先进焦平面与光谱成像技术现状

深入分析先进的焦平面技术和光谱成像技术的发展趋势,为探测器及光谱成像仪的研究提供参考。对光谱成像技术的现状和发展趋势、焦平面技术、先进焦平面技术对光谱成像系统技术的推动作用三个方面进行详细的分析总结,认为焦平面技术向着高性能、大规模面阵规格、高灵敏度、宽谱响应的方向发展;并推动光谱成像系统向着高分辨率、宽幅、多波段、更短重访周期和简化系统方向发展。成像光谱仪的发展趋势和需求指明焦平面技术的发展方向,同时焦平面技术的发展也会引领成像光谱仪系统进步和革新。     

成像光谱仪一体化设计

随着超光谱成像技术的发展,超光谱成像光谱仪的要求也随之提高,小型化、高光谱分辨率和高空间分辨率成为发展趋势,这就要求设计者在进行仪器设计的过程中不断完善和优化设计。提出了成像光谱仪一体化设计的方法,即不单纯地进行光谱仪分光系统的设计,而是将光谱仪分光系统置于整体结构中进行整体系统设计和优化,从而实现超光谱成像光谱仪的最佳设计结果,并以近年来应用较为广泛的凸面光栅成像光谱仪为例,较为详细地阐述了成像光谱仪一体化设计方法在系统研制过程中的应用,并通过对该凸面光栅成像光谱仪的测试验证了该方法的正确性。     

成像光谱仪星上定标技术

成像光谱仪是同时获取地物图像和光谱信息的新一代光学遥感仪器。星上定标是成像光谱仪光谱图像数据定量化应用的基础。本文阐述了成像光谱仪星上定标的原理,按照星上定标采用的参考标准对星上定标技术进行了分类,详细介绍了星上辐射定标和光谱定标技术,并展望了成像光谱仪未来发展趋势。绝对辐射定标已经成为成像光谱仪星上定标的基本要求,太阳将逐步代替星上标准灯成为绝对辐射标准。基于不同参考标准的定标方法的综合应用将使星上定标精度和可靠性大大提高。随着定标精度的进一步提高,地面光谱定标装置将逐步空间化,基于探测器的星上辐射定标系统也将逐步得到应用。     

PGP成像光谱仪的全视场自动化光谱定标方法

为了对PGP成像光谱仪所获得的光谱数据进行定量化分析,需对PGP成像光谱仪进行光谱定标,以获得各光谱通道的中心波长、光谱分辨率及成像光谱仪的光谱弯曲等光谱特性信息。采用单色准直光法设计了一套全视场自动化的光谱定标系统,系统中引入球面镜为待测的成像光谱仪光谱定标提供准直光,通过可自动控制的折转镜改变定标入射光线的入射角,以此实现待测成像光谱仪空间维不同视场的自动化光谱定标。运用该定标系统对PGP成像光谱仪进行光谱定标实验,得到该成像光谱仪的光谱性能参数,并结合定标系统的结构特点,对实验的结果进行了精度分析。实验分析结果表明该系统对PGP成像光谱仪的中心波长定标精度达到0.1 nm,光谱分辨率定标精度达到1.3%。该研究设计的全视场自动化光谱定标系统具有结构新颖紧凑、通用性较强、光谱定标精度较高等特点,且由于自动化的控制,避免了由于人为参与定标过程所带来的额外误差。该系统可用于实现PGP成像光谱仪及其他同类型成像光谱仪的光谱定标。     

红外光谱图像技术及其在生物学研究中的应用

文章介绍了红外光谱图像技术;介绍了用焦平面阵列检测器、步进扫描傅里叶变换光谱仪、红外显微镜、分束器构成的红外光谱图像硬件系统及信息提取的软件方法;给出了用红外光谱图像分析猴脑组织中蛋白质和磷左异、残留在人胸部组织中的硅酮、水稻叶片等３个在生物学研究中的应用实例;指出了经外光谱图像技术进一步的发展方向是采用同步辐射作为光源、依靠数学算法提高分辨率和发展空间化学计量学来提取空间信息。     

干涉成像光谱仪技术的新发展

综述了成像光谱仪的发展过程以及空间调制干涉成像光谱仪技术的新原理、新技术、新发展。对干涉成像光谱技术的原理进行了论述 ,分析了Sagnac型和偏振型干涉成像光谱仪的分光机理和成像原理。提出了未来光谱仪技术的发展方向。     

用PtNe灯对大气紫外成像光谱仪进行光谱定标

大气紫外成像光谱仪是一台采用面阵CCD探测器的紫外成像光谱仪,CCD的一维用于记录光谱信息,另一维用于记录垂直飞行方向的空间信息。介绍了大气紫外成像光谱仪的系统组成、工作原理和仪器的主要技术指标,研究了光谱定标理论。结合大气紫外成像光谱仪的特点,选取PtNe空心阴极放电灯作为定标光源,建立了定标装置,对仪器进行了光谱定标。通过对仪器的输出结果进行数据处理,得到了像元序号与波长的函数表达式。定标结果表明,大气紫外成像光谱仪光谱定标的不确定度为0.043 nm。     

