DYNAMIC BEHAVIOR OF TWO PARALLEL SYMMETRY CRACKS IN MAGNETO-ELECTRO-ELASTIC COMPOSITES UNDER HARMONIC ANTI-PLANE WAVES

The dynamic behavior of two parallel symmetry cracks in magneto-electro-elastic composites under harmonic anti-plane shear waves is studied by Schmidt method. By using the Fourier transform, the problem can be solved with a pair of dual integral equations in which the unknown variable is the jumps of the displacements across the crack surfaces. To solve the dual integral equations, the jumps of the displacements across the crack surface were expanded in a series of Jacobi polynomials. The relations among the electric filed, the magnetic flux and the stress field were obtained. From the results, it can be obtained that the singular stresses in piezoelectric/piezomagnetic materials carry the same forms as those in a general elastic material for the dynamic anti-plane shear fracture problem. The shielding effect of two parallel cracks was also discussed.     

Basic solutions of multiple parallel symmetric mode-III cracks in functionally graded piezoelectric/piezomagnetic material plane

The Schmidt method is adopted to investigate the fracture problem of multiple parallel symmetric and permeable finite length mode-III cracks in a functionally graded piezoelectric/piezomagnetic material plane. This problem is formulated into dual integral equations, in which the unknown variables are the displacement jumps across the crack surfaces. In order to obtain the dual integral equations, the displacement jumps across the crack surfaces are directly expanded as a series of Jacobi polynomials. The results show that the stress, the electric displacement, and the magnetic flux intensity factors of cracks depend on the crack length, the functionally graded parameter, and the distance among the multiple parallel cracks. The crack shielding effect is also obviously presented in a functionally graded piezoelectric/piezomagnetic material plane with mul- tiple parallel symmetric mode-III cracks.     

STRESS INTENSITY FACTOR OF AN ANTI-PLANE CRACK PARALLEL TO THE WEAK/MICRO-DISCONTINUOUS INTERFACE IN A BI-FGM COMPOSITE

The problem considered is a mode Ⅲ crack lying parallel to the interface of an exponential-type functional graded material （FGM） strip bonded to a linear-type FGM substrate with infinite thickness. By applying the Fourier integral transform, the problem was reduced as a Cauchy singular integral equation with an unknown dislocation density function. The collocation method based on Chebyshev polynomials proposed by Erdogan and Gupta was used to solve the singular integral equation numerically. With the numerical solution, the effects of the geometrical and physical parameters on the stress intensity factor （SIF） were analyzed and the following conclusions were drawn： （a） The region affected by the interface or free surface varies with the material rigidity, and higher material rigidity will lead to bigger affected region. （b） The SIF of the crack in the affected region and parallel to the micro-discontinuous interface is lower than those of the weak discontinuous cases. Reducing the weak-discontinuity of the interface will be beneficial to decrease the SIF of the interface-parallel crack in the region affected by the interface. （c） The effect of the free surface on SIF is more remarkable than that of the interface, and the latter is still more notable than that of the material rigidity. When the effects of the interface and free surface are fixed, increase of the material rigidity will enhance the value of SIF.     

A MOVING CRACK IN A NONHOMOGENEOUS MATERIAL STRIP

This paper considers an anti-plane moving crack in a nonhomogeneous material strip of finite thickness. The shear modulus and the mass density of the strip are considered for a class of functional forms for which the equilibrium equation has analytical solutions. The problem is solved by means of the singular integral equation technique. The stress field near the crack tip is obtained. The results are plotted to show the effect of the material non-homogeneity and crack moving velocity on the crack tip field. Crack bifurcation behaviour is also discussed. The paper points out that use of an appropriate fracture criterion is essential for studying the stability of a moving crack in nonhomogeneous materials. The prediction whether the unstable crack growth will be enhanced or retarded is strongly dependent on the type of the fracture criterion used. Based on the analysis, it seems that the maximum 'anti-plane shear' stress around the crack tip is a suitable failure criterion for moving cracks in nonhomogeneous materials.     

Propagation of slip pulse along frictionless contact interface with local separation between two piezoelectric solids

The Stroh formalism of piezoelectric materials,Fourier analysis and singular integral equation technique were used to investigate the existence of a pulse at the fric- tionless interface in presence of local separation between two contact piezoelectric solids. The two solids were combined together by uniaxial tractions and laid in the electric field. The problem was cast into a set of Cauchy singular integral equations,from which the closed-form solutions were derived.The numerical discussion on the existence of such a slip pulse was presented.The results show that such a slip pulse,which has square root singularities at both ends of the local separation zone,can propagate in most material combinations.And the existence of such a slip pulse will not be affected by the applied mechanical and electric fields in some special material combinations.     

ANALYSIS OF TWO DISSIMILAR FUNCTIONALLY GRADED STRIPS CONTAINING INTERFACE CRACK UNDER PLANE DEFORMATION

In this paper the plane elasticity problem of two bonded dissimilar functionally graded strips containing an interface crack is studied.The governing equation in terms of Airy stress function is formulated and exact solutions are obtained for several special variations of material properties in Fourier transformation domain.The mixed boundary problem is reduced to a system of singular integral equations that are solved numerically.Numerical results show that fracture toughness of materials can be greatly improved by graded variation of elastic modulus and the influence of the specific form of elastic modulus on the fracture behavior of FGM is limited.     

