铝靶激光热应力的实验研究

 用高温应变计和热偶计等诊断技术，研究连续波氧碘化学激光（CW/COIL）与铝合金板作用产生的激光热应力。当照射靶面激光强度约1 000 W/cm²时，激光热应力随靶厚的增加而快速减小。当激光辐照靶材厚度h＝1.00 mm、激光强度I＝640~980 W/cm²时，激光热应力随辐照靶面激光强度的增加而增大。两者的激光热应力－时间曲线随靶厚的减薄或随辐照靶面激光强度的增加而变得越来越复杂。当靶厚h≤2.50 mm，辐照靶面激光强度I≥800 W/cm²时，激光热应力强度超过激光辐照区材料断裂强度，萌生许多孔洞裂纹，引起材料断裂破坏。     

基于靶面温度测量的激光强度时空分布重构方法

基于靶面温度分布测量反演激光强度时空分布的重构表达式中,被积函数包含的奇异阿贝尔核函数导致了求解积分表达式的病态和解的不稳定。为了解决这一积分求解问题,基于广义函数理论和正则变换方法,对积分函数进行了重新构造,获得了基于靶面温度时空分布测量反演入射激光强度分布的重构算法,并分析了重构结果对温度测量误差的敏感性。借助数值模拟方法对重构算法进行了验证,数值计算给出了重构强度误差与靶板厚度和辐照时间的关系。验证结果表明,两种背光面边界条件下反演获得的激光束时空分布,不仅与原始模型激光束达到了较好的一致,而且不受薄板条件的限制。算法对强激光辐照效应的靶面激光参量监测有实用性。     

激光与固体靶面烧蚀等离子体的能量耦合计算

 强激光辐照下固体靶表面迅速汽化产生靶蒸气等离子体，激光穿过等离子体区到达固体靶表面的过程就是激光束与等离子体的能量耦合与交换过程。采用具有五阶精度的WENO差分格式和简易等离子体状态方程模型对激光与等离子体相互作用的复杂物理过程进行了数值计算，分析了激光束能量在等离子体区中的吸收、屏蔽效应等动态耦合规律以及激光支持等离子体前驱冲击波传播。数值模拟结果表明：激光能量是支持靶面等离子体运动的唯一原因，能量屏蔽效应对激光与等离子体能量耦合有很大影响，通过控制激光脉冲宽度，可以合理调节屏蔽效应的影响。     

激光入射孔径对柱形腔靶辐照不均匀度的影响

 研究了激光入射孔径对柱形腔靶中 l=2阶靶丸辐照不均匀度的影响，计算得到了激光入射孔径对辐照不均匀度随时间变化的影响可以用源于某一固定点的一族曲线来描述。此固定点是由与激光光斑的位置决定的，与腔靶的半径和入射激光束的入射角有关，而与激光入射孔径的大小无关。辐照不均匀度随时间的变化是由激光光斑的辐射温度的变化和腔壁辐射温度的变化决定的，激光入射孔半径的大小影响着辐照不均匀度随时间变化的曲线的梯度，入射孔越大，曲线的梯度就越大。激光入射孔对l=2阶靶丸辐照不均匀度的影响与入射孔半径近似呈线性关系。     

激光器件 激光安全与防护

TN241 2005042575 强激光辐照光学材料的热力效应研究=Study of thermal and mechanical damage in optical material induced by high- power laser[刊,中]／赵建君(军械工程学院理化教研室,河北,石家庄(050003)),宋春荣…／／激光杂志,-2005,26 (1)．-31-32,34 在建立强激光辐照光学材料物理模型的基础上,采用解析解的形式计算了高斯型连续激光照射圆柱形靶板的三维温度场以及相应的应力分布。分析了高斯光束作用时,环向热应力最大值及其作用时间的关系,指出三维时,     

