Influence of oxygen partial pressure on the properties of undoped InOx films deposited at room temperature by rf-PERTE

Transparent and conductive/semiconductive undoped indium oxide (InO_x) thin films were deposited at room temperature. The deposition technique used is the radio frequency (rf) plasma enhanced reactive thermal evaporation (rf-PERTE) of indium (In) in the presence of oxygen. The influence of oxygen partial pressure on the properties of these films is presented. The oxygen partial pressure varied between 3 × 10^?2 and 1.3 × 10^?1 Pa. Undoped InO_x films, 100 nm thick, deposited at the oxygen partial pressure of 6 × 10^?2 Pa show a conductive behaviour, exhibit an average visible transmittance of 81%, a band gap around 2.7 eV and an electrical conductivity of about 1100 (Ω cm)^?1. For oxygen pressures greater than 6 × 10^?2 Pa, semiconductive films are obtained, maintaining the visible transmittance. Films deposited at lower pressures are conductive but dark. From XPS data, films deposited at an oxygen partial pressure of 6 × 10^?2 Pa show the highest amount of oxygen in the film surface and the lowest ratio between oxygen in the oxide crystalline and amorphous phases.     

Amorphous tungsten-doped In2O3 transparent conductive films deposited at room temperature from metallic target

Amorphous tungsten-doped In₂O₃ (IWO) films were deposited from a metallic target by dc magnetron sputtering at room temperature. Both oxygen partial pressure and sputtering power have significant effects on the electrical and optical properties of the films. The as-deposited IWO films with the optimum resistivity of 5.8 × 10^?4 Ω·cm and the average optical transmittance of 92.3% from 400 to 700 nm were obtained at a W content of 1 wt%. The average transmittance in the near infrared region (700–2500 nm) is 84.6–92.8% for amorphous IWO prepared under varied oxygen partial pressure. The mobility of the IWO films reaches its highest value of 30.3 cm² V^?1 s^?1 with the carrier concentration of 1.6 × 10²⁰ cm^?3, confirming their potential application as transparent conductive oxide films in various flexible devices.     

Role of oxygen in structural properties of annealed CuAlO2 films

CuAlO₂ films were sputtered on quartz substrates at different oxygen partial pressures (OPP) and carried out the annealing at 900 °C for 5 h in N₂ ambient. The structural properties of these films have been studied in detail by X-ray diffraction, Raman spectroscopy, and atomic force microscopy. Annealed CuAlO₂ films are grown along the (0 0 1) preferential orientation. The film deposited at 20% OPP demonstrates the excellent crystalline behavior and the smallest electrical resistivity (41.8 Ω cm). At higher OPP, the crystalline behavior begins to degenerate up to the amorphous state at 60% OPP, and some micro-caves presented in the film surface become larger and deeper with the increase in OPP. We believe that the negative thermal expansion behavior associated with excess oxygen atoms is the primary responsibility for the change in structural properties.     

Effect of tellurium deposition rate on the properties of Cu–In–Te based thin films and solar cells

To investigate the effects of tellurium (Te) deposition rate on the properties of Cu–In–Te based thin films (Cu/In=0.30–0.31), the films were grown on both bare and Mo-coated soda-lime glass substrates at 200 °C by co-evaporation using a molecular beam epitaxy system. The microstructural properties were examined by means of scanning electron microscopy and X-ray diffraction. The crystalline quality of the films was improved with increase in the deposition rate of Te, and exhibited a single CuIn₃Te₅ phase with a highly preferred (1 1 2) orientation. Te-deficient film (Te/(Cu+In)=1.07) grown with a low Te deposition rate showed a narrow bandgap of 0.99 eV at room temperature. The solar cell performance was affected by the deposition rate of Te. The best solar cell fabricated using CuIn₃Te₅ thin films grown with the highest deposition rate of Te (2.6 nm/s) yielded a total area (0.50 cm²) efficiency of 4.4% (V_oc=309 mV, J_sc=28.0 mA/cm², and FF=0.509) without light soaking.     

