与两相材料界面接触的裂纹对SH波的散射

利用积分变换方法得出了两相材料中作用简谐集中力时的格林函数．根据所得的格林函数并利用Betti-Rayleigh互易定理得出了与界面接触裂纹的散射波场．裂纹的散射波场可分解为两部分，一部分为奇异的散射场，另一部分为有界的散射场．利用分解后的散射场，可得裂纹在SH波作用下的超奇异积分方程．根据裂纹散射场的奇异部分和Cauchy型奇异积分的性质得出了裂纹和界面接触点处的奇性应力指数和接触点角形域内的奇性应力．利用所得的奇性应力定义了裂纹和界面接触点处的动应力强度因子．对所得超奇异积分方程的数值求解可得裂纹端点和接解点处的应力强度因子。     

多个纵向环形界面裂纹对P波散射的动应力强度因子

研究多个纵向环形界面裂纹的Ｐ波散射问题。以裂纹面的位错密度函数为未知量,利用Ｆｏｕｒｉｅｒ积分变换,将问题归结为第二类奇异积分方程,然后通过数值求解,获得裂纹尖端的动应力强度因子。最后给出了双裂纹动应力强度因子随入射波频率变化的关系曲线。     

非均匀弹性材料中反平面的运动裂纹

用解析方法研究了非均匀弹性材料中反平面运动裂纹问题。首先采用余弦变换求解非均匀材料的基本方程，然后根据混合边值条件建立裂纹运动的对偶积分方程，再把对偶积分方程化为第二类Fredholm积分方程。给出了数值算例，计算结果表明材料的非均匀性对动应力强度因子有较大的影响。     

功能梯度材料裂纹尖端动态应力场

研究受反平面剪切作用的功能梯度材料动态裂纹问题,通过积分变换-对偶积分方程方法推出了裂纹尖端动态应力场,时间域内的动态应力强度因子由Laplace数值反演获得,研究结果表明功能梯度材料的梯度越大,相应的裂纹问题的动态应力强度因子值越低。     

平面波对有部分脱胶衬砌的圆形孔洞的散射

将波函数展开法与奇异积分方程技术相结合研究了平面波对有部分脱胶衬砌的圆形孔洞的散射。将脱离区看作弧形裂纹并忽略裂纹表面的相互作用。将衬砌和基体中的波场展开成Fou-rier-Bessel级数,利用混合边界条件得到一组对偶级数方程组并进一步转化成Hilbert奇异积分方程。数值求解给出了脱离区大小和衬砌厚度对动应力强度因子(DSIF)和散射截面(SCS)的影响。结果显示由于脱胶,动应力强度因子和散射截面呈现明显的低频共振特性。     

折线型裂纹对SH波的动力响应

利用Fourier积分变换方法,得出了无限平面中用裂纹位错密度函数表示的单裂纹散射场．根据无穷积分的性质,把单裂纹的散射场分解为奇异部分和有界部分．利用单裂纹的散射场建立了折线裂纹在SH波作用下的Cauchy型奇异积分方程．根据折线裂纹散射场和所得的积分方程讨论了裂纹在折点处的奇性应力及折点处的奇性应力指数．利用所得的奇性应力定义了折点处的应力强度因子．对所得Cauchy型奇积分方程的数值求解,可得裂纹端点和折点处的动应力强度因子。     

黏弹性材料界面裂纹应力场奇性分析

研究两半无限大黏弹性体间Griffith界面裂纹在简谐载荷作用下裂纹尖端动应力场的奇异特性.通过引入裂纹张开位移和裂纹位错密度函数,相应的混合边值问题归结为一组耦合的奇异积分方程.渐近分析表明裂尖动应力场的奇异特征完全包含在奇异积分方程的基本解中.通过对基本解的深入分析发现黏弹性材料界面裂纹裂尖动应力场具有与材料参数和外载荷频率相关的振荡奇异特性.以标准线性固体黏弹材料为例讨论了材料参数和载荷频率对奇性指数和振荡指数的影响.     

粘弹性胶层中Ⅰ型裂纹的动态扩展

研究粘弹性胶层中Griffith裂纹在Ⅰ型载荷作用下,裂纹尖端动态应力强度因子和能量释放率的时间响应.首先,利用积分变换方法,推导出粘弹性层的控制方程组;其次,引入位错密度函数,并结合边界条件和界面连接条件,导出反映裂纹尖端奇异性的Cauchy型奇异积分方程组,然后,应用Chebyshev正交多项式化奇异积分方程组为代数方程组,并采用Schmidt方法对其数值求解,最后,经过Laplace逆变换,求得动态应力强度因子和能量释放率的时间响应.通过对材料参数的讨论,得到动应力强度因子和能量释放率随剪切松驰参量的减小而增大,随膨胀松弛参量的减小而减小,弹性参数对其影响较小.     