神光III主机极向驱动靶丸表面辐照均匀性

极向驱动是在间接驱动构型的激光装置中，通过重瞄各束激光的位置，实现较均匀的靶丸表面激光辐照，以研究直接驱动惯性约束聚变的关键物理问题.介绍了神光III主机装置的激光排布和焦斑特点，以及激光束重瞄方法和靶丸表面激光辐照均匀性优化原则.给出了三阶和五阶超高斯近似下的激光焦斑强度分布，Φ540 μm靶丸在能量沉积满足cos²γ和cos γ假设时靶丸表面最均匀辐照的移束参数，以及二维辐射流体程序模拟最优移束时的内爆对称性结果.二维模拟结果表明，按cosγ假设移束的热斑更对称.分析了激光的束间功率不平衡、激光束重瞄精度和靶丸定位精度对靶丸表面辐照均匀性的影响.模拟结果表明，为了不显著降低靶丸表面辐照均匀性，需要将束间功率不平衡控制在5%以内，激光束重瞄精度和靶丸定位精度控制在7 μm以内.     

序列尖峰脉冲激光对铝板熔融热-力效应研究

 本文用金相显微和扫描电镜诊断技术，对序列尖峰脉冲准连续激光束辐照LY12CZ和LF6M铝合金板材，产生激光热熔融与激光热应力效应，使照射区板材引生激光烧蚀池和许多断裂裂纹，造成材料断裂破坏的机理，进行了研究。给出了激光热应力、裂纹扩展应力与照射激光强度的变化关系和研究结果。     

激光辐照引起的材料温度场和热应力场的瞬态分布

 光电探测器吸收激光后的温升以及因温升造成的各种现象,致使探测器遭受到不同程度的损伤。利用热弹性理论对CO2激光器辐照K9玻璃材料进行研究,建立激光辐照材料温升及热应力分布二维平面模型,通过解析计算得到由激光辐照半导体材料引起的温度场和应力场的瞬态分布。研究表明, K9玻璃材料的激光辐照损伤阀值与辐照时间和光斑半径相关。在同一条件下,造成的热应力损伤阀值较熔融损伤的低,故K9玻璃材料的破坏形态为热应力破坏。      

超声速气流下强激光辐照靶体失效数值模拟

建立了能够反映激光、流场和结构相互作用的热流固耦合数值计算方法,用于模拟超声速气流（马赫数1.2~4.0）作用下强激光辐照靶体结构的失效行为。分析了不同耦合策略对数值计算结果的影响。研究了激光功率密度及来流马赫数对屈服失效和熔融失效行为的影响。结果表明:激光功率密度对失效辐照时间影响显著;存在一个临界马赫数,使得达到屈服失效和熔融失效的辐照时间最长。通过定量分析激光辐照下不同马赫数的气动生热、散热及能量分配,解释了临界马赫数存在的机理。     

斜辐照激光等离子体辐射X光子特性

 在神光Ⅱ高功率激光装置上，实验研究了激光斜辐照形成的激光等离子体辐射X射线光子的特性及真空喷射热等离子体流的方向。采用针孔X射线相机测量了钕玻璃激光（基频1.053 μm）辐照铝靶形成的激光铝等离子体辐射的X射线光子的空间分布，并针对正入射和入射激光斜辐照情况下测得的X射线光子量及特性进行了分析和比较。结果发现：入射激光斜辐照固体平面靶产生的向真空喷射热等离子体流的方向是垂直靶面（即法线方向）；正入射和斜入射激光叠加驱动靶时，一定程度上能改善激光辐照的均匀性，但等离子体源辐射的X射线光子数并未发现显著地增加；当激光斜辐照与靶相互作用时，激光能量被等离子体吸收下降。     

The interaction and the surface crack of single-crystal silicon induced by a millisecond laser