INTERACTION OF A SCREW DISLOCATION IN THE INTERPHASE LAYER WITH THE INCLUSION AND MATRIX

The interaction of a screw dislocation in the interphase layer with the circular inhomogeneity and matrix was dealt with . An efficient method for multiply connected regions was developed by combining the sectionally subholomorphic function theory, Schwatz symmetric principle and Cauchy integral technique. The Hilbert problem of the complex potentials for three material regions was reduced to a functional equation in the complex potential of the interphase layer, resulting in an explicit series solution . By using the present solution the interaction energy and force acting dislocation were evaluated and discussed.     

ON THE TORSION OF A CYLINDER WITH SEVERAL CRACKS

In this paper, based on paper, the analytic expression of the torsion function for a cylinder containing arbitrary oriented cracks is obtained. The probtem is reduced to solve a system of singular integral equations for the unknown dislocation density functions. Using the numerical method of the singular integral equations, the torsional rigidities and stress intensity factors are evaluated for several multicracked cylinders. Next, the cr(?)kcutting method is firstly extended to lve the torsion problem for a rectangular prism. The numerical results show that the method presented here is successful.     

ANALYSIS OF A CRACK IN A FUNCTIONALLY GRADED STRIP WITH A POWER FORM SHEAR MODULUS

The plane strain problem of a crack in a functionally graded strip with a power form shear modulus is studied. The governing equation in terms of Airy＇s stress function is solved exactly by means of Fourier transform. The mixed boundary problem is then reduced to a system of singular integral equations and is solved numerically to obtain the stress intensity factor at crack-tip. The maximum circumferential stress criterion and the strain energy density criterion are both employed to predict the direction of crack initiation. Numerical examples are given to show the influence of the material gradation models and the crack sizes on the mode-I and mode-II stress intensity factors. The dependence of the critical kink-angle on the crack size is examined and it is found that the crack kink-angle decreases with the increase of the normalized crack length, indicating that a longer crack tends to follow the original crack-line while it is much easier for a shorter crack to deviate from the original crack-line.     

Effects of electric/magnetic impact on the transient fracture of interface crack in piezoelectric-piezomagnetic sandwich structure: anti-plane case

Due to the incompatibility of the interlaminar deformations,the interface debonding or cracking usually happens in a layered magnetoelectric(ME)structure under an applied load.In this paper,the transient responses of the anti-plane interface cracks in piezoelectric(PE)-piezomagnetic(PM)sandwich structures are studied by the standard methods of the integral transform and singular integral equation.Discussion on the numerical examples indicates that the PE-PM-PE structure under electric impact is more likely to fracture than the PM-PE-PM structure under a magnetic impact.The dynamic stress intensity factors(DSIFs)are more sensitive to the variation of the active layer thickness.The effects of the material constants on the DSIFs are dependent on the roles played by PE and PM media during the deformation process.     

A mode III crack in functionally graded piezoelectric materials

This paper considers the mode III crack problem in functionally graded piezoelectric materials. The mechanical and the electrical properties of the medium are considered for a class of functional forms for which the equilibrium equations have an analytical solution. The problem is solved by means of singular integral equation technique. Both a single crack and a series of collinear cracks are investigated. The results are plotted to show the effect of the material inhomogeneity on the stress and the electric displacement intensity factors.     

SHEAR WAVE SCATTERING FROM A PARTIALLY DEBONDED PIEZOELECTRIC CYLINDRICAL INCLUSION

I. INTRODUCTION Owing to the intrinsic coupling characteristics between electric and elastic behaviors, piezoelectricmaterials have been used widely in technology such as transducers, actuators, sensors, etc. Studieson electroelastic problems of a piezo…     

Interfacial coplanar cracks in piezoelectric bi-material systems under pure mechanical impact loading

In this paper, we examine the dynamic behaviour of different piezoelectric bi-material combinations containing two interfacial cracks subjected to mechanical impact loading. The problem is formulated in terms of integral transforms techniques and the collocation method to obtain the solution for the resulting singular integral equation in the transformed plane. Laplace inversion was then used to obtain the resulting dynamic stress intensity factors in the physical plane. Numerical examples are provided for five different types of piezoelectric bi-material systems to illustrate the effect of the presence of collinear interacting cracks and the different material combinations upon the resulting dynamic stress intensity factors.     

Closed-form solution for two collinear cracks in a piezoelectric strip

Under the permeable electric boundary condition, the problem of two collinear anti-plane shear cracks lying at the mid-plane of a piezoelectric strip is investigated. By using the Fourier transform, the associated problem is reduced to a singular integral equation. Solving the resulting equation analytically, the electro-elastic field intensity factors and energy release rates at the inner and outer crack tips can be determined in explicit form. Numerical results for PZT-5H piezoelectric ceramic are also presented graphically. The results reveal that the effect of electric field on crack growth in piezoelectric materials is dependent on applied elastic displacement.     