三维动态裂纹问题的超奇异积分方程法

基于弹性材料的动态基本方程，结合广义Betti-Rayleigh互易等式与时域下的边界积分方程，推导得到时域下的超奇异积分方程组。引入Laplace域下的动态基本解，将经过主部分析的积分核函数分解为静态和动态部分，其中动态积分核不具有奇异性。在裂纹前沿附近单元，采用与理论分析一致的平方根位移模型。结合Lubich时间卷积实现拉氏变换，采用配置点法计算超奇异积分，获得问题的数值解。并针对椭圆裂纹算例编写Fortran程序，得到冲击荷载作用下张开型裂纹的动态应力强度因子变化规律，数值结果稳定且收敛速度快。     

压电压磁复合材料中裂纹对反平面简谐弹性波的散射问题

分析了压电压磁复合材料中裂纹对反平面简谐弹性波的散射问题。利用傅立叶变换,使问题的求解转换为对一对以裂纹表面上的位移差为未知变量的对偶积分方程的求解。为了求解对偶积分方程,把裂纹面上的位移差展开为雅可比多项式形式,进而得到了裂纹长度、入射波波速及入射波频率对裂纹应力强度因子的影响。从数值结果可以看出,压电压磁复合材料中可导通裂纹的反平面问题的动应力奇异性与一般弹性材料中的反平面断裂问题动应力奇异性相同。     

The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.     

The scattering of general SH plane wave by interface crack between two dissimilar viscoelastic bodies

The scattering of general SH plane wave by an interface crack between two dissimilar viscoelastic bodies is studied and the dynamic stress intensity factor at the crack-tip is computed. The scattering problem can be decomposed into two problems: one is the reflection and refraction problem of general SH plane waves at perfect interface (with no crack); another is the scattering problem due to the existence of crack. For the first problem, the viscoelastic wave equation, displacement and stress continuity conditions across the interface are used to obtain the shear stress distribution at the interface. For the second problem, the integral transformation method is used to reduce the scattering problem into dual integral equations. Then, the dual integral equations are transformed into the Cauchy singular integral equation of first kind by introduction of the crack dislocation density function. Finally, the singular integral equation is solved by Kurtz's piecewise continuous function method. As a consequence, the crack opening displacement and dynamic stress intensity factor are obtained. At the end of the paper, a numerical example is given. The effects of incident angle, incident frequency and viscoelastic material parameters are analyzed. It is found that there is a frequency region for viscoelastic material within which the viscoelastic effects cannot be ignored. This work was supported by the National Natural Science Foundation of China (No.19772064) and by the project of CAS KJ 951-1-20     

Dynamic fracture analysis of adhesive bonded material under normal loading

Dynamic fracture behavior of a Griffith crack along the interface of an adhesive bonded material under normal loading is studied. The singular integral equations are obtained by employing integral transformation and introducing dislocation density functions. By adopting Gauss-Jacobi integration formula, the problem is reduced to the solution of algebraic equations, and by collocation dots method. their solutions can be obtained Based on the parametric discussions presented in the paper, the following conclusions can be drawn： （1） Mode I dynamic stress intensity factor （DSIF） increases with increasing initial crack length and decreasing visco-elastic layer thickness, revealing distinct size effect; （2） The influence of the visco-elastic adhesive relaxation time on the DSIF should not be ignored.     

功能梯度夹层多个环形界面裂纹扭转冲击

研究位于功能梯度层和外部均匀材料之间多个环形界面裂纹的扭转冲击问题,功能梯度材料 (FGM)粘结在两种不同的弹性材料之间，功能梯度层和外部材料之间环形界面裂纹的数目是任意的．引进积分变换和位错密度函数将问题化为求解Laplace域里标准的Cauchy奇异积分方程，进而化为求解代数方程；应用Laplace数值反演技术，计算时域里的动应力强度因子(DSIF)．考查了结构几何尺度和材料特性对裂尖动态断裂特性的影响．数值结果表明，DSIF存在一个主峰，到达主峰后，在其相应的静态值附近波动并最终趋于稳定；增加FGM的梯度能减小DSIF的峰值．     