When the silicon material is irradiated by laser, it absorbs the laser energy leading to the temperature rise and the thermal stress. The damage effect includes melting, vaporation and thermal stress damage. Once the thermal stress exceeds the stress strength the crack will initiate. The silicon surface cracks induced by a millisecond laser are investigated. The experimental results show that three types of cracks are generated including cleavage crack, radial crack and circumferential crack. The cleavage crack is located within the laser spot. The radial crack and circumferential crack are located outside the laser spot. A two-dimensional spatial axisymmetric model of silicon irradiated by a 1064 nm millisecond laser is established. To assess what stresses generate and explain the generation mechanism of the different cracks, the thermal stress fields during laser irradiation and the cooling process are obtained using finite element method. The radial stress and hoop stress within the laser spot are tensile stress after the laser irradiation. The temperature in the center is the highest but the thermal stress in the center is not always highest during the laser irradiation. The cleavage cracks are induced by the tensile stress after the laser irradiation. The radial crack and the circumferential crack are generated during the laser irradiation.     

Effect of an absorbent overlay on the residual stress field induced by laser shock processing on aluminum samples

Laser shock processing (LSP) or laser shock peening is a new technique for strengthening metals. This process induces a compressive residual stress field, which increases fatigue crack initiation life and reduces fatigue crack growth rate. Specimens of 6061-T6 aluminum alloy are used in this investigation. A convergent lens is used to deliver 2.5 J, 8 ns laser pulses by a Q-switch Nd:YAG laser, operating at 10 Hz. The pulses are focused to a diameter of 1.5 mm onto aluminum samples. Density of 2500 pulses/cm² with infrared (1064 nm) radiation was used. The effect of an absorbent overlay on the residual stress field using this LSP setup and this energy level is evaluated. Residual stress distribution as a function of depth is assessed by the hole drilling method. It is observed that the overlay makes the compressive residual stress profile move to the surface. This effect is explained on the basis of the vaporization of the coat layer suppressing thermal effects on the metallic substrate. The effect of coating the specimen surface before LSP treatment may have advantages on improving wear and contact fatigue properties of this aluminum alloy.     

Thermal stress cleaving of silicon wafer by pulsed Nd：YAG laser

The applied laser energy absorbed in a local area in laser thermal stress cleaving of brittle materials using a controlled fracture technique produces tensile thermal stress that causes the material to separate along the moving direction of the laser beam. The material separation is similar to crack extension, but the fracture growth is controllable. Using heat transfer theory, we establish a three-dimensional （3D） mathematical thermoelastic calculational model containing a pre-existing crack for a two-point pulsed Nd：YAG laser cleaving silicon wafer. The temperature field and thermal stress field in the silicon wafer are obtained by using the finite element method （FEM）. The distribution of the tensile stress and changes in stress intensity factor around the crack tip are analyzed during the pulse duration. Meanwhile, the mechanism of crack propagation is investigated by analyzing the development of the thermal stress field during the cleaving process.     

Slow crack growth: Models and experiments

The properties of slow crack growth in brittle materials are analyzed both theoretically and experimentally. We propose a model based on a thermally activated rupture process. Considering a 2D spring network submitted to an external load and to thermal noise, we show that a preexisting crack in the network may slowly grow because of stress fluctuations. An analytical solution is found for the evolution of the crack length as a function of time, the time to rupture and the statistics of the crack jumps. These theoretical predictions are verified by studying experimentally the subcritical growth of a single crack in thin sheets of paper. A good agreement between the theoretical predictions and the experimental results is found. In particular, our model suggests that the statistical stress fluctuations trigger rupture events at a nanometric scale corresponding to the diameter of cellulose microfibrils.     

