The reliability of measurements on electron energy distribution function in silane rf glow discharges

Electron energy distribution function (EEDF) is a key parameter of plasmas, which is directly proportional to the second derivative of the probe I-V characteristics. Because of an amplifying effect of unavoidable noises in the experimental probe I-V curves during the derivation process, the experimental I-V curves should be smoothed before performing the numerical derivation. This paper investigates the effect of adjustable factors used in the smoothing process on the deduced second derivative of the I-V curves, and an optimum group of the adjustable factors is selected to make the rms deviation of the smoothed I-V curves from the measured curves less than 1%. A simple differentiation circuit is designed and used to measure the EEDF parameter straightforwardly. It is the first time, so far as we know, to measure the EEDF parameters simultaneously by means of both numerical and circuit derivative methods under the same discharge conditions and on the same discharge equipment. The deviation between two groups of mean electron energy E and electron density n_e obtained by the above different methods is within about 7%. This apparently improves the reliability of the measurements of the EEDF parameters.     

Low-Temperature Growth of Polycrystalline silicon Films by SiCl4／H2 rf Plasma Enhanced Chemical Vapour Deposition

Polycrystalline silicon film was directly fabricated at 200℃ by the conventional plasma enhanced chemical vapour deposition method from SiCl4 with H2 dilution. The crystallization depends strongly on the deposition power.The maximum crystMlinity and the crystalline grain size are over 80% and 200—50Onm, respectively. The results of energy dispersive spectroscopy and infrared spectroscopy measurements demonstrate that the film is mostly composed of silicon, without impurities such as Cl, N, C and bonded H. It is suggested that the crystallization at such a low temperature originates from the effects of chlorine, i.e., in-situ chemical, etching, in-situ chemical cleaning, and the detachment of bonded H.     

用SiCl4-H2低温沉积多晶硅薄膜微结构的Raman分析

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非晶硅薄膜的低温快速晶化及其结构分析

在镀铝的廉价玻璃衬底上高速沉积的非晶硅薄膜在不同的温度下退火10min.退火温度为500℃时,薄膜表面形成了硅铝的混合相,非晶硅薄膜开始呈现了晶化现象 退火温度为550℃时,大部分(约80%)的非晶硅晶化为多晶硅,平均晶粒尺寸为500nm 退火温度为600℃时,几乎所有的非晶硅都转化为多晶硅,其平均晶粒尺寸约为15μm.     

多晶硅薄膜低温生长中晶粒大小的控制

以SiCl4H2为气源,用等离子体增强化学气相沉积(PECVD)方法低温快速沉积多晶硅薄膜.实验发现,在多晶硅薄膜的生长过程中,气相空间各种活性基团的相对浓度是影响晶粒大小的重要因素,随功率、H2/SiCl4流量比的减小和反应室气压的增加,晶粒增大.而各种活性基团的相对浓度依赖于PECVD工艺参数,通过工艺参数的改变,分析生长过程中空间各种活性基团相对浓度的变化,指出“气相结晶”过程是晶粒长大的一个重要因素. 关键词： 气相结晶 多晶硅薄膜 晶粒生长 SiCl4     

氢化非晶硅薄膜中氢含量及键合模式的红外分析

Fourier红外透射(FTIR)谱技术是研究氢化非晶硅（a-Si∶H）薄膜中氢的含量（CH）及硅—氢键合模式（Si-Hn）最有效的手段.对用等离子体化学气相沉积（PCVD）方法在不同的衬底温度（Ts）下制备出的氢化非晶硅薄膜，通过红外透射光谱的基线拟合、高斯拟合分析，得到了薄膜中的氢含量，硅氢键合模式及其组分，并分析了这些参量随衬底温度变化的规律.     

用SiCl4/H2气源沉积多晶硅薄膜光照稳定性的研究

对以SiH₄/H₂及SiCl₄/H₂为源气体、采用 等离子体增强化学气相沉积技术制备的非晶硅薄膜和多晶硅薄膜进行了光照稳定性的研究.实验表明，制备的多晶硅薄膜并没有出现 非晶硅中的光致衰减现象，其光电导、暗电导在光照过程中没有下降反而有所上升且电导率 变化快慢受氢稀释度的制约.多晶硅薄膜的光照稳定性可能来源于高的晶化度及Cl元素的存在. 关键词： 多晶硅薄膜 稳恒光电导效应 晶界 光致衰退效应     

非晶硅薄膜的低温快速晶化及其结构分析

在镀铝的廉价玻璃衬底上高速沉积的非晶硅薄膜在不同的温度下退火10min.退火温度为500℃时,薄膜表面形成了硅铝的混合相, 非晶硅薄膜开始呈现了晶化现象;退火温度为550℃时,大部分(约80%)的非晶硅晶化为多晶硅,平均晶粒尺寸为500nm;退火温度为600℃时,几乎所有的非晶硅都转化为多晶硅,其平均晶粒尺寸约为1.5μm.     

纳米晶硅薄膜中氢含量及键合模式的红外分析

采用传统射频等离子体化学气相沉积技术在100—350℃的衬底温度下高速沉积氢化硅薄膜. 傅里叶变换红外光谱和Raman谱的研究表明,纳米晶硅薄膜中的氢含量和硅氢键合模式与薄膜的晶化特性有密切关系,当薄膜从非晶相向晶相转变时,氢的含量减少了一半以上,硅氢键合模式以SiH₂为主. 随着衬底温度的升高和晶化率的增加,纳米晶硅薄膜中氢的含量以及其结构因子逐渐减少. 关键词： 氢化纳米晶硅薄膜 红外透射谱 氢含量 硅氢键合模式     

Langmuir单探针诊断射频辉光放电等离子体及其数据处理

Langmuir探针是诊断等离子体参数的重要手段.报道了在氩气射顿(13.56MHz)辉光放电等离子体中使用调谐单探针进行诊断,对探针I-V特性曲线的统计噪声进行了数字滤波的光滑化处理,而后求二次微商.在相同的放电条件下,使用自行设计的微分电路,对探针特性二次微商进行在线测量.这两种方法得到的二次微商结果能够较好地符合. 关键词： Langmuir探针 二次微商 数值滤波 微分电路