环氧交联网T_g转变的tanδ-T曲线解析

本文系统地研完了预聚物分子量、固化剂配比和固化条件对环氧交联网T_g松弛内耗峰松弛时间分布的影响。本实验和理论研究结果首次证明了环氧交联网T_g松弛过程具有单一松弛时间描述的线性标准固体的特征,与预聚体分子量、固化剂配比和固化条件无关。此结果可用环氧交联网的两相结构特征加以解释。     

环氧交联网Tg转变的tanδ-T曲线解析

 本文系统地研完了预聚物分子量、固化剂配比和固化条件对环氧交联网T_g松弛内耗峰松弛时间分布的影响。本实验和理论研究结果首次证明了环氧交联网T_g松弛过程具有单一松弛时间描述的线性标准固体的特征,与预聚体分子量、固化剂配比和固化条件无关。此结果可用环氧交联网的两相结构特征加以解释。     

原位FTIR光谱法研究联萘基环氧树脂体系的固化反应

用原位FTIR光谱方法分析了联萘基环氧单体DGEBN与胺类和酚类固化剂的固化反应.固化体系中,在环氧与固化剂混合之后和反应之前就存在特殊的分子间作用力(包括氢键作用),这可能是由环氧-固化剂产生的环状中间体络合物使环氧基的伸缩振动频率产生红移所致.随着固化反应的进行,环氧基的振动吸收峰分裂成二重峰,分裂转变时间所对应的转化度接近理论凝胶点.4种固化剂与DGEBN进行固化反应表现出不同的反应活性.用FTIR和DSC两种方法分别得到的转化度随时间的变化关系具有可比性.     

酚醛型氰酸酯与双酚A型环氧共固化反应的FTIR研究

在恒温固化条件下,通过FTIR跟踪方法,研究了酚醛型氰酸酯与双酚A型环氧共固化反应的路径及其反应机理.共固化体系的反应过程包括在150℃及其以下温度,主要发生的是氰酸酯的三嗪环化固化反应,其中三嗪环化固化反应由于环氧的加入,反应速率被极大地提高了;同时,酚醛型氰酸酯中的氨基甲酸酯类杂质与环氧发生开环聚合反应,引起环氧官能团产生弱而持续的消耗.但在此阶段,酚醛型氰酸酯与环氧之间没有化学反应发生;在180℃及其以上温度,三嗪环和环氧发生反应,异构为异氰脲酸环结构,并进一步反应生成唑啉酮环结构,由于该反应的发生,促进了环氧官能团的消耗速度,在环氧官能团的转化率-时间图中,出现倒S曲线;在三嗪环的转化率图中,出现一个极大值后再降落的曲线.反应温度的提高有利于促进酚醛型氰酸酯与环氧之间的共固化反应,特别是当反应温度为220℃时,氰酸酯官能团和环氧官能团的消耗、三嗪环和唑啉酮环的生成均以较快的速率进行,—OCN生成三嗪环的转化率可以较容易地达到1,而唑啉酮环的转化率不超过0.5.     

环氧树脂与氰酸酯共聚反应研究

研究了催化剂对环氧树脂与氰酸酯树脂的共聚固化反应行为的影响,并初步探索氰酸酯／环氧固化的反应历程．研究表明,催化剂能明显地促进其固化反应,降低固化温度,缩短固化时间;氰酸酯与环氧共聚反应历程是首先氰酸酯三聚反应生成三嗪环结构,然后三嗪环开环与环氧共聚反应,最后是未能参与共聚反应的环氧官能团在唑啉结构和三嗪环的催化下发生聚醚化反应;在氰酸酯官能团欠量的条件下,固化树脂中主要是唑啉和聚醚结构,而三嗪环结构的含量很少．     

