A fractional differential constitutive model for dynamic stress intensity factors of an anti-plane crack in viscoelastic materials

Fractional differential constitutive relationships are introduced to depict the history of dynamic stress inten- sity factors （DSIFs） for a semi-infinite crack in infinite viscoelastic material subjected to anti-plane shear impact load. The basic equations which govern the anti-plane deformation behavior are converted to a fractional wave-like equation. By utilizing Laplace and Fourier integral transforms, the fractional wave-like equation is cast into an ordinary differential equation （ODE）. The unknown function in the solution of ODE is obtained by applying Fourier transform directly to the boundary conditions of fractional wave-like equation in Laplace domain instead of solving dual integral equations. Analytical solutions of DSIFs in Laplace domain are derived by Wiener-Hopf technique and the numerical solutions of DSIFs in time domain are obtained by Talbot algorithm. The effects of four parameters α, β, b1, b2 of the fractional dif- ferential constitutive model on DSIFs are discussed. The numerical results show that the present fractional differential constitutive model can well describe the behavior of DSIFs of anti-plane fracture in viscoelastic materials, and the model is also compatible with solutions of DSIFs of anti-plane fracture in elastic materials.     

Dynamic investigation of a functionally graded layered structure with a crack crossing the interface

The dynamic response of a functionally graded layered structure with a crack crossing the interface is analyzed. The in-plane impact loading condition is considered. By using the Laplace and Fourier integral transforms, singular integral equation method and residue theory, the present problem is reduced to a singular integral equation in the Laplace transform domain. The influences of Young’s modulus ratio, thickness ratio, and crack length and location on the dynamic stress intensity factors (DSIFs) are investigated. Particularly, the DSIFs corresponding to different crack locations are shown in the case when the crack center moves from one layer to another layer through the interface. The peak and static values and overshoot characteristics of the DSIFs are analyzed. It is found that these values typically exhibit kinking behavior when the crack tips arrive at the interface. This study is different from previous other investigations in the following respects: (1) the dynamic response of a crack crossing the interface of a functionally graded structure is studied analytically, which has hardly been done in the past and (2) the present model can be reduced to some important problems, such as a functionally graded coating-substrate structure with a crack in the graded coating or homogeneous substrate or one intersecting the interface.     

Transient dynamic fracture analysis by an extended meshfree method with different crack-tip enrichments

Investigation of transient dynamic stress intensity factors (DSIFs) of two-dimensional fracture problems of isotropic solids and orthotropic composites by an extended meshfree method is described. We adopt the recently developed extended meshfree radial point interpolation method (X-RPIM), which combines either the standard branch functions or the new linear ramp function associated with Heaviside functions to capture crack-tip behaviors. It is the first time the linear ramp function integrating into meshfree X-RPIM has been presented in a dynamical fracture context. We are particularly interested in exploring insight into the behaviors of DSIFs under dynamic impact loadings (e.g., step, blast and sine loading types) using our meshfree method. For some of these problems numerical examples have been performed using the new ramp functions, and the obtained results of DSIFs have also been compared with those using the standard enrichment functions under which the two schemes have the same setting. In each case it is found that the numerical solutions delivered using the X-RPIM associated with the ramp enrichments are in good agreement with those with the standard functions. The paper first describes formulations and then provides verification of our developed approach through a series of numerical examples in transient dynamic fracture for both solids and orthotropic composites. Illustration of scattered elastic stress waves propagating in the cracked body is depicted to take an insight look at the behavior of dynamic response.     

Effects of electric/magnetic impact on the transient fracture of interface crack in piezoelectric-piezomagnetic sandwich structure: anti-plane case

Due to the incompatibility of the interlaminar deformations,the interface debonding or cracking usually happens in a layered magnetoelectric(ME)structure under an applied load.In this paper,the transient responses of the anti-plane interface cracks in piezoelectric(PE)-piezomagnetic(PM)sandwich structures are studied by the standard methods of the integral transform and singular integral equation.Discussion on the numerical examples indicates that the PE-PM-PE structure under electric impact is more likely to fracture than the PM-PE-PM structure under a magnetic impact.The dynamic stress intensity factors(DSIFs)are more sensitive to the variation of the active layer thickness.The effects of the material constants on the DSIFs are dependent on the roles played by PE and PM media during the deformation process.     