CW-COIL激光辐射锗-硫化铅探测器的实验研究

本文叙述了锗－硫化铅（Ｇｅ－ＰｂＳ）探测器的基本特性。分析了激光辐射锗滤光片使用材料升温的穿透深度随时间的变化。在光斑面积２．４６ｍｍ×３．６９ｍｍ和辐照时间０．８ｓ的条件下，得到连续氧碘激光（ＣＷ－ＣＯＩＬ）辐照锗滤光片的烧蚀阈值为１２４Ｗ和破裂阈值为１７７Ｗ的实验数据。在此基础上，进行了ＣＷ－ＣＯＩＬ辐照Ｇｅ－ＰｂＳ探测器的热效应研究，在光斑直径２．１ｍｍ和辐照时间０．８ｓ的条件下，给出ＣＷ－ＣＯＩＬ使Ｇｅ－ＰｂＳ探测器致盲的阈值为１７Ｗ、永久失效的阈值为１９８Ｗ的实验结果。研究结果表明：ＣＷ－ＣＯＩＬ辐照Ｇｅ－ＰｂＳ探测器的破坏机理是激光加热和热应力联合作用的结果。锗滤光片升温，造成硫化铅探测器环境温度升高，导致其探测灵敏度下降为零是ＣＷ－ＣＯＩＬ辐照Ｇｅ－ＰｂＳ探测器产生致盲的原因。激光辐照功率越高，Ｇｅ－ＰｂＳ探测器致盲、恢复时间就越长，甚至造成永久性的失效。     

波段外脉冲激光对锗透镜热冲击效应的数值与实验研究

基于热传导及热弹性力学的基本关系式,建立了激光辐照锗透镜的热力耦合数学物理模型,对瞬态热传导方程和应力平衡方程进行有限元数值求解,得到了锗透镜的温度场和应力场分布,并利用波长1.06 μm,脉冲宽度10 ns的Nd∶YAG脉冲激光对锗透镜进行了热冲击实验研究.数值分析表明,热应力损伤在锗透镜的脉冲强激光损伤中占据主导地位,在短脉冲激光辐照下,锗透镜出现热应力损伤的激光能量密度小于出现熔融损伤的激光能量密度,热应力损伤主要集中在光斑中心区域并体现为压应力损伤,将使材料表面出现裂纹或剥落,实验结果与数值分析基本相符.     

On the delamination and crack formation in a thin wall fabricated using laser solid freeform fabrication process: An experimental–numerical investigation

Parts fabricated using laser solid freeform fabrication (LSFF) are subject to thermal stresses due to the layer-by-layer material deposition and the temperature distribution characteristic throughout the process domain. The thermal stress patterns and intensity contribute significantly to potential delamination and crack formation. In this paper, the temperature distribution and stress field induced during the multilayer LSFF process, and their correlation with delamination and crack formation are studied. This is performed by a numerical and experimental investigation in the fabrication of a thin wall of 304L stainless steel. For time-dependent predictions on the locations of maximum temperatures and thermal stresses and their patterns, a three-dimensional (3D) transient finite element model is employed to simulate the process, including the geometry of the deposited materials as well as coupled temperature and stress distributions across the process domain. The experimental results are used to verify the numerical results as well as to investigate the correlation between the numerical results and micro-crack formations across the fabricated parts. The experiments are conducted with the same process parameters used in the numerical analyses using a 1 kW Nd:YAG pulsed laser. The trend of numerical and experimental results reveals that by preheating the substrate prior to the fabrication process, it is possible to substantially reduce the micro-cracks formed across the part. To demonstrate the feasibility of preheating on the reduction of micro-cracks, several simulations and experiments are performed in which a crack-free result is obtained when the substrate is preheated to 800 K. For this case, 22% reduction in thermal stresses is obtained throughout the process domain.     

活塞激光热负荷应力场数值模拟

活塞激光热负荷就是通过光学转光片改变激光在空间的能量分配比例.结合活塞激光热负荷试验工况,建立了活塞激光热负荷应力场模拟数学物理模型,模型中考虑了材料的热物性参数随温度的变化.结果表明:由于活塞顶凹坑位置靠近通油孔,导致其应力波动幅值比激光辐照区域大;活塞凹坑、通油孔和靠近活塞顶面的活塞内腔由于和冷却介质直接接触,是活...