Fracture analysis of circular-arc interface cracks in piezoelectric materials

The anti-plane problem of N arc-shaped interfacial cracks between a circular piezoelectric inhomogeneity and an infinite piezoelectric matrix is investigated by means of the complex variable method. Cracks are assumed to be permeable and then explicit expressions are presented, respectively, for the electric field on the crack faces, the complex potentials in media and the intensity factors near the crack-tips. As examples, the corresponding solutions are obtained for a piezoelectric bimaterial system with one or two permeable arc-shaped interfacial cracks, respectively. Additionally, the solutions for the cases of impermeable cracks also are given by treating an impermeable crack as a particular case of a permeable crack. It is shown that for the case of permeable interfacial cracks, the electric field is jumpy ahead of the crack tips, and its intensity factor is always dependent on that of stress. Moreover all the field singularities are dependent not only on the applied mechanical load, but also on the applied electric load. However, for the case of a homogeneous material with permeable cracks, all the singular factors are related only to the applied stresses and material constants.     

The interaction of two parallel Mode-I limited-permeable cracks in a functionally graded piezoelectric material

In this paper, the interaction of two parallel Mode-I limited-permeable cracks in a functionally graded piezoelectric material was investigated by using the generalized Almansi's theorem. In the analysis, the electric permittivity of the air inside the crack was considered. The problem was formulated through Fourier transform into two pairs of dual integral equations, in which unknown variables are jumps of displacements across the crack surface. To solve the dual integral equations, the jumps of displacements across the crack surfaces were directly expanded as a series of Jacobi polynomials. The solution of the present paper shows that the singular stresses and the singular electric displacements at the crack tips in functionally graded piezoelectric materials carry the same forms as those in homogeneous piezoelectric materials; however, the magnitudes of intensity factors depend on the electric permittivity of the air inside the crack and the gradient parameter of functionally graded piezoelectric material properties. It was also revealed that the crack shielding effect is also present in functionally graded piezoelectric materials.     

Transient response of a piezoelectric ceramic strip with an eccentric crack under electromechanical impacts

The transient response of a piezoelectric strip with an eccentric crack normal to the strip boundaries under applied electromechanical impacts is considered. By using the Laplace transform, the mixed initial-boundary-value problem is reduced to triple series equations, then to a singular integral equation of the first kind by introducing an auxiliary function. The Lobatto–Chebyshev collocation technique is adopted to solve numerically the resulting singular integral equation. Dynamic field intensity factors and energy release rate are obtained for both a permeable crack and an impermeable crack. The effects of the crack position and the material properties on the dynamic stress intensity factor are examined and numerical results are presented graphically.     

Periodic cracks in a functionally graded piezoelectric layer bonded to a piezoelectric half-plane

Studied is the problem of a periodic array of cracks in a functionally graded piezoelectric strip bonded to a homogeneous piezoelectric material. The properties of the functionally graded piezoelectric strip, such as elastic modulus, piezoelectric constant and dielectric constant, are assumed in exponential forms and vary along the crack direction. The crack surface condition is assumed to be electrically impermeable or permeable. Integral transform and dislocation density functions are employed to reduce the problem to the solution of a system of singular integral equations. The effects of the periodic crack spacing, material constants and the geometry parameters on the stress intensity factor, the energy release ratio and the energy density factor are studied.     

压电涂层-功能梯度压电界面层-基底结构的二维接触问题研究

在多层压电元件中,由于界面处材料成分和性质的突变,常常导致界面处应力集中,使得界面处出现开裂或蠕变现象,从而大大缩短了压电元件的使用寿命。功能梯度压电材料作为界面层,可有效的缓解界面材料不匹配导致的破坏。本文主要研究利用功能梯度压电材料界面层连接压电涂层和基底,分析三层结构在圆柱型压头作用下的力电响应。利用傅里叶积分变换技术,本文将压电涂层-功能梯度压电层-基底结构在刚性圆柱压头作用下的二维平面应变接触问题转化为带有柯西核的奇异积分方程。运用高斯-切比雪夫积分公式,将奇异积分方程转化为线性方程组并对其进行数值求解,得到压电涂层-功能梯度压电层-基底结构在圆柱形压头作用下的应力分布和电位移分布。数值结果表明,梯度压电材料参数的变化对结构中的力电响应具有重要的影响。本文研究结果对于利用功能梯度压电界面层消除界面处的应力不连续导致的界面破坏具有重要的理论指导意义,研究结果可为功能梯度压电材料界面层的设计提供帮助。     

Impact response of a functionally graded piezoelectric plate with a vertical crack

The dynamic fracture problem for a functionally graded piezoelectric plate containing a crack perpendicular to the free boundaries is considered in this study. It is assumed that the electroelastic properties of the medium vary continuously in the thickness direction. Integral transform techniques and dislocation density function are employed to reduce the problem to the solution of a singular integral equation. Mode I dynamic energy density factors are presented for an internal crack as well as an edge crack for various values of dimensionless parameters representing the size and location of the crack and the material nonhomogeneity.