The transient fracture behavior for a functionally graded layered structure subjected to an in-plane impact load

The transient fracture behavior of a functionally graded layered structure subjected to an in-plane impact load is investigated. The studied structure is composed of two homogeneous layers and a functionally graded interlayer with a crack perpendicular to the boundaries. The impact load is applied on the face of the crack. Fourier transform and Laplace transform methods are used to formulate the present problem in terms of a singular integral equation in Laplace transform domain. Considering variations of parameters such as the nonhomogeneity constant, the thickness ratio and the crack length, the dynamic stress intensity factors (DSIFs) in time domain are studied and some meaningful conclusions are obtained.The project supported by the National Science Foundation for Excellent Young Investigators (10325208), the National Natural Science Foundation of China (10432030) and the China Postdoctoral Science Foundation (2004036018)The English text was polished by Ron Marshall.     

动载下裂纹应力强度因子计算的改进型扩展有限元法

相较于常规扩展有限元法(extended finite element method, XFEM), 改进型扩展有限元法(improved XFEM) 解决了现有方法线性相关与总体刚度矩阵高度病态问题, 在数量级上提升了总体方程的求解效率, 克服了现有方法在动力学问题中的能量正确传递、动态应力强度因子数值震荡、精度低下问题. 本文基于改进型XFEM, 采用Newmark 隐式时间积分算法, 重点研究了动载荷作用下扩展裂纹尖端应力强度因子的求解方法, 与静力学方法相比, 增加了裂纹扩展速度项与惯性项的贡献. 通过数值算例研究了网格单元尺寸、质量矩阵、时间步长、裂尖加强区域、惯性项、扩展速度项及相互作用积分区域J-domain的网格与单元尺寸对动态应力强度因子求解精度的影响, 验证了改进型XFEM计算动态裂纹应力强度因子方法的有效性. 针对文献中具有挑战性的 "I 型半无限长裂纹先稳定后扩展"问题, 改进型XFEM给出目前为止精度最好的动态应力强度因子数值解.      

Symmetric-Galerkin boundary element analysis of the dynamic T-stress for the interaction of a crack with an auxetic inclusion

In this work, the symmetric-Galerkin boundary element method (SGBEM) for 2-D elastodynamics in the Laplace-space frequency domain (Laplace domain) is employed to study the dynamic stress intensity factors (DSIFs) and the dynamic T-stress (DTS) during the interaction between a crack and an auxetic inclusion under impact loading conditions. It is found that, while the auxeticity has virtually no effect on the DSIFs, its influence on the DTS is noticeable. This finding is particularly important as it implies the imperative need of fracture criteria based on both the DSIFs and DTS for predicting crack growth in composite materials with auxetic phases.     

Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts

Using the integral transform and the Cauchy singular integral equation methods, the problem of an interface crack between two dissimilar piezoelectric layers under mechanical impacts is investigated under the permeable electrical boundary condition on the crack surface. The dynamic stress intensity factors (DSIFs) of both mode-I and II are determined. The effects of the crack configuration and the combinations of the constitutive parameters of the piezoelectric materials on the dynamic response are examined. The numerical calculation of the mode-I plane problem indicates that the DSIFs may be retarded or accelerated by specifying different combinations of material parameters. In addition, the parameters of the crack configuration, including the ratio of the crack length to the layer width and the ratio between the widths of two layers, exert a considerable influence on the DSIFs. The results seem useful for design of the piezoelectric structures and devices of high performance.     

Theoretical modeling and analysis of thermal fracture of semi-infinite functionally graded materials with edge cracks

The present investigation is devoted to a problem of the interaction of two edge cracks inclined arbitrary to the boundary of a non-homogeneous half-plane, which is a functionally graded layer on a homogeneous substrate. The functionally graded properties vary exponentially in thickness direction. One cycle of cooling from sintering temperature is considered. An approach based on integral equations is used and a solution is obtained, then the stress intensity factors are calculated and direction of the initial crack propagation is evaluated by using the maximum circumferential stress criterion. Influence of geometrical and material (inhomogeneity) parameters on the fracture characteristics is investigated. This study can serve as a part of the modeling of the fracture process in FGM coatings under cyclic heating–cooling thermal loading.     

