Direct patterning of poly(amic acid) and low‐temperature imidization using a crosslinker,a photoacid generator,and a thermobase generator

A positive‐type photosensitive polyimide (PSPI) based on poly(amic acid) (PAA), a crosslinker 1,1,1‐tris{4‐[2‐(vinyloxy)ethoxy]phenyl}ethane (TVPE), a photoacid generator (PAG) (5‐propylsulfonyloxyimino‐5H‐thiophen‐2‐ylidene)‐2‐(methylphenyl)acetonitrile (PTMA), and a thermobase generator (TBG) t‐butyl 2,6‐dimethylpiperidine‐1‐carboxylate (BDPC) has been developed as a promising material in microelectronics. The PAA was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐oxydianiline (ODA) in dimethyl sulfoxide (DMSO). The PSPI, consisting of PAA (69 wt %), TPVE (21 wt %), PTMA (3 wt %), and BDPC (7 wt %), showed high sensitivity of 21 mJ/cm² and a high contrast of 6.8 when it was exposed to a 436‐nm line (g‐line), postbaked at 90 °C for 5 min, and developed with 1.69 wt % TMAHaq. A clear positive image of 8 μm line and space pattern was printed on film, which was exposed to 50 mJ/cm² of g‐line by a contact printing mode and fully converted to the corresponding polyimide (PI) pattern on heating at 200 °C, confirmed by FTIR spectroscopy. Thus, this system will be a good candidate for next generation PSPIs. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 3362–3369, 2009     

A simple approach toward low‐dielectric polyimide nanocomposites: Blending the polyimide precursor with a fluorinated polyhedral oligomeric silsesquioxane

This article describes a new and simple method for preparing polyimide nanocomposites that have very low dielectric constants and good thermal properties: simply through blending the polyimide precursor with a fluorinated polyhedral oligomeric silsesquioxane derivative, octakis(dimethylsiloxyhexafluoropropyl) silsesquioxane (OF). The low polarizability of OF is compatible with polyimide matrices, such that it can improve the dispersion and free volume of the resulting composites. Together, the higher free volume and lower polarizability of OF are responsible for the lower dielectric constants of the PI‐OF nanocomposites. This simple method for enhancing the properties of polyimides might have potential applicability in the electronics industry. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 6296–6304, 2008     

Thermal behavior of aromatic polyamic acids and polyimides containing oxadiazole rings

Two aromatic polyimides and the corresponding poly(amic acid)s, with oxadiazole and para/meta phenoxyphenylene rings in the backbone, were synthesized and the structure — thermal properties correlation was followed by dynamic mechanical analysis. Concerning the poly(amic acid)s, the glass transition domain was emphasized only for the compound with meta-oriented rings because the process of imidization takes place with increasing temperature. A multiplex experiment was performed to calculate the activation energy of the transition localized under 200°C. Consecutive heating-cooling-heating cycles were accomplished. All phenomena are discussed by cross-examination of the storage modulus (E′), loss modulus (E″) and loss factor tanδ variation with temperature.     

Atomistic models of three fluorinated polyimides in the amorphous state

Molecular models of three fluorinated polyimides based on the 4,4′‐(hexafluoroisopropylidene)diphthalic dianhydride (6FDA) have been studied using molecular dynamics (MD) simulations. The respective diamines were 4,4′‐hexafluoroisopropylidene dianiline (6FpDA), 3,3′‐hexafluoroisopropylidene dianiline (6FmDA), and 2,4,6‐trimethyl‐1,3phenylenediamine (DAM). Thirty independent samples were prepared using a hybrid pivot Monte Carlo‐MD generation technique and average densities were found to be in very good agreement with experiment. Model structures also agreed with available wide‐angle X‐ray scattering data. Cohesive energies, Hildebrand solubility parameters, fractional free volumes (FFV), void space distributions and intermolecular as well as intramolecular interactions were analyzed. The differences in bulk properties between both 6FDA‐6FpDA and 6FDA‐6FmDA isomers remain fairly small, although the configurations of the former are more extended. 6FDA‐DAM has a lower density, larger intermolecular distances, and higher free volume than the other two polyimides. Results are discussed with respect to their use as matrices for gas separation. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 1166–1180, 2009     

Polyimides as cathodic materials in lithium batteries: Effect of the chemical structure of the diamine monomer