Dynamic stress intensity factors of two collinear mode-III cracks perpendicular to and on the two sides of a bi-FGM weak-discontinuous interface

The mechanical model was established for the anti-plane dynamic fracture problem for two collinear cracks on the two sides of and perpendicular to a weak-discontinuous interface between two materials with smoothly graded elastic properties, as opposed to a sharp interface with discontinuously changing elastic properties. The problem was reduced as a system of Cauchy singular integral equations of the first kind by Laplace and Fourier integral transforms. The integral equations were solved by Erdogan's collocation method and the dynamic stress intensity factors in the time domain were obtained through Laplace numerical inversion proposed by Miller and Guy. The influences of geometrical and physical parameters on the dynamic stress intensity factors were illustrated and discussed, based on which some conclusions were drawn: (a) to increase the thickness of the FGM strip on either side of the interface will be beneficial to reducing the DSIF of a crack perpendicular to a bi-FGM interface and embedded at the center of one of the FGM strips; (b) To increase the rigidity of the FGM strip where the crack is located will increase the DSIF. However, when the material in one side of the interface is more rigid, the DSIF of the interface-perpendicular embedded crack in the other side will be reduced; (c) To decrease the weak-discontinuity of a bi-FGM interface will not necessarily reduce the stress intensity factor of a crack perpendicular to it, which is different from the case of interfacial crack; (d) For two collinear cracks with equal half-length, when the distance between the two inner tips is less than about three times of the half-length, the interaction of them is intensified, however, when the distance is greater than this the interaction becomes weak.     

Moving interfacial crack between piezoelectric ceramic and elastic layers

An analysis is performed for the problem of a finite Griffith crack moving with constant velocity along the interface of a two-layered strip composed of a piezoelectric ceramic and an elastic layers. The combined out-of-plane mechanical and in-plane electrical loads are applied to the strip. Fourier transforms are used to reduce the problem to a pair of dual integral equations, which is then expressed in terms of a Fredholm integral equation of the second kind. The dynamic stress intensity factor(DSIF) is determined, and numerical results show that DSIF depends on the crack length, the ratio of stiffness and thickness, and the magnitude and direction of electrical loads as well as the crack speed. In case that the crack moves along the interface of piezoelectric and elastic half planes, DSIF is independent of the crack speed.     

Antiplane mechanical and inplane electric time-dependent load applied to two coplanar cracks in piezoelectric ceramic material

This work is concerned with the dynamic response of two coplanar cracks in a piezoelectric ceramic under antiplane mechanical and inplane electric time-dependent load. The cracks are assumed to act either as an insulator or as a conductor. Laplace and Fourier transforms are used to reduce the mixed boundary value problems to Cauchy-type singular integral equations in Laplace transform domain. A numerical Laplace inversion algorithm is used to determine the dynamic stress and electric displacement factors that depend on time and geometry. A normalized equivalent parameter describing the ratio of the equivalent magnitude of electric load to that of mechanical load is introduced in the numerical computation of the dynamic stress intensity factor (DSIF) which has a similar trend as that for the pure elastic material. The results show that the dynamic electric field will impede or enhance crack propagation in a piezoelectric ceramic material at different stages of the dynamic electromechanical load. Moreover, the electromechanical response is greatly affected by the ratio of the crack length to the ligament between the cracks. The stress and electric displacement intensity factor can be combined by the energy density factor or function to address the fracture of piezoelectric materials under the combined influence of electromechanical loading.     

Fracture analysis on a piezoelectric sensor with a viscoelastic interface

Fracture analysis is performed on a layered piezoelectric sensor possessing a Kelvin-type viscoelastic interface. An electrically permeable anti-plane crack is situated in the piezoelectric layer and perpendicular to the interface. The crack problem is solved by the methods of integral transform and Cauchy singular integral equation. The variations of the dynamic stress intensity factor (DSIF) vs. physical and geometrical parameters are investigated. At the beginning of creep and relaxation, larger viscosity coefficient always induces smaller DSIF. With time elapsing, the effect of viscosity coefficient becomes weaker and weaker. When time approaches infinity, the viscous effect disappears, and the DSIF converges to a value corresponding to the case of an elastic interface. The effect of the viscoelastic interface on the fracture behavior of the piezoelectric layer also depends on the substrate thickness. To some extent, thicker substrate may intensify the effect of the interface.