Low-Temperature Growth of Polycrystalline silicon Films by SiCl4／H2 rf Plasma Enhanced Chemical Vapour Deposition

Polycrystalline silicon film was directly fabricated at 200℃ by the conventional plasma enhanced chemical vapour deposition method from SiCl4 with H2 dilution. The crystallization depends strongly on the deposition power.The maximum crystMlinity and the crystalline grain size are over 80% and 200—50Onm, respectively. The results of energy dispersive spectroscopy and infrared spectroscopy measurements demonstrate that the film is mostly composed of silicon, without impurities such as Cl, N, C and bonded H. It is suggested that the crystallization at such a low temperature originates from the effects of chlorine, i.e., in-situ chemical, etching, in-situ chemical cleaning, and the detachment of bonded H.     

用SiCl4-H2低温沉积多晶硅薄膜微结构的Raman分析

关键词：     

用SiCl4-H2低温沉积多晶硅薄膜微结构的Raman分析

用拉曼散射谱研究以SiCl4 H2 为气源 ,用射频辉光放电等离子体增强化学气相沉积技术 ,在 2 0 0℃低温下沉积多晶硅薄膜的微结构特征 .结果表明 ,薄膜表层包含有大量微晶相的纳米硅晶粒和非晶相的硅聚合物 ,随射频功率增加 ,晶相结构的成分增大 .另一方面 ,深度拉曼谱分布的研究也显示薄膜的晶化度和晶粒尺度随纵向深度的增加逐渐增大 .因此可以认为 ,在多晶硅薄膜生长的最初阶段 ,空间反应过程对低温晶化起重要作用 .