铁电陶瓷电致疲劳失效的研究进展

铁电陶瓷是具备力电转换功能的典型高技术材料.本文概述铁电陶瓷电致疲劳失效的 研究进展.首先介绍电致疲劳的定义和特点,然后讨论电致疲劳失效在不同尺度下的表现行 为,包括宏观尺度下裂纹的疲劳扩展;细观尺度下裂纹的萌生;微观尺度下点缺陷在循环电 场下的积聚.随即阐述了铁电陶瓷在循环电场下缺陷汇聚的理论分析,运用微结构演化方法 计算了单个孔洞随畴界的移动距离,推导了循环电场下铁电陶瓷内点缺陷浓度的演 化方程,给出了点缺陷浓度与其汇聚程度之间的定量关系,从而提出了贯通不同尺度的铁电陶瓷电致 疲劳失效机理.     

微焊点电致损伤与断裂的实验及数值研究

本文制作了微焊点试件,并通过施加较大的电载荷使其发生了电迁移。对微焊点在电迁移过程中的微观组织形貌及其演化进行了观察。结果发现,高温和常温条件下的电致失效模式都是阴极处的界面断裂,但是低温条件下的迁移试件会在阳极处形成凸丘,而高温下则没有。此外,本文还测试了微焊点在电迁移过程中的电阻、温度场以及塑性变形,以期找到微焊点电致损伤的表征方法。实验表明,红外方法可以快速准确地发现焊点表面和内部的缺陷,而电阻值对微焊点的电致损伤并不敏感。最后本文采用有限元方法分析了微焊点的电致应力及空位浓度,较好地解释了微焊点电致失效的机制。     

铁电材料的疲劳失效行为

在航空航天、核能发电等重大装备技术领域, 作为高温传感/驱动/能量收集器件的敏感材料——铋层状结构铁电(BLSF)陶瓷在复杂载荷环境下的疲劳失效问题严重限制着器件寿命和可靠性的提高. 本文以BLSF陶瓷的应用需求为背景, 围绕铁电材料的疲劳裂纹扩展与电畴极化翻转及其相互作用机制等关键问题, 综述了铁电材料在热、力、电三种载荷及其耦合作用下疲劳失效行为的研究现状, 并根据当前铁电材料的一些新发展、新应用对其未来研究方向进行了展望, 旨在为高性能、长寿命铁电/压电器件设计提供参考.      

铁电陶瓷PZT53复杂力电耦合行为的实验研究

通过实验研究了平行和垂直于极化方向的正应力对铁电陶瓷锆钛酸铅(PZT53)的电滞回线(E3-P3)和电致应变曲线(E-ε)的影响. 实验发现平行于极化方向的压应力对PZT53陶瓷的电滞回线、电致应变曲线形状以及矫顽场大小都有明显的影响，但是垂直于极化方向的拉、压应力只对PZT53陶瓷的电致应变曲线形状有明显的影响，但对电滞回线形状和矫顽场大小都没有显著影响. 采用畴翻转的模型详细解释了观察到的实验现象，所得结果为建立铁电陶瓷的多轴力、电耦合本构模型，提供了物理基础.     

第十届全国疲劳与断裂学术会议征文通知

由中国力学学会、中国机械工程学会、中国金属学会、中国材料研究会和中国航空学会联合举办的“第十届全国疲劳与断裂学术会议”将于２０００年１２月在广州召开．本届会议由中国力学学会主办．现将有关征文事项通知如下：１征文内容： （１）疲劳领域 循环形变与疲劳断裂的晶体学；新型材料（包括陶瓷、复合材料、金属间化合物、纳米材料等）的循环形变与疲劳断裂；疲劳损伤、寿命估算和疲劳设计；非金属材料（包括工程塑料、生物材料、建筑材料等）的疲劳断裂行为；载荷谱和载荷下的疲劳；环境疲劳；疲劳实验方法和设备；疲劳和断裂的失效…     

介电弹性材料的机电耦合性能研究

作为一种新型的电活性聚合物,介电弹性材料可被用作柔性致动器。其中材料的介电性能和机械性能是影响其机电耦合致动性能的关键因素。通过实验方法研究了一种典型的介电弹性材料VHB4910在不同温度和频率下的介电常数和弹性模量,基于实验结果分析了该材料的机电耦合性能。结果表明:依赖于频率和温度的弹性模量是影响该介电弹性材料致动变形的主要因素,对致动性能的影响最大可达4个数量级,材料的介电常数对其致动性能的影响相对较小。     

