In气氛下晶体生长对Mg掺杂p-Al_xGa_(1-x)N激活能的影响

Ⅲ-Ⅴ族氮化物宽禁带半导体材料体系中,普通方法生长的p型外延层电导率一般都很低,成为了制约器件性能提高的瓶颈。在p-AlxGa1-xN材料中,Mg受主的激活能较大,并且随Al组份增加而增大。通过在p-AlxGa1-xN材料生长过程中引入三甲基铟(TMIn),发现能有效地降低AlxGa1-xN材料中受主态的激活能。为研究不同In气氛下生长的p-AlxGa1-xN材料的性质,在使用相同二茂基镁(CP2Mg)的情况下,改变TMIn流量,生长了A,B,C和D四块样品。X射线衍射(XRD)组份分析表明:在1100℃下生长AlxGa1-xN外延层时,In的引入不会影响晶体组份。利用变温霍尔(Hall)测试研究了p-AlxGa1-xN材料中受主的激活能,结果表明:In气氛下生长的外延层相比无In气氛下生长的外延层,受主激活能明显降低,电导率显著提高。采用这种方法改进深紫外发光二极管(LED)的p-AlxGa1-xN层后,LED器件性能明显提高。     

Effect of Indium Ambient on Electrical Properties of Mg-Foped AlxGa1-xN

Mg-doped AlxGa1-xN epilayers were grown on AlN/sapphire templates by metal organic chemical vapor depo- sition （MOCVD） using an indium-assisted growth method. At room temperature, the resistivity of Mg-doped Alo.43Gao.57N epilayer grown under indium （In） ambient is of the order of 10^4Ω.cm, while the resistivity of Mg-doped Al0.43Ga0.57N grown without In assistance is of the order of 10^6Ω.cm. The ultraviolet light-emitting diodes （UV-LEDs） using the In-assisted Mg-doped Al0.43Ga0.57N as the p-type layers were fabricated to verify the function of indium ambient. It is found that there are a lower turn-on voltage and a lower diode series resistance in the UV-LEDs fabricated with p-type Al0.43Ga0.57 N layers grown under In-ambient.     

Epitaxial evolution on buried cracks in a strain-controlled AlN/GaN superlattice interlayer between AlGaN/GaN multiple quantum wells and a GaN template

Epitaxial evolution of buried cracks in a strain-controlled AlN/GaN superlattice interlayer(IL) grown on GaN template, resulting in crack-free AlGaN/GaN multiple quantum wells(MQW), was investigated. The processes of filling the buried cracks include crack formation in the IL, coalescence from both side walls of the crack, build-up of an MQW-layer hump above the cracks, lateral expansion and merging with the surrounding MQW, and two-dimensional step flow growth.It was confirmed that the filling content in the buried cracks is pure GaN, originating from the deposition of the GaN thin layer directly after the IL. Migration of Ga adatoms into the cracks plays a key role in the filling the buried cracks.     

Structural characterization of V/Al/V/Au Ohmic contacts to n-type Al0.4Ga0.6N

This paper investigates the temperature dependence of the specific resistance in annealed V/Al/V/Au (15 nm/85 nm/20 nm/95 nm) contacts on n-Al0.4Ga0.6 N. Contacts annealed at 700C and higher temperatures show Ohmic behaviour. Annealing at 800 C produces the lowest contact resistance. Samples annealed at 800C have been analysed by using cross-sectional transmission electron microscopy and an energy dispersive x-ray spectrum. Limited reaction depths are observed between V-based contacts and n-AlGaN. The VN grains are found to form in the contact layer of the annealed samples,which can be considered as the key to the successful formation of Ohmic contact. The contact layer adjacent to AlGaN material consists of V-Al-Au-N,AlN and AlAu alloys.     

AlGaN-Based Deep-Ultraviolet Light Emitting Diodes Fabricated on AlN/sapphire Template

We report on the growth and fabrication of deep ultraviolet （DUV） light emitting diodes （LEDs） on an AIN template which was grown on a pulsed atomic-layer epitaxial buffer layer. Threading dislocation densities in the AlN layer are greatly decreased with the introduction of this buffer layer. The crystalline quality of the AlGaN epilayer is further improved by using a low-temperature GaN interlayer between AlGaN and AlN. Electroluminescences of different DUV-LED devices at a wavelength of between 262 and 317nm are demonstrated. To improve the hole concentration of p-type AlGaN, Mg-doping with trimethylindium assistance approach is performed. It is found that the serial resistance of DUV-LED decreases and the performance of DUV-LED such as EL properties is improved.