脂环族环氧树脂和螺环原碳酸酯的光引发正离子共聚合

<正> 无收缩单体-1,6,8,13-四氧螺[7,7]十三碳烷(SOC_7)和3,4-环氧基环己烷甲酸3',4'-环氧基环己烷甲酯(ERL-4221)的光引发正离子共聚合的研究结果表明,少量SOC_7加到ERL-4221体系中可抑制固化收缩没有明显降低热性能。ERL-4221对SOC_7的合适克分子比为4比1,由此得到T_g为203℃而聚合时体积收缩为4.4％的交联共聚物。     

过剩热焓松弛CO_2和甲苯在PET薄膜中渗透的影响

本文研究了非晶态、未取向PET薄膜样品在低于T_g温度以下热处理,结构的变化和过剩热焓松弛对CO_2和甲苯溶剂在样品中渗透速率的影响。结果表明,随退火时间增加,从T_g转变吸热峰确定的过剩热焓松弛量、 T_g温度、密度增加,而反式构象含量减少。除分子链堆砌密度提高或自由体积下降外,没有发现非晶相有结构上的变化。因此,CO_2在样品中随退火时间的增加渗透速率下降。然而,由于样品脆性增加和甲苯的溶胀作用,样品表面出现裂纹,使甲苯在样品中的表观渗透速率增加。     

4,5-环氧环己烷1,2-二甲酸二缩水甘油酯/m-PDA固化体系的形态结构及动态力学行为

<正> 不少作者已对一般固化环氧树脂的形态结构作了研究。作者对4,5-环氧环己烷1,2二甲酸二缩水甘油酯(简称TDE-85)树脂固化行为研究的结果表明,由于TDE-85具有两种不同活性的环氧基,固化温度不同,两种环氧基参与开环交联反应程度不相同。本文在不同温度下采用SEM、TBA对TDE-85/m-PDA固化体系并研究其形态结构和相应的动态力学行为。以探讨TDE-85由于化学结构的特殊固化过程与形态结构间的关系。     

KH407型甲酚甲醛环氧塑料封装材料

目前国外大约90％的晶体管、80％的集成电路及大规模集成电路都采用塑封生产,主要用环氧膜塑料,国内主要靠进口。由于要求低温贮存,运输十分困难。我所研制成功的KH407型环氧膜塑料机械强度高,介电性能、耐热性能及粘结性能优良,塑封工艺性好,固化速度快,生产效率高。主要性能已基本达到国外同类产品水平。用于塑封中、小规模集成电路和晶体管,塑封产品符合电子工业部     

一种液晶环氧增韧环氧树脂的研究

环氧树脂具有优异的机械性能 ,耐高温以及良好的加工工艺性 .被广泛用于机械、航天、船舶等领域 .由于环氧树脂固化后断裂延伸率小 ,脆性大 ,使其应用受到了一定的限制 .为此 ,国内外学者对环氧树脂进行了大量的改性研究工作 .用含有“柔性链段”的固化剂固化环氧 ,在交联网络中引入柔性链段[1] ;在环氧基体中加入橡胶弹性体[2 ] 、热塑性树脂[3 ,4] 、液晶聚合物[5,6] 等分散相或用热固性树脂连续贯穿于环氧树脂网络中形成互穿、半互穿网络结构[7] ,以改善环氧树脂的韧性 .本文采用液晶环氧化合物原位复合增韧环氧树脂 ,考察了液晶环氧对环…     

热处理对尼龙1010固态结晶和玻璃态热松驰的影响

本文用DSC首先论证淬火尼龙1010试样在DSC曲线上出现的放热峰是冷结晶峰,然后研究淬火尼龙1010在不同热处理条件下,冷结晶峰和玻璃态热松驰峰的变化规律。实验结果表明,等温结晶时间较短,试样的固态结晶速率较快;等温结晶时间较长,固态结晶速率较慢,这可能与在Tg区域等温所形成的新氢键有关。当升高等温温度时,固态结晶速率加快。在低于Tg的不同温度退火,玻璃态热松弛峰的峰高及热焓在281K达最大值,进而确定对玻璃态热松驰影响最敏感的温度区间是277～284K。     

