1,4-双(二苯基膦)丁烷交联的季膦化聚芳醚酮阴离子交换膜

以1,4-双(二苯基膦)丁烷为交联剂,以具有四甲基联苯结构的聚芳醚酮为基体材料,分别制备了刚性三苯基膦和柔性三丁基膦修饰的阴离子交联膜材料.交联剂在交联结构形成的过程中转变成季膦盐,在提高膜材料机械稳定性的同时保持离子交换功能基团的含量.研究了2种阴离子交换膜的尺寸稳定性、电导率、机械性能及耐碱稳定性等.研究结果表明,当交联度为20%时,三苯基膦与三丁基膦修饰的阴离子交换膜的拉伸强度分别由未交联时的27和18 MPa提高到45和30 MPa;交联的膜材料在60℃的3 mol/L KOH溶液中浸泡120 h后,三苯基膦修饰的阴离子交换膜的电导率保留率为81%,三丁基膦修饰的阴离子交换膜的电导率保留率为69%,膜的耐碱稳定性均较未交联时有明显提高.交联度相同时,三苯基膦修饰的阴离子交换膜表现出更高的拉伸强度和更好的耐碱稳定性.     

Investigation on the stress behavior of cellulose acetate and the development of highly moisture‐resistant optical films for display devices

An optical film with high optical anisotropy was prepared by the stretching of a cellulose acetate film and the consequential orienting of a retardation‐enhancing additive. The change in retardation in response to moisture absorption was explored and it was found that the degree of the retardation variation is strongly related to the stretching temperature. Stress generated by the stretching and its relaxation was systematically investigated to elucidate the effect of stretching temperature on the irreversible change in retardation upon moisture absorption. The results show that the magnitude of releasable stress plays an important role in controlling changes in optical properties. In addition, the difference in the deformation behavior between glassy and rubbery states should be taken into account in the development of a moisture‐resistant optical film. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 1470–1478     

A rigid inclusion in an elastic space under the action of a uniform heat flow in the inclusion plane

A solution is presented for the three dimensional static thermoelastic problem of an absolutely rigid inclusion (anticrack) in the case when a uniform heat flow is directed along the inclusion plane. By using the potential method and the Fourier transform technique, the problem is reduced to a system of coupled two-dimensional singular integral equations for the shear stress jumps across the inclusion. As an illustration, a typical application to the circular anticrack is presented. Explicit expressions for the thermal stresses in the inclusion plane are obtained and discussed from the point of view of material failure.     

Propagation of a pre-existing turbulent fluid fracture

The propagation of rough and smooth wall pre-existing turbulent fluid fractures is investigated. The laminar fluid fracture is included as a special case for comparison. Lubrication theory is assumed to apply in the fracture and turbulence is introduced through the wall shear stress. The Perkins–Kern–Nordgren approximation is made in which the fluid pressure is proportional to the half-width of the fracture. The fracture half-width satisfies a non-linear diffusion equation. By using a linear combination of the Lie point symmetries of the non-linear diffusion equation a group invariant solution for the fracture length, volume and half-width is derived. The evolution of the length, half-width and mean flow velocity is analysed for a range of working conditions at the fracture entry. It is found that the mean flow velocity increases approximately linearly along the fracture.     

Determination of crack growth kinetics in non-reinforced semi-crystalline thermoplastics using the linear elastic fracture mechanics (LEFM) approach

The aim of this study was to find a satisfactory method to characterize the fatigue crack growth behavior of non-reinforced, semi-crystalline thermoplastic polymers using linear elastic fracture mechanics (LEFM). For this, crack growth curves (crack length versus cycle number) as well as crack growth kinetics curves (crack growth rate da/dN versus amplitude stress intensity factor ΔK) had to be generated. As methods suggested by ISO 15850 and ASTM E 647-11 failed to provide satisfactory results for the crack growth curves, a more advanced method was searched for and finally found in the literature. Regarding the crack growth kinetics curve, the idea of the calculation was based on methods recommended in ISO 15850 and ASTM E 647-11. However, these methods had to be considerably modified and improved in order to get accurate results with little scatter. The whole methodology was developed and verified with fatigue crack growth tests on two semi-crystalline thermoplastics (polyoxymethylene POM and polyetheretherketone PEEK).     

Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads

Effects of High Temperature Storage (HTS) and bonding toward microstructure change of intermetallic compound (IMC) at the wire bonding interface of 3 types of bond pad (Al, AlSiCu and NiPdAu) were presented in this paper. Optical and electron microscope analyses revealed that the IMC growth rate of samples under 175 and 200 °C HTS increased in the order of Al > AlSiCu > NiPdAu. Besides, higher HTS and bonding temperatures also promoted higher IMC thickness. The compositional study showed that higher HTS and bonding temperature developed rapid interdiffusion in bonding interface. In the mechanical ball shear test, a decrease of the shear force of Al and AlSiCu bond pads after 500 h HTS was believed due to poorly developed IMC at bonding interface. On the other hand, shear force degradation at 1000 h was due to excessive growth of IMC that in turn causes the formation of defects. For NiPdAu bond pad, increasing trend of shear force with HTS duration at 175 °C implied a good reliability of the Cu wire bonding. The rapid microscopic inspection on Cu wired Al bond pad under HTS 175 °C showed the IMC development from the periphery to the center of the ball bond. However, after 500 h voids started to develop until the crack was observed at 1000 h.     

Protein dielectrophoresis: Key dielectric parameters and evolving theory

Globular proteins exhibit dielectrophoresis (DEP) responses in experiments where the applied field gradient factor ∇E² appears far too small, according to standard DEP theory, to overcome dispersive forces associated with the thermal energy kT of disorder. To address this a DEP force equation is proposed that replaces a previous empirical relationship between the macroscopic and microscopic forms of the Clausius–Mossotti factor. This equation relates the DEP response of a protein directly to the dielectric increment δε⁺ and decrement δε⁻ that characterize its β-dispersion at radio frequencies, and also indirectly to its intrinsic dipole moment by way of providing a measure of the protein's effective volume. A parameter Γ_pw, taken as a measure of cross-correlated dipole interactions between the protein and its water molecules of hydration, is included in this equation. For 9 of the 12 proteins, for which an evaluation can presently be made, Γ_pw has a value of ≈4600 ± 120. These conclusions follow an analysis of the failure of macroscopic dielectric mixture (effective medium) theories to predict the dielectric properties of solvated proteins. The implication of a polarizability greatly exceeding the intrinsic value for a protein might reflect the formation of relaxor ferroelectric nanodomains in its hydration shell.     

Stress-Strain Behavior of Shape Memory Polymers by 1WE Method: Application to Tecoflex®

Thermomechanical cycles including programming, cooling, unloading and heating to trigger the 1WE were examined for a shape memory polymer (SMP), Tecoflex® (TFX EG-72D). Cycles were performed at 60°C with 50% and 225% strains and the recovery time of 10 min. Strains evolving with time were estimated during the thermomechanical treatments for the total 44 cycles using 50% strains and the total 50 cycles using 225% strains. Recovery ratios for 50% strains and 225% were also estimated. It turns out that programming, cooling, unloading and heating to trigger the 1WE causes an increase of irreversible strain and is associated with a corresponding decrease of the intensity of the 1WE in particular during the first thermomechanical cycles. In parallel scanning electron microscopic study using secondary electron imaging shows a very slight wavy surface structure evolved during cycling.     

Digital photoelasticity of glass: A comprehensive review

The recent advances in digital photoelasticity have made it possible to use it conveniently for the stress analysis of articles and components made of glass. Depending on the application, the retardation levels to be measured range from a few nanometres to several thousand nanometres, which necessitates different techniques and associated equipments. This paper reviews the recent advances in the photoelasticity of glass with a focus on the techniques/methods developed in the last decade. A brief introduction to the residual stress in glass is provided initially to bring out its tensorial nature. The subsequent sections are organised thematically rather than chronologically, for better readability and easy access of information.     

Effects of initial crystal size of diamond powder on surface residual stress and morphology in polycrystalline diamond (PCD) layer

Polycrystalline diamond compacts (PDC) were synthesized using diamond powder of average crystal size 3-20 μm by the Ni 70 Mn 25 Co 5 alloy infiltration technique at high temperature and high pressure (HPHT).The surface residual stress of polycrystalline diamond (PCD) layer was measured using micro-Raman spectroscopy with hydrostatic stress model and X-ray diffraction (XRD).Measurements of the stress levels of PCDs show that the residual compressive stresses range from 0.12 to 0.22 GPa,which increase with th...