星载超光谱成像技术发展与展望

超光谱成像技术由于能够同时获取目标的空间信息和光谱信息,显著提高了空间遥感技术对地物的探测和识别能力,在对地观测和深空探测领域具有广阔的应用前景。总结了星载超光谱成像技术近三十年来的国内外研究现状,对国内外典型超光谱成像仪的技术指标、技术特点和应用领域进行了论述。分析结果表明：高空间分辨率、高光谱分辨率是超光谱成像技术未来的发展趋势,offner光栅色散型超光谱成像仪是一个重要的发展方向。     

凸面光栅成像光谱仪全视场自动化光谱定标系统设计

为了确定凸面光栅成像光谱仪的光谱特性,需要对凸面光栅成像光谱仪进行光谱定标。基于单色准直光法设计了一套全视场光谱定标系统,引入球面镜提供准直光,采用一块可以自由滑动和转动的折转镜改变定标光线的入射角,实现了全谱段自动化光谱定标。运用光学设计软件CODEV对光谱定标系统进行了部分光学模拟,证明了整个系统的可靠性。结合光谱定标系统的结构和特点,对整个光谱定标系统进行了精度分析。理论分析结果表明,该系统的光谱定标精度优于1%。该定标系统具有体积小、通用性强等特点,可为其他成像光谱仪的光谱定标提供参考。     

成像光谱测量研究

详细论述成像光谱仪的工作原理和各系统的研究方案，提出控制线性偏振光的光学设计方法，分析成像光谱的像光谱间相关性，最后介绍成像光谱仪的推广应用前景。     

288×4长波线阵红外探测器的测试

第二代热成像技术的长波红外以HgCdTe288×4扫描型焦平面阵列（FPA）为主。相对凝视系统而言，该扫描型FPA空间截止频率更高、视场更宽。针对该线阵FPA在搜索、观瞄等领域的广泛应用，设计测试方案对探测器进行测试。实验结果与探测器出厂报告基本吻合，成功实现了对288×4长波线阵红外探测器的性能检测。     

Hyperspectral opportunities with next-generation QSIP arrays

Hyperspectral applications that employ gratings typically exploit only one grating order, since other orders that emerge from the grating at the same angle of dispersion would corrupt the spectrum measured with conventional FPAs. Previously, dualband infrared focal plane arrays (FPA), developed for multi-spectral imaging applications, have demonstrated advantages over conventional multi-FPA sensor configurations in compactness and band-to-band pixel registration. In addition, dualband and multiband FPA architectures of Quantum Structure Infrared Photodetector (QSIP) technology would enable applications beyond simple multi-spectral imaging. For example, In the case of dual- (or multi-) waveband FPAs, the different grating orders can be paired with the FPA wavebands, allowing high efficiency hyperspectral imaging over very broad wavelength regions. Exploiting the “third dimension” of FPA detecting layers for this type of hyperspectral application has been demonstrated previously. As time progresses, multi-waveband FPAs are expected to provide an increase in spectral information at the pixel level without the need for external (e.g. dispersive) optical elements. As the number of wavebands increases to the point of providing spectral overlap of adjacent spectral resolution elements, hyperspectral capability is then achieved by the FPA acting alone. This technology may someday become possible through advanced QSIP architectures having photons of different wavelength continuously absorbed at different depths, and their resulting photocurrents isolated with a vertical grid of contacts or an equivalent mechanism for transporting depth-dependent signal photocurrent to a read-out circuit unit cell.     

Optical system design of the Dyson imaging spectrometer based on the Fery prism

Imaging spectrometer has obtained wide development since rich feature information can be obtained by it; now, we focus on its high spectral resolution and miniaturization. In this paper, we design the Dyson imaging spectrometer system based on Fery prism. The average spectral resolution is 4.3 nm and the structure of the total length is 229 mm. It is a small, high-spectrometer imaging system. The front and rear surface of the traditional prism are plane, but the surfaces of the Fery prism are spherical, which can provide some optical power to realize imaging function and produce the dispersion effect. The Fery prism does not need to be placed in the parallel optical path, which simplifies the collimator lens and the imaging lens and are necessary in the prism spectrometer, making it possible to obtain a compact spectrometer. Full-spectrum transmittance of the prism is up to 94 %. Compared to the convex grating, the energy efficiency is greatly improved, and the free spectral range is wider, and its dispersion will not bring higher-order spectral aliasing problem. The small high spectrometer only includes two components. Its spectral range is from 400 to 1000 nm, covering the near-ultraviolet to near-infrared. The various aberrations of the typical spectrum are corrected. The spectrometer is excellent in performance.     

Analyses of infrared focal plane array figure of merit and its impact on sensor system trades

The performance of infrared focal plane arrays (IRFPAs) is usually described by a set of figures of merit and operating parameters. They include FPA format, pixel pitch, operating temperature, cut-on and cutoff wavelengths, median detectivity, uniformity, and integration time. This article examines the promise of superlattice infrared materials and how the improved FPA figure of merit affects sensor system performance as measured by range, update rate, size, power, and cost. A simple analysis shows that for space-based surveillance, the system cost, as measured by the number of hosting satellites, may be decreased substantially by using detector arrays with large array size and longer detection range. It also shows that to make long-wavelength superlattice IRFPAs useful for future space applications, the residual nonuniformity must be improved.     