Polyimides are being investigated as alternative, environmentally friendly and safe organic electrode materials for lithium and sodium batteries. However, further improvements need the proper chemical design of these polymers. In this paper, the effect of chemical structure of polyimides on their performance as cathodic materials in lithium batteries was investigated in detail. More in particular, we studied polyimides based on seven different diamine monomers in combination with best performing naphthalenic dianhydride monomer. The first set included the so‐called cardo diamines possessing additional redox‐active carbonyl group with the goal to enhance the theoretical capacity of the polymer. Second, several aromatic diamines including additional functionalities such as cyclic amides, anthrone, or quinolidinium groups were investigated. Finally, aliphatic diamines, containing oxyethylene moieties and thus capable to increase the ionic conductivity of the resulting polymer system, were explored. Among the different polyimides, the “cardo” one based on naphthalenic dianhydride and aromatic aniline phthalein with an additional carbonyl group showed the best results in terms of battery performance. Such polyimide was capable to deliver up to 130 mAhg⁻¹ specific capacity (87% of the theoretical value) at 25 °C and at a current density of 250 mAg⁻¹ during 100 charge/discharge cycles. © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 714–723     

Proton conductive polyimide ionomer membranes: Effect of NH,OH, and COOH groups

A new series of sulfonated polyimide (SPI) copolymers containing NH, OH, or COOH groups were synthesized by the polycondensation of 1,4,5,8‐naphthalnetetracarboxylic dianhydride, 3,3′‐bis(sulfopropoxy)‐4,4′‐diaminobiphenyl, and 3‐(4‐aminophenyl)‐5‐(3‐aminophenyl)‐1H‐1,2,4‐triazole (SPI‐8‐m), 3,5‐bis(4‐aminophenyl)‐1H‐1,2,4‐triazole (SPI‐8‐p), 3,6‐diaminocarbazole (SPI‐9), 3,5‐diamino‐1H‐1,2,4‐triazole (SPI‐10), bis(3‐aminopropyl)‐amine (SPI‐11), 2,6‐diaminopurine (SPI‐12), 2,4‐diamino‐6‐hydroxyprymidine (SPI‐13), or 3,5‐bis(4‐aminophenoxy)benzoic acid (SPI‐14). The obtained SPIs were soluble in polar organic solvents and gave tough and flexible membranes by solution casting. The SPI membranes having NH and COOH groups showed high thermal (decomposition temperature ≈200 °C) and mechanical (maximum stress >22 MPa) stability. Introducing NH groups, especially triazole and carbazole groups, was effective in improving proton conductive properties of SPI membranes at low humidity. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2846–2854, 2010     

Effects of the acceptor conjugation length and composition on the electrical memory characteristics of random copolyimides

Resistive‐switching memories based on copolyimides (coPIs), PI‐NTCDIX and PI‐BTCDIX , with different compositions of 4,4′‐diamino‐4″‐methyltriphenylamine ( AMTPA ), 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride, and N,N′‐bis‐(4‐aminophenyl)‐1,8:4,5‐naphthalenetetracarboxydiimide ( NTCDI ) or N,N′‐bis‐(4‐aminophenyl)‐1,2:4,5‐benzenetetracarboxydiimide ( BTCDI ) have been developed. By varying the feed ratio of monomers, PI‐NTCDIX and PI‐BTCDIX showed tunable optical and electronic properties through the charge transfer (CT) between AMTPA and NTCDI or BTCDI . The memory devices based on PI‐NTCDIX exhibited the tunable electrical bistability from the volatile dynamic random access memory to nonvolatile write once read many memory characteristics as the NTCDI composition increased. The OFF/ON electrical switching transition was mainly attributed to the CT mechanism for the charge separated high conductance, based on the analysis of model compounds and density functional theory calculation. Also, the volatility of the memory device depended on the stability of CT complex. The long conjugation and high electron affinity of the NTCDI moiety stabilized the radical anion generated in the CT complex and prevented the recombination of segregated radical species even through applying the high positive or negative voltage. On the other hand, the memory devices based on PI‐BTCDIX showed a rather unique behavior compared with those based on PI‐NTCDIX . At the low BTCDI composition, the device exhibited volatile memory property. However, no switching behavior was observed at the high BTCDI composition due to the low highest occupied molecular orbital energy level of BTCDI . Combining these results and our previous study on perylenebisimide ( PBI ), we concluded that memory characteristics could be tailored by changing the conjugation length ( PBI > NTCDI > BTCDI ) and the acceptor composition in random coPIs. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2013     