CRYSTALLIZATION AND MELTING OF NYLON 610

Differential scanning calorimetry was used to study the crystallization andmelting of nylon 610. For nylon 610 crystallized from the melt state (260℃), the overall rateof bulk crystallization can be described by a simple Avrami equation with Avrami exponentn ≈ 2, independent of crystallization temperature. With the experimentally obtainedT_m~0 (235℃ ～ 255℃) of nylon 610, the fold surface free energy σ_e was determined to be35 ～38 erg/cm~2. The effects of annealing temperature and time on the melting of quenchednylon 610 were also investigated. For nylon 610 quenched at room temperature there isonly one DSC endotherm peak DSC scans on annealed samples exhibited an endothermpeak at approximately 10℃ above the annealing temperature. The size and position of theendothermic peak is strongly related to annealing temperature and time. An additionalthird melting was observed when quenched nylon 610 was annealed at high temperaturefor a sufficiently long residence time. The existence of the third melting peak suggests thatmore than one kind of distribution of lamella thickness may occur when quenched nylon610 is annealed. The implications of these results in terms of crystal thickening mechanismwere discussed.     

Structural changes in glassy polymers studied by thermal analysis and dynamic mechanical tests

Structural changes which take place in many amorphous polymers, when they are annealed at temperatures near the glass transition temperature, have important theoretical, physical, and mechanical consequences. In this paper the possible existence of some local ordering in highlycrosslinked epoxy resins is studied. Three kinds of tests—TMA, DSC, and dynamic experiments—are used for a type of epoxy resin, cured with six different amounts of curing agent. In order to study the effect of the thermal history on the behavior of the polymer at its transition region, as well as the morphology of the materials tested, three different thermal treatments have been followed. Interesting results were derived concerning the influence of these parameters to these parameters to the mechanical characterization of the polymer.     

Physical Aging of a Tetrafunctional/phenol Novolac Epoxy Mixture Cured with Diamine. DSC and DMA measurements

The physical aging of a system containing tetraglycidyl-4-4′-diaminodiphenylmethane (TGDDM), with a multifunctional novolac glycidyl ether resin hardened by 4,4′-diaminodiphenylsulphone (DDS) has been investigated by differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). Samples fully cured were aged at temperatures between 200 and 250°C, during periods of time from 1 to a maximum of 336 h. Furthermore, the dynamic mechanical relaxation behaviour annealed at temperature of 220°C, was studied, aging during 24 and 168 h. The effect of the enthalpy relaxation during DSC heating scan is shown by the presence of an endothermic peak whose position and intensity depends on the aging conditions, both temperature and time. DSC studies suggest that enthalpy relaxation increases gradually with aging time to a limiting value for each temperature where structural equilibrium is reached. DMA results show that the effect of aging is to cause chain stiffening and a decrease in the height of the peak value of the loss factor. This revised version was published online in August 2006 with corrections to the Cover Date.     

聚苯基单醚喹噁啉薄膜的性能与物理老化

研究了物理老化对聚苯基单醚喹啉薄膜的结构与力学性能的影响 .用差示扫描量热计 (DSC)及正电子湮没寿命谱 (PALS)方法表征了两种不同物理老化条件试样的凝聚结构以及自由体积的差别 .结果表明 ,物理老化使聚苯基单醚喹啉薄膜玻璃化转变温度移向高温 ,在其末端出现热焓吸收峰 ,分子链堆砌紧密使自由体积减小 ,分子可动性降低 .用动态力学分析 (DMTA)以及静态拉伸性能测试等方法研究了两类试样的力学性能 ,结果表明 ,物理老化后 ,试样的动态储能模量稍有增加 ,力学损耗降低 .而静态拉伸实验的断裂应变降低 ,屈服应力增加 ,断裂能降低 ,试样在宏观上由韧性断裂变为明显的脆性断裂 .     