Type-II InAs/GaSb photodiodes and focal plane arrays aimed at high operating temperatures

Recent efforts to improve the performance of type II InAs/GaSb superlattice photodiodes and focal plane arrays (FPA) have been reviewed. The theoretical bandstructure models have been discussed first. A review of recent developments in growth and characterization techniques is given. The efforts to improve the performance of MWIR photodiodes and focal plane arrays (FPAs) have been reviewed and the latest results have been reported. It is shown that these improvements has resulted in background limited performance (BLIP) of single element photodiodes up to 180 K. FPA shows a constant noise equivalent temperature difference (NEDT) of 11 mK up to 120 K and it shows human body imaging up to 170 K.     

基于无基底焦平面阵列红外热像仪的理论模型分析

基于双材料微悬臂梁热变形原理的光学读出非制冷红外探测阵列经历了从有基底结构向无基底结构的发展过渡,无基底阵列的红外成像结果和有限元模型分析均表明无基底阵列不满足恒温基底条件.本文结合电学比拟的方法,提出了一种新的基于无基底焦平面阵列(focal plane Array,FPA)的热传递分析的理论模型.分析采用整体考虑的思路,避开了无基底FPA阵列各单元热传递互相影响所产生的复杂热分布分析,并考虑了框架对热量的吸收与传递.理论模型采用外边框与环境等温的边界条件,虽不及有限元方法对边界条件的处理灵活,但也已取 关键词： 光学读出 无基底 非制冷红外成像 焦平面阵列     

Development of a 1K × 1K, 8–12 μm QWIP array

In the on-going evolution of GaAs quantum well infrared photodetectors (QWIPs) we have developed a 1,024 × 1,024 (1K × 1K), 8–12  μm infrared focal plane array (FPA). This 1 megapixel detector array is a hybrid using an L3/Cincinnati Electronics silicon readout integrated circuit (ROIC) bump bonded to a GaAs QWIP array fabricated jointly by engineers at the Goddard Space Flight Center (GSFC) and the Army Research Laboratory (ARL). We have integrated the 1K × 1K array into an SE-IR based imaging camera system and performed tests over the 50–80 K temperature range achieving BLIP performance at an operating temperature of 57 K. The GaAs array is relatively easy to fabricate once the superlattice structure of the quantum wells has been defined and grown. The overall arrays costs are currently dominated by the costs associated with the silicon readout since the GaAs array fabrication is based on high yield, well-established GaAs processing capabilities. One of the advantages of GaAs QWIP technology is the ability to fabricate arrays in a fashion similar to and compatible with silicon IC technology. The designer’s ability to easily select the spectral response of the material from 3 μm to beyond 15 μm is the result of the success of band-gap engineering and the Army Research Lab is a leader in this area. In this paper we will present the first results of our 1K × 1K QWIP array development including fabrication methodology, test data and imaging capabilities.     

Research topics at Thales Research and Technology: Small pixels and third generation applications

Recent results obtained on building blocks for future third generation infrared focal plane arrays (FPAs) are presented. Our approach concerning the FPA performance assessment and small pixels modelling is exposed. We also demonstrate the ability of the quantum well infrared photodetector technology to answer the needs for compact (20 μm pitch) polarimetric FPAs. Finally, we present our first results on mid-wave infrared detectors at wavelengths below 4.2 μm.     

集成式光读出FPA红外成像系统设计

本文对读出原理、像差要求、图谱质量进行深入研究,进而对读出技术进行深度整合与简化,实现光读出FPA红外成像系统小型化、轻量化、集成化。首先,从FPA的热-机械效应出发,介绍了光读出FPA红外成像系统的工作原理;然后,针对通常采用的光读出FPA红外成像系统体积大、重量大、结构复杂缺陷,提出了高集成度的新型光读出系统;接着,在分析讨论读出光路像差容限、特点的基础上,对以异形棱镜为核心元件的光读出系统进行了具体的光学仿真设计;最后,设计了集光、机、电、软技术的集成式光读出FPA红外成像系统。对系统样机测试结果表明:在确保成像性能的前提下,光读出FPA红外成像系统的体积减小到175 mm×83 mm×105 mm。以异形棱镜为核心元件的光读出技术,在满足成像精度和灵敏度的前提下,可减小读出系统的复杂程度,有效降低了光读出FPA红外成像系统的体积和重量,从而促进光读出FPA成像系统的工业化应用。     

基于LabVIEW的短波红外焦平面相对响应光谱测试系统

搭建了一套适用于短波红外焦平面的相对响应光谱自动测试系统。系统测试程序在LabVIEW虚拟仪器开发环境下完成,具备光栅单色仪的控制、数据采集处理与存储等功能。系统采用单光路标准代替法实现了相对响应光谱的校准。测试了InGaAs短波红外线列焦平面,得到了每个像元校准后的相对响应光谱,提取了峰值波长、截止波长等参数在线列上的分布情况,实现了对焦平面全像元的相对响应光谱测试。