Significant change in water contact angle of electrospray‐synthesized SiO2 films depending on their surface morphology

Amorphous SiO₂ films were deposited by means of an electrospray technique. The relation between the water contact angle (WCA) of the deposited SiO₂ films and the surface morphology is investigated. The feeding rate of the electrospray process greatly affects the morphology of the synthesized SiO₂ films. There is also a significant change in the WCA on the surface of the films: the rougher the surface, the greater the WCA. A model based on the Cassie–Baxter formulation is used to explain the change observed in the WCA on the SiO₂ films. Copyright © 2012 John Wiley & Sons, Ltd.     

A quasi‐dynamic procedure for coupled thermal simulations

This paper outlines the development and adaptation of a coupling strategy for transient temperature analysis in a solid via a conjugate heat transfer method. This study proposes a quasi‐dynamic coupling procedure to bridge the temporal disparities between the fluid and the solid. In this approach, dynamic thermal modeling in the solid is coupled with a sequence of steady states in the fluid. This quasi‐dynamic algorithm has been applied to the problem of convective heat transfer over, and transient conduction heat transfer within, a flat plate using the severe thermal conditions of a solid propellant rocket. Two different coupled thermal computations have been performed. In the first one—referred to as the reference computation—the coupling period is equal to the smallest solid time constant. In the second one, a very large coupling period is used. The results show that the procedure can predict accurate transient temperature fields at a reasonable computational cost. The simulation CPU time is approximately reduced by up to 90%, while maintaining a very good accuracy. All the details of the numerical test case are given in the paper. This application illustrates the capabilities and the overall efficiency of this coupled approach in a solid transient problem using long term simulations of time dependent flows. Copyright © 2013 John Wiley & Sons, Ltd.     

The effect of differently sized Ag catalysts on the fabrication of a silicon nanowire array using Ag-assisted electroless etching

A simple and low cost method to generate single-crystalline, well-aligned silicon nanowires (SiNWs) of large area, using Ag-assisted electroless etching, is presented and the effect of differently sized Ag catalysts on the fabrication of SiNWs arrays is investigated. The experimental results show that the size of the Ag catalysts can be controlled by adjusting the pre-deposition time in the AgNO₃/HF solution. The optimum pre-deposition time for the fabrication of a SiNWs array is 3 min (about 162.04 ± 38.53 nm Ag catalyst size). Ag catalysts with smaller sizes were formed in a shorter pre-deposition time (0.5 min), which induced the formation of silicon holes. In contrast, a large amount of Ag dendrites were formed on the silicon substrate, after a longer pre-deposition time (4 min). The existence of these Ag dendrites is disadvantageous to the fabrication of SiNWs. Therefore, a proper pre-deposition time for the Ag catalyst is beneficial to the formation of SiNWs.SiNWs were synthesized in the H₂O₂/HF solution system for different periods of time, using Ag-assisted electroless etching (pre-deposition of the Ag catalyst for 3 min). The length of the SiNWs increases linearly with immersion time. From TEM, SAED and HRTEM analysis, the axial orientation of the SiNWs is identified to be along the [001] direction, which is the same as that of the initial Si wafer. The use of HF may induce Si–H_x bonds onto the SiNW array surface. Overall, the Ag-assisted electroless etching technique has advantages, such as low temperature, operation without the need for high energy and the lack of a need for catalysts or dopants.     

A novel hexairon cluster with one disulfide and two Ph2PCS3− ligands

The title compound, hexadecacarbonylbis{μ₃‐[(diphenylphosphanyl)methanediidyl]sulfanido}‐μ₄‐disulfido(2−)‐hexairon(4 Fe—Fe), [Fe₆(C₁₃H₁₀PS)₂(S₂)(CO)₁₆], contains two inversion‐related [Fe₃(Ph₂PCS)(CO)₈] subclusters linked by an equatorial disulfide bond [S—S = 2.1490 (9) Å]. Each Ph₂PCS³⁻ ligand is coordinated to a triiron core in a μ₃‐κP:κ²C:κ²S fashion.