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Optimization and Finite Element Analysis of the Temperature Field in a Nitride MOCVD Reactor by Induction Heating 下载免费PDF全文
A susceptor structure with a ring channel for a vertical metalorganic chemical vapor deposition reactor by induction heating is proposed. Thus the directions of heat conduction are changed by the channel, and the channel makes the heat in the susceptor redistribute. The pattern of heat transfer in this susceptor is also analyzed. In addition, the location and size of the channel in the susceptor are optimized using the finite element method. A comparison between the optimized and the conventional susceptor shows that the optimized susceptor not only enhances the heating efficiency but also the uniformity of temperature distribution in the wafer, which contributes to improving the quality of the film growth. 相似文献
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Accumulation-type GaN metal-oxide-semiconductor field-effect transistors (MOSFETs) with atomic-layer-deposited Al2O3 gate dielectrics are fabricated. The device, with atomic-layer-deposited Al2O3 as the gate dielectric, presents a drain current of 260 mA/mm and a broad maximum transconductance of 34 mS/mm, which are better than those reported previously with Al2O3 as the gate dielectric. Furthermore, the device shows negligible current collapse in a wide range of bias voltages, owing to the effective passivation of the GaN surface by the Al2O3 film. The gate drain breakdown voltage is found to be about 59.5 V, and in addition the channel mobility of the n-GaN layer is about 380 cm2/Vs, which is consistent with the Hall result, and it is not degraded by atomic-layer-deposition Al2O3 growth and device fabrication. 相似文献
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Investigation of passivation effects in AlGaN/GaN metal-insulator-semiconductor high electron-mobility transistor by gate-drain conductance dispersion study 下载免费PDF全文
This paper studies the drain current collapse of AlGaN/GaN metal-insulator-semiconductor high electron-mobility transistors (MIS-HEMTs) with NbAlO dielectric by applying dual-pulsed stress to the gate and drain of the device.For NbAlO MIS-HEMT,smaller current collapse is found,especially when the gate static voltage is 8 V.Through a thorough study of the gate-drain conductance dispersion,it is found that the growth of NbAlO can reduce the trap density of the AlGaN surface.Therefore,fewer traps can be filled by gate electrons,and hence the depletion effect in the channel is suppressed effectively.It is proved that the NbAlO gate dielectric can not only decrease gate leakage current but also passivate the AlGaN surface effectively,and weaken the current collapse effect accordingly. 相似文献
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AlGaN/GaN high electron mobility transistors (HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 1015 cm-2. The dc characteristics of the devices, such as the drain saturation current and the maximum transconductance, decreased after neutron irradiation. The gate leakage currents increased obviously after neutron irradiation. However, the rf characteristics, such as the cut-off frequency and the maximum frequency, were hardly affected by neutron irradiation. The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism. It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas (2DEG) decreased after neutron irradiation. There was no evidence of the full-width at half-maximum of X-ray diffraction (XRD) rocking curve changing after irradiation, so the dislocation was not influenced by neutron irradiation. It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices. 相似文献
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本文考虑一类完全信息下研究与开发 (R& D)项目中的纯策略问题 .设有一个 R& D项目 ,两位风险中性的投资人竞争 .项目需要的投资量至少是 I,投资较多的一方取胜 .项目成功后的价值是确定的 ,但是其价值大小对这两位投资人不一样 (品牌知名度 ,管理水平 ,营销能力等方面的差异导致的价格和销量不同 ) ,我们使用博弈论方法对此进行研究 ,得到的结果显示 :如果他们所实现的项目价值是常量 ,则不存在均衡解 ;而当项目价值是一个关于投资总量的单增函数时 ,则在两位投资人的价值函数的差异较大时 ,存在一个同时还是社会占优的 Nash均衡解 ,在两位投资人的价值函数差异不太大时 ,不存在均衡解 ,此时的竞争会导致社会效益下降 .从而提示政府应当通过一定的方式 (如招投标法 ,审批法 )对投资活动予以控制 . 相似文献
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Fabrication and Characteristics of AIInN/A1N/GaN MOS-HEMTs with Ultra-Thin Atomic Layer Deposited Al2O3 Gate Dielectric 下载免费PDF全文
Al0.85In0.15N//AlN/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs) employing a 3-nm ultra-thin atomic-layer deposited (ALD) Al2O3 gate dielectric layer are reported. Devices with 0.6μm gate lengths exhibit an improved maximum drain current density of 1227mA/mm at a gate bias of 3 V, a peak transeonductance of 328mS/mm, a cutoff frequency fr of 16 GHz, a maximum frequency of oscillation fmax of 45 GHz, as well as significant gate leakage suppression in both reverse and forward directions, compared with the conventionM Al0.85In0.15N/AlN/GaN HEMT. Negligible C - V hysteresis, together with a smaller pinch-off voltage shift, is observed, demonstrating few bulk traps in the dielectric and high quality of the Al2O3/AIInN interface, it is most notable that not only the transconductance profile of the MOS-HEMT is almost the same as that of the conventional HEMT with a negative shift, but also the peak transconduetance of the MOS-HEMT is increased slightly. It is an exeitin~ inwrovement in the transconductance performance. 相似文献
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This paper discusses the effect of N 2 plasma treatment before dielectric deposition on the electrical performance of a Al2O3 /AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor(MISHEMT),with Al2O3 deposited by atomic layer deposition.The results indicated that the gate leakage was decreased two orders of magnitude after the Al2O3 /AlGaN interface was pretreated by N 2 plasma.Furthermore,effects of N 2 plasma pretreatment on the electrical properties of the AlGaN/Al2O3 interface were investigated by x-ray photoelectron spectroscopy measurements and the interface quality between Al2O3 and AlGaN film was improved. 相似文献
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几类Lotka-Volterra模型的定性分析 总被引:1,自引:0,他引:1
本文考虑几类“捕食者—食饵”型的Lotka—Volterra模型,给出了这些模型全局稳定与所有正解最终有界的充分条件;对这些条件的描述与论证,本文运用了图论的概念与方法。 相似文献
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通过实验和数值器件仿真研究了钝化GaN高电子迁移率晶体管(HEMTs)、栅场板GaN HEMTs和栅源双层场板GaN HEMTs电流崩塌现象的物理机理,建立了电流崩塌强度与帽层中载流子浓度、陷阱电离率和电场的内在联系.研究结果表明,场板可以有效调制帽层中横向和纵向电场的强度分布,并可有效调制纵向电场的方向,减弱栅极附近电场强度,增加场板下方电场强度,这会减弱栅极附近自由电子的横向运动,增强场板下方自由电子的纵向运动,进而可以有效调制帽层中自由电子浓度的分布,提高陷阱的电离率,减小器件的电流崩塌.
关键词:
电流崩塌
钝化器件
场板器件
陷阱电离率 相似文献