为一种重要的新型超声换能器。该文针对图像声呐系统对新型超声换能器的迫切需求,提出了一种电容式微机械超声换能器结构和参数,并利用硅微加工技术制备出了该换能器,最后对其主要性能参数进行了测试和分析。测试结果表明该换能器具有发射和接收超声波的功能,中心工作频率为1.965 MHz,6 dB相对带宽达到109.4%,在1 MHz、2 MHz和3 MHz频率时的接收灵敏度分别为-218.29 d B、-219.39 dB和-218.11 dB。该文研制的电容式微机械超声换能器显示出了优秀的宽频带特性,且工作频率和接收灵敏度性能均基本满足了高频图像声呐系统的需求。  相似文献   
1
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号