Growth condition related orientation transition for YBa2Cu3O7−δ films on NdGaO3 substrate

For comprehensive understanding, the crystallographic out-of-plane axis transition for YBa₂Cu₃O_7?δ (YBCO or Y123) films grown on (110) NdGaO₃ (NGO) substrate, using liquid phase epitaxy (LPE), was systematically investigated via changing flux composition, processing temperature and oxygen partial pressure. It is found that LPE films could grow, remarkably, in a wide temperature range between 24 K above and 25 K below the peritectic temperature (T_p). The unpredicted c-oriented films formed at the temperatures above T_p, is deduced to be attributed to the etch-back behavior, i.e., Nd partially dissolved from the NGO substrate into solution, which leads to a locally high supersaturation for facilitating film growth. Even more distinctively, decreasing from the high temperature in this wide range, the YBCO films characteristically experienced the orientation transitions, the double transition of the c-axis oriented→a/c-axis mixed→c-axis oriented in air, and a single evolution of the c-axis→a-axis in the pure oxygen atmosphere. By combining supersaturation with the NGO etch-back, and solute diffusion, the transition origin of the film orientation in various temperature regions was clarified.     

Hydrothermal synthesis of BaTiO3 thin films on nanoporous TiO2 covered Ti substrates

It is well known that there is an upper limit (<0.25 μm) for the thickness of hydrothermal thin films grown on Ti substrate in the 100–200 °C temperature range, even the reaction time is extended to several weeks. In this paper, BaTiO₃ thin films have been firstly hydrothermally synthesized on titanium substrates covered with a nanoporous TiO₂ layer. By using TiO₂ covered substrates, the thickness of BaTiO₃ films can easily reach ∼1.0 μm at 110 °C after only 2 h hydrothermal treatment. It is found that the large quantity of pores with size at the tens of nanometer range in the oxide layer served as easy paths for the diffusion of Ba²⁺ and OH⁻ and enabled the film grow thicker. SEM and XRD results show that the films are crack-free and in polycrystalline phase.     

Flux's influence on the luminescent properties of europium and dysprosium codoped melilite long afterglow phosphor

The europium (Eu^2 +) and dysprosium (Dy^3 +) codoped melilite (Sr₂MgSi₂O₇) long afterglow phosphors are synthesized with H₃BO₃ and Li₂CO₃ fluxes, respectively. The XRD analysis demonstrates similar crystal structure and crystal size of the samples. The SEM presents a better crystallization of samples with flux, other than the one without flux. The excitation and emission spectra of the samples are similar but the decay processes of the afterglow are different. The afterglow properties are enhanced by H₃BO₃ while they are suppressed by Li₂CO₃, due to the different concentrations and depths of traps. The sample without flux has a low trap concentration because of the greater surface. Li⁺ ions reduce the concentration of Sr^2 + vacancies and then the trap depth becomes smaller. B^3 + ions break the potential balance in oxygen vacancies then the attraction to trapped electron is enhanced.     

Platinum-catalyst-assisted metalorganic vapor phase epitaxy of InN

This paper reports the first attempt of the Pt-catalyst-assisted MOVPE growth of InN. In order to enhance NH₃ decomposition at a relatively low growth temperature (～550 °C), Pt is used as a catalyst. The catalyst is installed in the NH₃ introduction tube in the MOVPE reactor and the tube is located just above the susceptor to be heated. Compared with InN films grown without the catalyst, the samples grown with Pt catalyst show improved electrical properties; a carrier concentration in the order of 10¹⁸ cm^?3 and a Hall mobility as high as 1350 cm²/Vs are obtained. The crystalline quality is also improved by employing the catalyst and a tilt fluctuation as low as 8.6 arcmin is obtained for a sample grown on a GaN/sapphire template. It is confirmed that for InN films grown at 550 °C with Pt catalyst, the electrical and crystallographic properties are also improved with increase in thickness. These results indicate that the growth at around 550 °C with the Pt catalyst is performed under the circumstances where NH₃ is effectively decomposed, whereas the deterioration of InN during growth is significantly suppressed.     

Growth and characterization of GaN and AlN films on (1 1 1) and (0 0 1) Si substrates

GaN and AlN films were grown on (1 1 1) and (0 0 1) Si substrates by separate admittances of trimethylgallium (or trimethylaluminum) and ammonia (NH₃) at 1000°C. A high temperature (HT) or low temperature (LT) grown AlN thin layer was employed as the buffer layer between HT GaN (or HT AlN) film and Si substrate. Experimental results show that HT AlN and HT GaN films grown on the HT AlN-coated Si substrates exhibit better crystalline quality than those deposited on the LT AlN-coated Si substrates. Transmission electron microscopy (TEM) of the HT GaN/HT AlN buffer layer/(1 1 1)Si samples shows a particular orientation relationship between the (0 0 0 1) planes of GaN film and the (1 1 1) planes of Si substrate. High quality HT GaN films were achieved on (1 1 1) Si substrates using a 200 Å thick HT AlN buffer layer. Room temperature photoluminescence spectra of the high quality HT GaN films show strong near band edge luminescence at 3.41 eV with an emission linewidth of ∼110 meV and weak yellow luminescence.     