Dynamic stress intensity factors of two 3D rectangular cracks in a transversely isotropic elastic material under a time-harmonic elastic P-wave

The dynamic stress intensity factors (DSIFs) of two 3D rectangular cracks in a transversely isotropic elastic material under an incident harmonic stress wave are investigated by generalized Almansi’s theorem and the Schmidt method in the present paper. Using 2D Fourier transform and defining the jumps of displacement components across the crack surface as the unknown functions, three pairs of dual integral equations are derived. To solve the dual integral equations, the jumps of the displacement components across the crack surfaces are expanded in a series of Jacobi polynomials. Numerical examples are provided to show the effects of the geometric shape of the rectangular crack, the characteristics of the harmonic wave and the distance between two rectangular cracks on the DSIFs of the transversely isotropic elastic material.     

Angle cracks in two bonded functionally graded piezoelectric material under anti-plane shear

Consider two bonded functionally graded piezoelectric material (FGPM) with finite height. Each material contains an arbitrary oriented crack. The material properties are assumed in exponential forms in the direction normal to the interface. The crack surface condition is assumed to be electrically impermeable or permeable. Using the Fourier transform technique, the problem can be reduced to a system of singular integral equations, which are then solved numerically by applying the Gauss-Chebyshev integration formula to obtain the stress intensity factors at the crack tips. Numerical calculations are carried out to obtain the energy density factor S and the energy release rate G. In impermeable case, the energy release rate has been shown to be negative as the electric loads are applied. The positive definite characteristic of the energy density factor makes it possible for predicting the fracture behavior of the cracked structure. The influences of the non-homogeneous parameters and crack orientation on the energy density factors at the crack tips are discussed in detail. The results show that the energy density factor at the crack tip will be increased when the crack tip is located within the softer material.     

HIA: A Hybrid Integral Approach to model incompressible isotropic hyperelastic materials – Part 2: Finite element analysis

The present paper is devoted to the modeling of finite deformations of hyperelastic bodies by using the Hybrid Integral Approach (HIA) model introduced by the Authors. This model combines the affine behavior of chains included in the molecular 8-chains density, the interleaving constraint part and an original phenomenological integral density which allows to balance the mismatch between model and experimental data. A total Lagrangian formulation is adopted to describe the geometrical and material non-linearities and a finite element implementation is performed in the FER software. Four test examples, including homogeneous and non-homogeneous deformations, as well as complex computation involving dynamic contact and impact are proposed to show the applicability of the developed approach and the efficiency of the model.     

Thermally induced fracture of a smart functionally graded composite structure

Discussed is the fracture behavior of a cracked smart actuator on a substrate under thermal load. The actuator is made of piezoelectric material with functionally graded material (FGM) properties. Integral transform method is used to reduce the problem to the solution of a set of singular integral equations and is solved numerically. This paper is completed by including graphical plots of the thermal flow, stress and electric displacement intensity factors around the crack for different crack positions and material gradients. Directions of crack initiation are also predicted by using the energy density criterion.     

Dynamic interaction between a sub-interface crack and the interface in a bi-material: time-domain BEM analysis

Summary Transient response of a sub-interface crack in a bi-material is studied with emphasis on the dynamic interaction between the crack and the interface, by combining the traditional time-domain displacement boundary element method (BEM) and the non-hypersingular traction BEM. Computations are performed for an unbounded bi-material with a crack subjected to impact tensile loading on its faces or incident impact waves and a bounded rectangular bi-material plate under remote impact tensile loading. Numerical results of the dynamic stress intensity factors (DSIFs) and dynamic interface tractions are presented for various material combinations and crack locations. It is shown that pronounced increases in DSIFs and the interface tractions may be caused in some cases because of the dynamic interaction between the crack and the interface.This work was initialized during the second author's stay at Institute of Mechanics, TU Darmstadt, Germany under the support of the Alexander von Humboldt Foundation. Discussion on the BEM formulation with Dr. Seelig is gratefully acknowledged. The first two authors are also grateful for the partial support by the China National Natural Science Foundation under Grant No. 10025211 and the NJTU Scientific Paper Fund (PD195).     

CRACK PROPAGATING IN FUNCTIONALLY GRADED COATING WITH ARBITRARILY DISTRIBUTED MATERIAL PROPERTIES BONDED TO HOMOGENEOUS SUBSTRATE

In this paper, a finite crack with constant length （Yoffe type crack） propagating in a functionally graded coating with spatially varying elastic properties bonded to a homogeneous substrate of finite thickness under anti-plane loading was studied. A multi-layered model is employed to model arbitrary variations of material properties based on two linearly-distributed material compliance parameters. The mixed boundary problem is reduced to a system of singular integral equations that are solved numerically. Some numerical examples are given to demonstrate the accuracy, efficiency and versatility of the model. The numerical results show that the graded parameters, the thicknesses of the interfacial layer and the two homogeneous layers, the crack size and speed have significant effects on the dynamic fracture behavior.     

