石墨化氮化碳负载Cu纳米颗粒用作高效氧还原电催化剂

高活性低成本氧还原反应(ORR)电催化剂是燃料电池和金属/空气电池等可再生能源技术的关键组成部分.在离子液体[(C16mim)2CuCl4]和质子化的石墨化氮化碳(g-CN)的存在下,采用简易的水热反应制备了Cu/g-CN电催化剂用于ORR.与纯的g-CN相比,所制Cu/g-CN表现出高的ORR催化活性:起始电势正移99 mV,为2倍动力学电流密度.另外,Cu/g-CN还表现出比商用Pt/C(HiSPECTM 3000,20%)催化剂更好的稳定性和甲醇容忍性.因此,该催化剂作为廉价的高效ORR电催化剂有望应用于燃料电池中.     

The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.     

剪切载荷作用下含损伤胶接材料界面动应力强度因子的研究

主要针对剪切载荷作用下，胶接材料接合区域界面裂纹尖端动态应力强度因子进行了分析，其中考虑了裂尖区域的损伤．通过积分变换，引入位错密度函数，奇异积分方程被简化为代数方程，并采用配点法求解；最后经过Laplace逆变换，得到动态应力强度因子的时间响应．Ⅱ型动应力强度因子随着黏弹性胶层的剪切松弛参量、弹性基底的剪切模量和Poisson比的增加而增大；随膨胀松弛参量的增加而减小．损伤屏蔽发生在裂纹扩展的起始阶段。裂纹尖端的奇异性指数（-0．5）是与材料参数、损伤程度和时间无关的，而振荡指数由黏弹性材料参数控制．