多物理场下FCBGA焊点电迁移失效预测的数值模拟研究

随着微电子封装技术的快速发展, 焊点的电迁移失效问题日益受到关注. 基于有限元法并结合子模型技术对倒装芯片球栅阵列封装(flip chip ball grid array, FCBGA)进行电-热-结构多物理场耦合分析, 详细介绍了封装模型的简化处理方法, 重点分析了易失效关键焊点的电流密度分布、温度分布和应力分布, 发现电子流入口处易产生电流拥挤效应, 而整个焊点的温度梯度较小. 基于综合考虑“电子风力”、温度梯度、应力梯度和原子密度梯度四种电迁移驱动机制的原子密度积分法, 并结合空洞形成/扩散准则及失效判据, 分析FCBGA焊点在不同网格密度下的电迁移空洞演化过程, 发现原子密度积分算法稳定, 不依赖网格密度. 采用原子密度积分法模拟真实 工况下FCBGA关键焊点电迁移空洞形成位置和失效寿命, 重点研究了焊点材料和铜金属层结构对电迁移失效的影响. 结果表明, 电迁移失效寿命随激活能的增加呈指数级增加, 因此Sn3.5Ag焊点的电迁移失效寿命约为63Sn37Pb的2.5倍, 有效电荷数对电迁移寿命也有一定的影响;铜金属层结构的调整会改变电流的流向和焊点的应力分布, 进而影响焊点的电迁移失效寿命.      

固体破坏理论的若干问题

本文列举和初步探讨了位于当代固体破坏理论的前沿上的十五个问题。它们包括：固体破坏理论的封闭、宏微观非线性力学、尺度效应、多层次计算、细微观实验力学技术、断裂过程区的描述、异质体的强度与韧性、材料的多层次抗破坏设计、高速破坏过程、非均匀介质的动态断裂与前兆、疲劳的起源、破坏元技术、内损伤破坏与微结构形貌演化失稳的识别、材料的微结构演化、电致失效力学。     

准脆性材料断裂过程区中的圆饼微裂纹损伤计算

准脆性工程材料及结构在外力作用下，不仅引起内部缺陷变化和微裂纹的出现及发展，且使得其结构承载能力降低或性能劣化．在其材料失效过程中常存在裂缝与断裂损伤过程区．为研究材料细观缺陷或微裂纹与宏观破坏的规律，通过细观力学方法，对于代表性体积单元RVE中的圆饼型微裂纹的尺寸与密度变化，探讨其宏观断裂过程区力学参量与损伤之间的量化关系．借助宏观断裂过程区的黏聚裂纹模型，将损伤单元RVE嵌入到宏观裂缝端部的断裂过程区中，对其进行联接细观损伤到宏观破坏的力学多尺度研究．文中也通过实验数据，对其理论计算结果进行了算例的讨论与分析．     

压电智能复合材料层合梁的力电耦合模型及层间应力分析

由于非凡的物理性能，石墨烯纳米片(GPL)被认为是最有吸引力的复合材料增强材料之一.GPL增强材料可以明显提高聚偏氟乙烯(PVDF)压电性能和力学性能.在力电载荷作用下，对含均匀石墨烯薄片增强(GSR)智能压电复合材料层合梁层间应力预测至关重要.若对受到力电耦合作用且层与层之间材料性能突变的压电层合梁层间剪切变形预测有误，则其层间应力过大可能导致层间失效.因此，论文提出一种适于分析此类问题且满足层与层之间相容性条件的有效力电耦合模型，用于含GSR致动器的复合材料层合梁层间应力分析.应用Reissner混合变分原理(RMVT),可以提高考虑力电耦合效应的横向剪应力预测精度.三维(3D)弹性理论和所选模型计算结果将用于评估所提梁模型性能.此外，还从力电载荷、压电层厚度、石墨烯体积分数和长厚比等方面对含GSR致动器复合材料层合梁力学响应特性进行了系统的研究.     

A comparison of electromigration failure of metal lines with fracture mechanics

Atoms constructing an interconnecting metal linein a semiconductor device are transported by electron flowin high density.This phenomenon is called electromigration,which may cause the line failure.In order to characterize theelectromigration failure,a comparison study is carried outwith some typical phenomena treated by fracture mechanicsfor thin and large structures.An example of thin structures,which have been treated by fracture mechanics,is silica optical fibers for communication systems.The damage growth ina metal line by electromigration is characterized in comparison with the crack growth in a silica optical fiber subjectedto static fatigue.Also a brief comparison is made betweenthe electromigration failure and some fracture phenomena inlarge structures.     

