多台阶器件结构深层表面光刻工艺优化

针对多台阶器件结构深层表面光刻工艺中存在的问题,对不同台阶高度分别测量了台阶表面及台阶底部沉积的光刻胶厚度,并对台阶高度与光刻胶厚度的关系进行数值描述与分析.基于Beer定律对薄光刻胶光吸收系数的描述,分析了通过实验得到的不同曝光时间下光刻胶的光强透过率曲线,解释了随着曝光时间的增加光刻胶光强透过率发生变化的原因,同时认为光刻胶光吸收系数与光刻胶厚度密切相关.在此基础上,确定了台阶底部堆积光刻胶完全曝光所需时间.优化平面光刻工艺,在不同台阶高度的深台阶表面及底部同时制作出窄线条的高质量图形.     

Single-mode low threshold current multi-hole vertical-cavity surface-emitting lasers

A multi-hole vertical-cavity surface-emitting laser(VCSEL) operating in stable single mode with a low threshold current was produced by introducing multi-leaf scallop holes on the top distributed Bragg-reflector of an oxidationconfined 850 nm VCSEL.The single-mode output power of 2.6 mW,threshold current of 0.6 mA,full width of half maximum lasing spectrum of less than 0.1 nm,side mode suppression ratio of 28.4 dB,and far-field divergence angle of about 10 are obtained.The effects of different hole depths on the optical characteristics are simulated and analysed,including far-field divergence,spectrum and lateral cavity mode.The single-mode performance of this multi-hole device is attributed to the large radiation loss from the inter-hole spacing and the scattering loss at the bottom of the holes,particularly for higher order modes.     

Integration of GaN thin films with silicon substrates by fusion bonding and laser lift-off

GaN thin films grown on sapphire substrates by metalorganic chemical vapor deposition (MOCVD) are successfully bonded and transferred onto Si receptor substrates using fusion bonding and laser lift-off (LLO) technique. GaN/Al_2O_3 structures are joined to Si substrates by pressure bonding Ti/Au coated GaN surface onto Ti/Au coated Si receptor substrates at the temperature of 400℃. KrF excimer laser with 400-mJ/cm~2 energy density, 248-nm wavelength, and 30-ns pulse width is used to irradiate the wafer through the transparent sapphire substrates and separate GaN films from sapphire. Cross-section scanning electron microscopy (SEM) combined with energy dispersive X-ray spectrometer (EDS) measurements show that Au/Si solid solution is formed during bonding process. Atomic force microscopy (AFM) and photoluminescence (PL) measurements show that the qualities of GaN films on Si substrates degrade little after substrates transfer.     

Avoiding silicon/glass bonding damage with fusion bonding method

A novel fusion bonding method between silicon and glass with Nd:YAG laser is described.This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system(MEMS)device during the anodic bonding. The diameter of laser spot is 300 μm,the power of laser is 100 W,the laser velocity for bonding is 0.05 m/s,the average bonding tension is 6.3 MPa.It could distinctly reduce and eliminate the defects and damage,especially in movable sensitive mechanical parts of MEMS device.     

猝发双脉冲直线感应加速器组元研究

在原单脉冲直线感应加速器（LIA）组元的基础上，利用电缆延时和电缆反射两种方式获得了间隔500～1 000 ns的猝发双脉冲输出。在感应加速腔上进行了双脉冲实验，获得了幅度大于200 kV、前沿小于35 ns、平顶大于60 ns的双脉冲加速电压波形。两种方式中第一个脉冲的前沿和幅度都达到了原单脉冲组元的水平，表明加速腔负载的变化对波形没有明显影响，但由于电缆对波形的损耗，第二个脉冲的幅度和前沿比第一个脉冲略差。可以利用水介质传输线来代替长电缆，减小传输线的长度及其对波形的损耗。两个脉冲间的幅度差异可以通过改变长电缆的阻抗来调节。实验表明，通过这两种猝发双脉冲的产生方式并结合加速腔磁芯的改进，可简单高效地完成原单脉冲LIA的双脉冲改造。     

