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1.
In this work, a continuum model is presented for size and orientation dependent thermal buckling and post-buckling of anisotropic nanoplates considering surface and bulk residual stresses. The model with von-Karman nonlinear strains and material cubic anisotropy of single crystals contains two parameters that reflect the orientation effects. Using Ritz method, closed form solutions are given for buckling temperature and post-buckling deflections. Regarding self-instability states of nanoplates and their recovering at higher temperatures, an experiment is discussed based on low pressurized membranes to verify the predictions. For simply supported nanoplates, the size effects are lowest when they are aligned in [100] direction. When the edges get clamped, the orientation dependence is ignorable and the behavior becomes symmetric about [510] axis. The surface residual stress makes drastic increase in buckling temperature of thinner nanoplates for which a minimum thickness is pointed to stay far from material softening at higher temperatures. Deflection of [100]-oriented buckled nanoplates is higher than [110] ones but this reverses at higher temperatures. The results for long nanoplates show that the buckling mode numbers are changed by orientation which is verified by FEM.  相似文献   
2.
The aim of this paper is to analyze delaminated multilayered plates under classical loads using an alternative model to the existing three-dimensional finite element methods (3D-FEM). The proposed alternative model, named LS1, is a layerwise stress model proving significantly less computationally expensive while accurate and efficient. In particular this paper uses experimental data from different simple test specimens in a finite element code, which is based on LS1, in order to calculate strain energy release rates (SERR) in different modes of delamination. The focus is on two types of delaminated interfaces 0°/0° and 0°/45°. The obtained SERR results are in very good agreement with the experimental values and, in the case of mixed-mode delamination, they are as accurate as the SERR obtained by 3D-FE models. The other interesting property of the LS1 model is the very fast calculation speed as the SERR can be analytically deduced from interfacial stresses. This relation which only depends on the stacking sequence and the position of delamination is presented.  相似文献   
3.
The object of this paper is to determine the thermal expansion behavior of nine different encapsulants in order to identify possible deficiencies in production processes and allow for the optimization of the process parameters. High dimensional stability of the encapsulant is of great importance in photovoltaic (PV) module production to avoid problems during lamination and/or in application. For this purpose, the samples were heated twice in a thermo-mechanical analyzer (TMA) in tensile mode, and the coefficient of thermal expansion (CTE) over temperature was evaluated. To get additional information about transition temperatures of the encapsulants, differential scanning calorimetry (DSC) measurements were made. The TMA results for most samples showed anisotropic behavior which was eliminated after the first heating run. Three samples showed shrinkage with subsequent increased thermal expansion as well as anisotropic behavior. It could be shown that knowing the thermal expansion behavior of the solar cell encapsulants is highly relevant for the PV module lamination process, and Thermo-Mechanical Analysis proved to be a suitable method to evaluate and also for quality control of solar cell encapsulation films.  相似文献   
4.
Detailed finite element implementation is presented for a recently developed technique (He et al., 2012) to characterize nonlinear shear stress–strain response and interlaminar shear strength based on short-beam shear test of unidirectional polymeric composites. The material characterization couples iterative three-dimensional finite element modeling for stress calculation with digital image correlation for strain evaluation. Extensive numerical experiments were conducted to examine the dependence of the measured shear behavior on specimen and test configurations. The numerical results demonstrate that consistent results can be achieved for specimens with various span-to-thickness ratios, supporting the accurate material properties for the carbon/epoxy composite under study.  相似文献   
5.
段铁城  李录贤 《力学学报》2016,48(5):1096-1113
已有多种厚板理论和高阶剪切变形模型,但仍需要进一步研究以更加完善.首先根据平均转角及上下表面剪应力自由这两个条件,提出了具有统一高阶剪切变形模型的中面位移模式,并将之表示为正交分解形式.根据正交特性,定义了板的广义应力;运用板问题应变能密度表示的等价性,提出了与广义应力功共轭的广义应变表示形式,建立了板的本构关系.证明了不同转角定义时虚功原理板理论表示的客观性,以及与三维弹性理论表示的等价性.运用虚功原理,建立了变分自洽的高阶厚板理论和变分渐近的低阶厚板理论,推导了相应的平衡方程及边界条件,分析了与已有板理论的异同.以广义应力形式建立了厚板理论的平衡方程,厘清了不同转角表示时板理论间的关系、低阶厚板理论与高阶厚板理论间的关系以及剪切系数计算等若干基本问题.对圣维南扭转问题的求解证明了该理论的正确性.  相似文献   
6.