Stress Analysis And Geometrical Configuration Selection for Multilayer Piezoelectric Displacement Actuator

Multilayer piezoelectric ceramic displacement actuators are susceptible to cracking in the region near the edge of the internal electrode, which may cause system damage or failure. In this paper, the stress distribution of a multilayer piezoelectric composite is investigated in a working environment and the optimized geometrical con?guration of the piezoelectric layer is obtained. The stress distribution in the structure and the stress concentration near the edge of th…     

Fatigue crack growth induced by domain switching under electromechanical load in ferroelectrics

Reliability calls for a better understanding of the failure of ferroelectric ceramics. The fracture and fatigue of ferroelectric ceramics under an electric field or a combined electric and mechanical loading are investigated. The small-scale domain-switching model is modified to analyze failure due to fracture and fatigue. Effects of anisotropy and electromechanical load coupling are taken into account. Analytical expressions are obtained for domain-switching regions near the crack tip such that of 90° domain switching can be distinguished from 180° domain switching in addition to different initial poling directions. The crack tip stress intensity variation of ferroelectric ceramics due to the domain switching is analyzed. A positive electric field tends to enhance the propagation of an insulating crack perpendicular to the poling direction, while a negative field impedes it. Fatigue crack growth under various coupling loads and effects of the stress field and electric field on near field stress intensity variation are analyzed. Predicted crack growth versus cyclic electric field agrees well with experiment.     

Interfacial cracks between piezoelectric and elastic materials under in-plane electric loading

A new experimental technique for accelerated fatigue crack growth tests was recently developed (Du et al., 2001). The technique, which uses piezoelectric actuators, enables application of cyclic loading at frequencies several orders higher than that by mechanical loading. However, the validity of this technique relies on the equivalence between piezoelectric and mechanical loading. In this paper, the behavior of an interfacial crack between a piezoelectric material and an elastic material under in-plane electric loading is studied. The displacement mismatch along a bonded interface due to electric potential loading on the piezoelectric material is modeled by inserting an array of uniformly distributed dislocations along the interface. By means of Fourier transformation methods, the governing equations are converted to an integral equation, which is then converted to a standard Hilbert problem. A closed form solution for stresses, electric field, and electric displacements along the bonded interface is obtained. The results agree very well with those obtained from numerical simulations. The results show that the closed form solution is accurate not only for far field distributions of stresses and electric variables, but also for the asymptotic distributions near the crack tip. The solution also suggests the likelihood of domain switching in the piezoelectric material near the crack tip, a process that may influence the interfacial fracture resistance.     

A theoretical analysis of the electromigration-induced void morphological evolution under high current density

In this work,analysis of electromigration-induced void morphological evolution in solder interconnects is per-formed based on mass diffusion theory. The analysis is conducted for three typical experimentally observed void shapes: circular, ellipse, and cardioid. Void morphological evolution is governed by the competition between the electric field and surface capillary force.In the developed model,both the electric field and capillary force on the void's surface are solved analytically.Based on the mass conversation princi-ple,the normal velocity on the void surface during diffusion is obtained. The void morphological evolution behavior is investigated, and a physical model is developed to predict void collapse to a crack or to split into sub-voids under elec-tric current.It is noted that when the electric current is being applied from the horizontal direction, a circular void may either move stably along the electric current direction or col-lapse to a finger shape,depending on the relative magnitude of the electric current and surface capillary force.However, the elliptical-shaped void will elongate along the electric cur-rent direction and finally collapse to the finger shape.On the other hand,the cardioid-shaped void could bifurcate into two sub-voids when the electric current reaches a critical value. The theoretical predictions agree well with the experimental observations.     

Analysis of electric boundary condition effects on crack propagation in piezoelectric ceramics

There are three types of cracks: impermeable crack, permeable crack and conducting crack, with different electric boundary conditions on faces of cracks in piezoelectric ceramics, which poses difficulties in the analysis of piezoelectric fracture problems. In this paper, in contrast to our previous FEM formulation, the numerical analysis is based on the used of exact electric boundary conditions at the crack faces, thus the common assumption of electric impermeability in the FEM analysis is avoided. The crack behavior and elasto-electric fields near a crack tip in a PZT-5 piezoelectric ceramic under mechanical, electrical and coupled mechanical-electrical loads with different electric boundary conditions on crack faces are investigated. It is found that the dielectric medium between the crack faces will reduce the singularity of stress and electric displacement. Furthermore, when the permittivity of the dielectric medium in the crack gap is of the same order as that of the piezoelectric ceramic, the crack becomes a conducting crack, the applied electric field has no effect on the crack propagation. The project supported by the National Natural Science Foundation of China (19672026, 19891180)