Solution‐processable colorless polyimides derived from hydrogenated pyromellitic dianhydride with controlled steric structure

This work presents novel colorless polyimides (PIs) derived from 1R,2S,4S,5R‐cyclohexanetetracarboxylic dianhydride (H″‐PMDA). Isomer effects were also discussed by comparing with PI systems derived from conventional hydrogenated pyromellitic dianhydride, that is, 1S,2R,4S,5R‐cyclohexanetetracarboxylic dianhydride (H‐PMDA). H″‐PMDA was much more reactive with various diamines than H‐PMDA, and the former led to PI precursors with much higher molecular weights. The results can be explained from the quite different steric structures of these isomers. The thermally imidized H″‐PMDA‐based films were colorless regardless of diamines because of inhibited charge‐transfer interaction. In particular, the H″‐PMDA/4,4′‐oxydianiline system simultaneously achieved a very high T_g exceeding 300 °C, high toughness (elongation at break > 70%), and good solution processability. In contrast, the H‐PMDA‐based counterparts were essentially insoluble. The outstanding solubility of the former probably results from disturbed chain stacking by its nonplanar steric structure. An advantage of chemical imidization process is also proposed. In some cases, a copolymerization approach with an aromatic tetracarboxylic dianhydride was effective to improve the thermal expansion property. The results suggest that the H″‐PMDA‐based PI systems can be promising candidates for novel high‐temperature plastic substrate materials in electronic paper displays. A potential application as optical compensation film materials in liquid crystal displays (LCD) is also proposed in this work. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2013     

Novel soluble fluorinated poly(ether imide)s with different pendant groups: Synthesis,thermal, dielectric,and optical properties

Three types of new bis(ether dianhydride) monomers, [4,4′‐(2‐(3′‐methylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4a)], [4,4′‐(2‐(3′‐trifluoromethylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4b)], and [4,4′‐(2‐(3′,5′‐ditrifluoromethylphenyl)‐1,4‐phenylenedioxy)‐diphthalic anhydride (4c)] were prepared via a multistep reaction sequence. Three series of soluble poly(ether imide)s (PEIs) were prepared from the obtained dianhydrides by a two‐step chemical imidization method. Experimental results indicated that all the PEIs had glass transition temperature in the range of 200–230 °C and the temperature of 5% weight loss in the range of 520–590 °C under nitrogen. The PEIs showed excellent solubility in a variety of organic solvents due to introduction of the bulky pendant groups and were capable of forming tough films. The casting films of PEIs (80–91 μm in thickness) had tensile strengths in the range from 88 to 117 MPa, tensile modulus from 2.14 to 2.47 GPa, and elongation at break from 15 to 27%. The casting films showed UV‐Vis absorption edges at 357–377 nm, low dielectric constants of 2.73–2.82, and water uptakes lower than 0.66 wt %. The spin‐coated films of PEIs presented a minimum birefringence value as low as 0.0122 at 650 nm and low optical absorption at the optical communication wavelengths of 1310 and 1550 nm. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 3281–3289, 2010     

Effect of thermal history on the deformation and failure of polyimides

Thermal‐processing structure‐property relationships for polyetherimide (PEI), poly(4,4′‐oxydiphenylene pyromellitimide) (POPPI), and phenylethynyl‐terminated imide (PETI‐5) composite matrices are reported from a fundamental perspective. For thermoplastic PEI, deformation and failure depend primarily on free volume as evidenced by moisture‐absorption, mechanical‐property, and mass‐density changes as a function of annealing. The deformation of POPPI can be divided into the following three regimes as a function of annealing temperature: (1) physical aging‐induced glassy state free‐volume decreases, (2) thermally activated microvoid collapse, and (3) chemical degradation. In the case of PETI‐5, macroscopic defects, free volume, and polymer morphology control deformation. The effects of residual crystallinity on deformation are reported, and it is shown that mechanical toughness can be significantly decreased upon annealing below the glass‐transition temperature. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 2947–2959, 2001