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Ⅲ-Ⅴ族氮化物宽禁带半导体材料体系中,普通方法生长的p型外延层电导率一般都很低,成为了制约器件性能提高的瓶颈。在p-AlxGa1-xN材料中,Mg受主的激活能较大,并且随Al组份增加而增大。通过在p-AlxGa1-xN材料生长过程中引入三甲基铟(TMIn),发现能有效地降低AlxGa1-xN材料中受主态的激活能。为研究不同In气氛下生长的p-AlxGa1-xN材料的性质,在使用相同二茂基镁(CP2Mg)的情况下,改变TMIn流量,生长了A,B,C和D四块样品。X射线衍射(XRD)组份分析表明:在1 100 ℃下生长AlxGa1-xN外延层时,In的引入不会影响晶体组份。利用变温霍尔(Hall)测试研究了p-AlxGa1-xN材料中受主的激活能,结果表明:In气氛下生长的外延层相比无In气氛下生长的外延层,受主激活能明显降低,电导率显著提高。采用这种方法改进深紫外发光二极管(LED)的p-AlxGa1-xN层后,LED器件性能明显提高。 相似文献
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Mg-doped AlxGa1-xN epilayers were grown on AlN/sapphire templates by metal organic chemical vapor depo- sition (MOCVD) using an indium-assisted growth method. At room temperature, the resistivity of Mg-doped Alo.43Gao.57N epilayer grown under indium (In) ambient is of the order of 10^4Ω.cm, while the resistivity of Mg-doped Al0.43Ga0.57N grown without In assistance is of the order of 10^6Ω.cm. The ultraviolet light-emitting diodes (UV-LEDs) using the In-assisted Mg-doped Al0.43Ga0.57N as the p-type layers were fabricated to verify the function of indium ambient. It is found that there are a lower turn-on voltage and a lower diode series resistance in the UV-LEDs fabricated with p-type Al0.43Ga0.57 N layers grown under In-ambient. 相似文献
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