新型多有源区隧道再生光耦合大功率半导体激光器

针对大功率半导体激光器面临的主要困难,提出并实现了一种隧道再生多有源区耦合大光腔 高效大功率半导体激光器机理.该机理能有效地解决光功率密度过高引起的端面灾变性毁坏 、热烧毁和光束质量差等大功率激光器存在的主要问题.采用低压金属有机化合物气相淀积 方法生长了以碳和硅作为掺杂剂的GaAs隧道结、GaAs/InGaAs 应变量子阱有源区和新型多有 源区半导体激光器外延结构,并制备了高性能大功率980nm激光器件.三有源区激光器外微分 量子效率达2.2,2A驱动电流下单面未镀膜激光输出功率高达2.5W. 关键词： 半导体激光器 大功率 金属有机化合物气相沉积     

p型GaN低温粗化提高发光二极管特性

利用金属有机物化学气相沉积技术在蓝宝石衬底上低温生长GaN:Mg薄膜,对不同源流量的GaN:Mg材料特性进行优化研究.研究表明二茂镁(CP2Mg)和三甲基镓(TMGa)物质的量比([CP2Mg]/[TMGa])在1.4×10-3—2.5×10-3范围内,随[CP2Mg]/[TMGa]增加,晶体质量提高,空穴浓度线性增加.当[CP2Mg]/[TMGa]为2.5×10-3时获得空穴浓度与在较高温度生长获得的空穴浓度相当,且薄膜表面较粗糙.采用[CP2Mg]/[TMGa]为2.5×10-3的p型GaN层制备的发光二极管,在注入电流为20mA时,输出光强提高了17.2%.     

用于POF的高性能共振腔发光二极管

提出用AlGaAs材料为n型下DBR,AlGaInP材料为p型上DBR,GaInP/AlGaInP多量子阱为有源区来制备650nm波长的共振腔发光二极管（RCLED）.用传输矩阵法对器件的结构进行了理论设计,并制备了RCLED和普通LED两种结构.测试结果表明,RCLED有更高的发光效率,是普通LED的近1.3倍,当注入电流从3mA增加到30mA时,RCLED的峰值波长只变化了1nm,而普通LED的波长则变化了7nm,且RCLED的光谱半宽窄,远场发散角小. 关键词： 发光二极管 共振腔 金属有机物化学气相淀积     

Internal quantum efficiency drop induced by the heat generation inside of light emitting diodes （LEDs）

The reasons for low output power of AlGaInP Light Emitting Diodes (LEDs) have been analysed. LEDs with AlGaInP material have high internal but low external quantum efficiency and much heat generated inside especially at a large injected current which would reduce both the internal and external quantum efficiencies. Two kinds of LEDs with the same active region but different window layers have been fabricated. The new window layer composed of textured 0.5 μm GaP and thin Indium-Tin-Oxide film has shown that low external quantum efficiency (EQE) has serious impaction on the internal quantum efficiency (IQE), because the carrier distribution will change with the body temperature increasing due to the heat inside, and the test results have shown the evidence of LEDs with lower output power and bigger wavelength red shift.     

Improving performances of ITO/GaP contact on AlGaInP light-emitting diodes

In this paper AlGaInP light emitting diodes with different types of electrodes:Au/Zn/Au-ITO Au/Ti-ITO Au/Ge/Ni-ITO and Au-ITO are fabricated. The photoelectricity properties of those LEDs are studied. The results show that the Au/Zn/Au electrode greatly improves the performance of LEDs compared with the other electrodes. Because the Au/Zn/Au electrode not only forms a good Ohmic contact with indium tin oxide (ITO), but also reduces the specific contact resistances between ITO and GaP, which are 1.273×10-6 ·cm2 and 1.743×10-3 ·cm2 between Au/Zn/Au-ITO and ITO-GaP respectively. Furthermore, the textured Zn/Au-ITO/Zn electrode is designed to improve the performances of LEDs, reduce the forward-voltage of the LED from 1.93 to 1.88 V, and increase the luminous intensity of the LEDs from 126 to 134 mcd when driven at 20 mA.