Growth of pure ZnO thin films prepared by chemical spray pyrolysis on silicon

Structural, morphological, optical and electrical properties of ZnO thin films prepared by chemical spray pyrolysis from zinc acetate (Zn(CH₃COO)₂ 2H₂O) aqueous solutions, on polished Si(1 0 0), and fused silica substrates for optical characterization, have been studied in terms of deposition time and substrate temperature. The growth of the films present three regimes depending on the substrate temperature, with increasing, constant and decreasing growth rates at lower, middle, and higher-temperature ranges, respectively. Growth rate higher than 15 nm min⁻¹ can be achieved at T_s=543 K. ZnO film morphological and electrical properties have been related to these growth regimes. The films have been characterized by X-ray diffraction, scanning electron microscopy and X-ray photoelectron spectroscopy.     

Fabrication and ionic conductivity of amorphous Li–Al–Ti–P–O thin film

Li⁺ ion conducting Li–Al–Ti–P–O thin films were fabricated on ITO-glass substrates at various temperatures from 25 to 400 °C by RF magnetron sputtering method. When the substrate temperature is higher than 300 °C, severe destruction of ITO films were confirmed by XRD (X-ray diffraction) and the abrupt transformation of one semi-circle into two semi-circles on the impedance spectra. These as-deposited Li–Al–Ti–P–O solid state electrolyte thin films have an amorphous structure confirmed by XRD and a single semicircle on the impedance spectra. Good transmission higher than 80% in the visible light range of these electrolyte thin films can fulfill the demand of electro-chromic devices. Field emission scanning electron microscopy and atomic force microscopy showed the denser, smoother and more uniform film structure with the enhanced substrate temperature. Measurements of impedance spectra indicate that the gradual increased conductivity of these Li–Al–Ti–P–O thin films with the elevation of substrate temperature from room temperature to 300 °C is originated from the increase of the pre-exponential factor (σ₀). The largest Li-ion conductivity can come to 2.46 × 10^? 5 S cm^? 1. This inorganic solid lithium ion conductor film will have a potential application as an electrolyte layer in the field such as lithium batteries or all-solid-state EC devices.     

ZnO growth on Si with low-temperature ZnO buffer layers by ECR-assisted MBE

High-quality ZnO films were grown on Si(1 0 0) substrates with low-temperature (LT) ZnO buffer layers by an electron cyclotron resonance (ECR)-assisted molecular-beam epitaxy (MBE). In order to investigate the optimized buffer layer temperature, ZnO buffer layers of about 1.1 μm were grown at different growth temperatures of 350, 450 and 550 °C, followed by identical high-temperature (HT) ZnO films with the thickness of 0.7 μm at 550 °C. A ZnO buffer layer with a growth temperature of 450 °C (450 °C-buffer sample) was found to greatly enhance the crystalline quality of the top ZnO film compared to others. The root mean square (RMS) roughness (3.3 nm) of its surface is the smallest, compared to the 350 °C-buffer sample (6.7 nm), the 550 °C-buffer sample (7.4 nm), and the sample without a buffer layer (6.8 nm). X-ray diffraction (XRD), photoluminescence (PL) and Raman scattering measurements were carried out on these samples at room temperature (RT) in order to characterize the crystalline quality of ZnO films. The preferential c-axis orientations of (0 0 2) ZnO were observed in the XRD spectra. The full-width at half-maximum (FWHM) value of the 450 °C-buffer sample was the narrowest as 0.209°, which indicated that the ZnO film with a buffer layer grown at this temperature was better for the subsequent ZnO growth at elevated temperature of 550 °C. Consistent with these results, the 450 °C-buffer sample exhibits the highest intensity and the smallest FWHM (130 meV) of the ultraviolet (UV) emission at 375 nm in the PL spectrum. The ZnO characteristic peak at 438.6 cm⁻¹ was found in Raman scattering spectra for all films with buffers, which is corresponding to the E₂ mode.     