热历史对尼龙1212熔融行为的影响

利用DSC方法研究了不同热历史条件对尼龙1212熔融行为的影响.不同的热历史条件下,在DSC曲线上,观察到尼龙1212产生2个或3个熔融峰,依据聚合物结晶理论,对各峰的来源进行了分析.在160℃下不同温度退火120 min的尼龙1212样品DSC曲线上,低温结晶熔融峰主要由低温结晶形成的一些微晶体或者片晶熔融产生,其晶体完善程度较差,熔融峰值较低,峰面积较小;主熔融峰是由样品在淬火过程中形成的晶体和升温过程中低温结晶形成的晶体的熔融重结晶形成较为完善的晶体熔融所产生,熔融峰值较高,峰面积较大.在不同的升温速率条件下,熔融峰温度有所移动,表明不同升温速率条件下产生的熔融峰的结晶晶型是相同的.在不同结晶时间下结晶,延长结晶时间对较高完善程度晶体的生长有利.在不同温度下依次退火处理的样品,熔融产生两个附加峰,这两个附加峰的峰温都比它们相应的退火温度高,而峰高和峰面积随退火温度降低而减小.根据等温结晶结果,由Hoffman方法确定了尼龙1212的平衡熔融温度为202.8℃.     

DSC Studies on Polytetrahydrofurans with Various Molecular Masses, Their Blends and Their Cured Samples

DSC studies are given for polytetrahydrofurans with molecular masses equal to 650, 1400, and 2900, for their blends, and for their cured samples. The samples were stored, annealed, and quenched to obtain the samples with different thermal histories. Two or more endothermic peaks appear in the DSC curves for the stored samples, even for the non-blended samples. A hyperbolic curve forced the plot of the highest melting temperature vs. the molecular mass to asymptote to about 50°C. The relationship between the highest melting temperature and the composition for the blended samples is suitable to linear or Fox’s relation. A peak and a shoulder appear in the DSC curves of the cured samples. As the samples are cooled at the faster rates in the thermal treatment, the shoulder appears at the lower temperatures. This revised version was published online in July 2006 with corrections to the Cover Date.     

Physical aging of epoxy polymers and their composites

Exposure to extended periods of sub‐T_g temperatures causes physical changes in the molecular structure of epoxy resins and epoxy‐based materials to occur. These physical aging mechanisms include the reduction in free volume and changes to the molecular configuration. As a result, mechanical, thermodynamical, and physical properties are affected in ways that can compromise the reliability of epoxy‐based engineering components and structures. In this review, the physical changes in the molecular structure of epoxies are described, and the influence of these changes on the bulk‐level response is detailed. Specifically, the influence of physical aging on the quasistatic mechanical properties, viscoelasticity, fracture toughness, thermal expansion coefficient, volume relaxation, enthalpy relaxation, endothermic peak temperature, fictive temperature, and moisture/solvent absorption capability is reviewed. Also discussed are relationships between relaxation functions, crosslink density, composite reinforcement, and epoxy/copolymer blending and the physical aging response of epoxies. Finally, the concepts of thermal and mechanical rejuvenation are discussed. © 2011 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2011     

Annealing effect on cold drawing of PVC-films

Cold drawing of PVC-films at room temperature depends on thermal pretreatment. Yield stress, difference between yield and draw stress and neck temperature increase, when the samples have been annealed not far below glass transition temperature and subsequently quenched; they decrease by annealing aboveT _g and quenching down to room temperature. These changes of variables characterizing the cold drawing process can be interpreted morphologically by an increase or decrease of free volume in the noncrystalline regions which favour neck formation or render it more difficult respectively.     

环氧树脂的物理老化

本工作发展了补偿式示差扫描量热(CDSC)法,用于环氧树脂热焓松弛研究,实验结果证明CDSC法较DSC法灵敏并能提供更多的信息。用CDSC法研究了交联度对环氧树脂热焓松弛动力学的影响,计算了活化能,对结果进行了讨论。