Dynamic behavior of unequal parallel permeable interface multi-cracks in a piezoelectric layer bonded to two piezoelectric materials half planes

This study is concerned with the treatment of the dynamic behavior of interacting cracks in a piezoelectric layer bonded to two dissimilar piezoelectric half planes subjected to harmonic anti-plane shear waves. The permeable electric boundary condition is considered. By use of the Fourier transform technique, the problem can be solved with the help of two pairs of dual integral equations in which the unknown variables are the jumps of the displacements across the crack surfaces. To solve the dual integral equations, the jumps of the displacements across the crack surfaces are expanded in two series of Jacobi polynomials. The electromechanical behavior of two pairs of unequal parallel cracks was determined. Numerical examples are provided to show the effects of the geometry of the cracks, the frequency of the incident waves and materials properties upon the dynamic stress intensity factors (DSIFs) and the electric displacement intensity factors.     

Elastodynamic solution of a non-homogeneous orthotropic hollow cylinder

A theoretical method for analyzing the axisymmetric plane strain elastodynamic problem of a non-homogeneous orthotropic hollow cylinder is developed. Firstly, a new dependent variable is introduced to rewrite the governing equation, the boundary conditions and the initial conditions. Secondly, a special function is introduced to transform the inhomogeneous boundary conditions to homogeneous ones. By virtue of the orthogonal expansion technique, the equation with respect to the time variable is derived, of which the solution can be obtained. The displacement solution is finally obtained, which can be degenerated in a rather straightforward way into the solution for a homogeneous orthotropic hollow cylinder and isotropic solid cylinder as well as that for a non-homogeneous isotropic hollow cylinder. Using the present method, integral transform can be avoided and it can be used for hollow cylinders with arbitrary thickness and subjected to arbitrary dynamic loads. Numerical results are presented for a non-homogeneous orthotropic hollow cylinder subjected to dynamic internal pressure. The project supported by the National Natural Science Foundation of China (10172075 and 10002016)     

Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate

This work deals with the mode III fracture problem of a cracked functionally graded piezoelectric surface layer bonded to a cracked functionally graded piezoelectric substrate. The cracks are normal to the interface and the electro-elastic material properties are assumed to be varied along the crack direction. Potential and flux types of boundary condition are assigned on the edge of the surface layer. The problem under the assumptions of impermeable and permeable cracks can be formulated to the standard singular integral equations, which are solved by using the Gauss–Chebyshev technique. The effects of the boundary conditions, the material properties and crack interaction on the stress and electric displacement intensity factors are discussed.     

A penny-shaped interface crack between a functionally graded piezoelectric layer and a homogeneous piezoelectric layer

The problem of a penny-shaped interface crack between a functionally graded piezoelectric layer and a homogeneous piezoelectric layer is investigated. The surfaces of the composite structure are subjected to both mechanical and electrical loads. The crack surfaces are assumed to be electrically impermeable. Integral transform method is employed to reduce the problem to a Fredholm integral equation of the second kind. The stress intensity factor, electric displacement intensity factor and energy release rate are derived, some typical numerical results are plotted graphically. The effects of electrical loads, material nonhomogeneity and crack configuration on the fracture behaviors of the cracked composite structure are analyzed in detail.     

Numerical analysis for a crack in piezoelectric material under impact

In this paper, a numerical analysis of impact interfacial fracture for a piezoelectric bimaterial is provided. Starting from the basic equilibrium equation, a dynamic electro-mechanical FEM formulation is briefly presented. Then, the path-independent separated dynamic J integral is extended to piezoelectric bimaterials. Based on the relationship of the path-independent dynamic J integral and the stress and electric displacement intensity factors, the component separation method is used to calculate the stress and electric displacement intensity factors for piezoelectric bimaterials in this finite-element analysis. The response curves of the dynamic J integral, the stress and electric displacement intensity factors are obtained for both homogeneous material (PZT-4 and CdSe) and CdSe/PZT-4 bimaterial. The influences of the piezoelectricity and the electro-mechanical coupling factor on these responses are discussed. The effects of an applied electric field are also discussed.