Structural features of epitaxial NiFe2O4 thin films grown on different substrates by direct liquid injection chemical vapor deposition

NiFe₂O₄ (NFO) thin films are grown on four different substrates, i.e., Lead Zinc Niobate–Lead Titanate (PZN–PT), Lead Magnesium Niobate–Lead Titanate (PMN–PT), MgAl₂O₄ (MAO) and SrTiO₃ (STO), by a direct liquid injection chemical vapor deposition technique (DLI-CVD) under optimum growth conditions where relatively high growth rate (～20 nm/min), smooth surface morphology and high saturation magnetization values in the range of 260–290 emu/ cm³ are obtained. The NFO films with correct stoichiometry (Ni:Fe=1:2) grow epitaxially on all four substrates, as confirmed by energy dispersive X-ray spectroscopy, transmission electron microscopy and x-ray diffraction. While the films on PMN–PT and PZN–PT substrates are partially strained, essentially complete strain relaxation occurs for films grown on MAO and STO. The formations of threading dislocations along with dark diffused contrast areas related to antiphase domains having a different cation ordering are observed on all four substrates. These crystal defects are correlated with lattice mismatch between the film and substrate and result in changes in magnetic properties of the films. Atomic resolution HAADF imaging and EDX line profiles show formation of a sharp interface between the film and the substrate with no inter-diffusion of Pb or other elements across the interface. Antiphase domains are observed to originate at the film–substrate interface.     

Preparation of thick,crack-free germanosilicate glass films by polyvinylpyrrolidone and study of the UV-bleachable absorption band

With addition of polyvinylpyrrolidone (PVP) transparent, stable GeO₂–SiO₂ sols containing up to 60–80 mol% GeO₂ were synthesized using tetraethyl orthogermanate (TEOG) and tetraethylorthosilicate (TEOS) as precursors for germania and silica, respectively. It was shown by TEM analyses that the PVP can be absorbed onto the colloidal particles providing steric hindrance for the combination and aggregation of particles. These sols were observed showing rapid increase in viscosity within both the early period and the end period of sol aging time, but exhibiting a viscosity value of about 28 mPa s within the rest aging time (45–90 h) satisfying well the requirements for the deposition of thick films by cycles of dip-coating operation. It was determined by TG-DTA and SEM analyses that the densification of GeO₂–SiO₂ gel material with PVP was much more retarded than the gel without PVP resulting in crack-free germansilicate films with a thickness of 3 μm. The crystallization behavior of germansilicate films was enhanced with the increase of GeO₂ content but glass films with a composition of 60GeO₂ · 40SiO₂ was obtained by sintered at 700 °C for 1 h and annealed at 550 °C under a flowing H₂/N₂ atmosphere for 2 h. FT-IR analyse showed that the heat treatment at 700 °C for 60 min was effective to remove the organics and hydroxyl groups in the germansilicate film. An intense 5 eV absorption band was distinctly observed in films. The intensity of this absorption band was found to be effectively bleached by UV illumination. Weak photoluminescence emission bands which originated from the neutral oxygen di-vacancy (NODV) were detected near 375 and 276 nm. Therefore, the 5 eV absorption band observed in this work was mainly caused by the neutral oxygen monovacancy (NOMV). A saturated absorptivity change of the UV-bleachable band after prolonged illumination was found to be 256 cm⁻¹ for the 60GeO₂ · 40SiO₂ films implying the NOMV concentration in the films reached about 3.8 × 10¹⁸ cm⁻³.     

Transparent thin film transistors based on indium oxide semiconductor

Indium oxide films were deposited by radio-frequency plasma enhanced reactive thermal evaporation (rf-PERTE). The combined use of rf power and oxygen pressure allowed the control of the crystallite size in the film, changing the optical and electrical properties. The films obtained have electrical resistivity ranging from 13.7 to 1.7 × 10⁷ Ω cm. Transparent TFTs made with those films as semiconducting and conducting layers, respectively, present threshold voltages near 2 V and on/off ratios of 10⁴.     

Fabrication and characterization of transparent conductive ZnO:Al thin films prepared by direct current magnetron sputtering with highly conductive ZnO(ZnAl2O4) ceramic target

Using a highly conductive ZnO(ZnAl₂O₄) ceramic target, c-axis-oriented transparent conductive ZnO:Al₂O₃ (ZAO) thin films were prepared on glass sheet substrates by direct current planar magnetron sputtering. The structural, electrical and optical properties of the films (deposited at different temperatures and annealed at 400°C in vacuum) were characterized with several techniques. The experimental results show that the electrical resistivity of films deposited at 320°C is 2.67×10⁻⁴ Ω cm and can be further reduced to as low as 1.5×10⁻⁴ Ω cm by annealing at 400°C for 2 h in a vacuum pressure of 10⁻⁵ Torr. ZAO thin films deposited at room temperature have flaky crystallites with an average grain size of ∼100 nm; however those deposited at 320°C have tetrahedron grains with an average grain size of ∼150 nm. By increasing the deposition temperature or the post-deposition vacuum annealing, the carrier concentration of ZAO thin films increases, and the absorption edge in the transmission spectra shifts toward the shorter wavelength side (blue shift).     