A discussion is proposed on the paper “Evaluación numérica del efecto del espesor de la placa de contacto en la acción de palanca en conexión de acero tipo T” by L.M. Bezerra, C.S. de Freitas, W.T. Matias and J.E. Carmona. The topics to be discussed are the definition of the T-stub model, the bibliographic references used in the work and the finite element analysis assumptions adopted in the modeling of the components.  相似文献   
7.
周志东  张春祖  蒋泉 《中国物理 B》2011,20(10):107701-107701
The effects of internal stresses and depolarization fields on the properties of epitaxial ferroelectric perovskite thin films are discussed by employing the dynamic Ginzburg-Landau equation (DGLE). The numerical solution for BaTiO3 film shows that internal stress and the depolarization field have the most effects on ferroelectric properties such as polarization, Curie temperature and susceptibility. With the increase of the thickness of the film, the polarization of epitaxial ferroelectric thin film is enhanced rapidly under high internal compressively stress. With the thickness exceeding the critical thickness for dislocation formation, the polarization increases slowly and even weakens due to relaxed internal stresses and a weak electrical boundary condition. This indicates that the effects of mechanical and electrical boundary conditions both diminish for ferroelectric thick films. Consequently, our thermodynamic method is a full scale model that can predict the properties of ferroelectric perovskite films in a wide range of film thickness.  相似文献   
8.
GaN基蓝绿光LED电应力老化分析   总被引:2,自引:1,他引:1  
李志明  潘书万  陈松岩 《发光学报》2013,34(11):1521-1526
对InGaN/GaN多量子阱蓝光和绿光LED进行了室温20,40,60 mA加速电流下的电应力老化研究,发现蓝光与绿光样品经过60 mA电流老化424 h后,其电学性能表现出一定的共性与差异性:在小测量电流下,绿光样品的光衰减幅度较蓝光样品大~9%;而在较大测量电流 (20 mA)下,两者的光衰减幅度基本相同 (18%)。同时,蓝绿光样品的正向电学性能随老化时间的变化幅度基本一致,反映出它们具有相似的退化机制,绿光样品老化后增多的缺陷大部分体现为简单的漏电行为,而并非贡献于非辐射复合中心。在此基础上对GaN基外延结构进行了优化,优化后的LED长期老化的光衰减幅度较参考样品降低了3%。  相似文献   
9.
We present an analytical model of transient compressive stress evolution during growth of thin films with high surface and grain boundary diffusivities on substrates. The model provides a closed-form analytical solution which compares well with numerical analysis as well as recent experimental data on transient stress evolution during electrodeposition of Sn films on substrates.  相似文献   
10.
The paper presents a mechanical model for predicting the cohesive failure of a periodic array of integrated circuit (IC) chips adhesively bonded to a stretched substrate. A unit cell of the layered structure consisting of the IC chips, adhesive layer, and substrate is modeled as an assembly of two elastic Timoshenko beams, representing the chip and substrate, connected by an elastic interface, representing the adhesive. Accordingly, the stresses and energy release rate (ERR) in the adhesive layer – responsible for the premature cracking of the adhesive and debonding of the IC chips – are identified with the corresponding quantities computed for the elastic interface. Expressions for the adhesive stresses and ERR are given in terms of geometrical dimensions and material properties, combined with integration constants obtained numerically via the multi-segment analysis method. For comparison, the stresses in the adhesive are also computed based on a finite element model, and the ERR is evaluated using the virtual crack-closure technique (VCCT). The analytical predictions and numerical results match fairly well, considering the effects of key factors, such as the distance between adjacent chips, the chip size, the material properties of adhesive and substrate. The interaction between the chips is shown to have relevant effects on the adhesive stresses. In particular, only the mode II contributes to the ERR which increases with the ratio of the chip size to the distance between the chips and with the compliance of the adhesive and substrate layers.  相似文献   
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