Preparation of indium tin oxide thin films without external heating for application in solar cells

Indium tin oxide (ITO) films were grown without external heating in an ambient of pure argon by RF-magnetron sputtering method. The influence of argon ambient pressure on the electro-optical properties of as-deposited ITO films was investigated. The morphology, structural and optical properties of ITO films were examined and characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), atomic force microscopy (AFM) and UV–VIS transmission spectroscopy. The deposited ITO films with a thickness of 300 nm show a high transparency between 80% and 90% in the visible spectrum and 14–120 Ω/□ sheet resistance under different conditions. The ITO films deposited in the optimum argon ambient pressure were used as transparent electrical contacts for thin film Cu(In,Ga)Se₂ (CIGS) solar cells. CIGS solar cells with efficiencies of the order of 7.0% were produced without antireflective films. The results have demonstrated that the developed ITO deposition technology has potential applications in thin film solar cells.     

Characterization of deep levels in a-plane GaN epi-layers grown using various growth techniques

To study the correlation between defects and deep levels in a-plane GaN films grown on r-plane sapphire substrates, transmission electron microscopy (TEM) and deep level transient spectroscopy (DLTS) have been performed on three types of a-plane GaN samples grown using modified two-step growth (sample I), SiN_x interlayer (sample II), and patterned insulator on sapphire substrate (sample III). From the microstructure evolution in cross-sectional TEM images, it was shown that combination of growth techniques is highly efficient in the reduction of dislocation densities. Average dislocation densities of samples I, II, and III were about 2.2×10⁹ cm^?2, 1.1×10⁹ cm^?2, and 3.4×10⁸ cm^?2, respectively. The trap a_t E_c–E_t～0.13 eV (E1) was observed in only sample I, and three electron traps at 0.28–0.33 eV (E2), 0.52–0.58 eV (E3), and 0.89–0.95 eV (E4) from the conduction band edge were measured common to all the samples. The analysis of trap properties indicated that E2 and E3 trap levels are strongly associated with the partial dislocations in a-plane GaN films.     

Evaluation of structural and mechanical properties of aluminum oxide thin films deposited by a sol–gel process: Comparison of microwave to conventional anneal

Thin films of Al₂O₃ have been deposited on polished silica glass substrates at room temperature by sol–gel dip coating technique followed by two different exposure methods. One set was annealed at different temperatures ranging from 200 °C to 800 °C for 10 h and a second set was exposed to microwave (2.45 MHz) radiation at different powers for 10 min. The lower temperature and shorter time with microwave irradiation might be ascribed to the activating and facilitating effect of microwaves on solid phase diffusion. Unlike other preparation methods, microwave heating is generally quite faster, and energy efficient. X-ray diffraction (XRD) and scanning electron microscopy (SEM), energy dispersive X-ray analysis techniques have been employed to characterize structural, morphological and elemental compositions of the films. Adhesion strength failure measurements on films performed by scratch test in progressive loading sequence have shown critical loads up to 25 N (partial perforation) for both annealed films and films exposed to microwave irradiation. Nanohardness indentation tests of the films exposed (800 W) to microwave have shown hardness of 8.3 GPa with elastic modulus of 120 GPa compared to the conventional annealed film (800°) of 4.5 GPa with elastic modulus of 90 GPa.     

Incipient amorphous-to-crystalline transition in HfO2 as a function of thickness scaling and anneal temperature

A series of 1.4, 1.8, and 4.0 nm thick HfO₂ films deposited on Si(1 0 0) substrates have been measured by extended X-ray absorption fine-structure prior to anneal processing, following a standard post deposition anneal of 700 °C for 60 s in NH₃ ambient, and following an additional rapid thermal anneal cycle of 1000 °C for 10 s in N₂ ambient. Analysis of the second coordination shell gives clear evidence of increased ordering with increasing film thickness at each temperature. Similarly, increased ordering with increasing anneal temperature is evident for each film thickness. Although X-ray diffraction and high resolution transmission electron microscopy indicated the 1.4 nm HfO₂ samples to be amorphous, EXAFS has distinguished nanocrystalline from amorphous states for these films.