原位退火温度对Mg_2Si薄膜结构及方块电阻的影响

采用磁控溅射法和原位退火工艺在钠钙玻璃衬底上制备Mg_2Si半导体薄膜.首先在钠钙玻璃衬底上依次溅射一定厚度的Si、Mg薄膜,冷却至室温后原位退火4h,在400~600℃退火温度下制备出一系列Mg_2Si薄膜样品.采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)对Mg_2Si薄膜样品的晶体结构和表面形貌进行表征,利用四探针测试仪测试薄膜样品的方块电阻,讨论了原位退火温度对Mg_2Si薄膜结构、表面形貌及电学性能的影响.结果表明,采用原位退火方式成功在钠钙玻璃衬底上制备出单一相的Mg_2Si薄膜,退火温度为550℃时,结晶度最好,连续性和致密性最强,方块电阻最小.这对后续Mg_2Si薄膜器件的设计与制备提供了重要的参考.     

掺Mo对NiSi薄膜热稳定性的改善

报导了在镍薄膜中掺入少量Mo提高了镍硅化物的热稳定性.结果表明，经650— 800℃快速热 退火形成的Ni(Mo)Si硅化物薄膜电阻值较低，约为2．4(Ω／□).XRD分析表明薄膜中只存在 NiSi相，而没有NiSi₂生成.由吉布斯自由能理论分析表明在Ni薄膜中掺人5．9 ％Mo对改善 Ni硅化物热稳定性起到至关重要的作用.经650—800℃快速热退火后的 Ni(Mo)Si／Si肖特基 二极管电学特性良好，势垒高度Φ_B为0．64—0．66eV，理想因子接近于1，更 进一步证明掺少量的Mo能够改善NiSi薄膜的热稳定性. 关键词： 镍硅化物 快速热退火 x射线衍射分析 卢瑟福背散射     

充氚不锈钢中氦行为的实验研究

对充氚和未充氚的抗氢-2不锈钢(HR-2)样品进行退火处理,利用正电子湮没寿命谱技术以及金相检验技术探讨不锈钢中氦和微缺陷的相互作用行为.未充氚样品中,影响正电子寿命值的主要因素为杂质元素在晶界的析出.充氚样品实验中,退火温度小于300℃时,正电子寿命值的增加说明了氦泡的形成过程为非热形成,通过“冲出位错环”机制形成及长大;退火温度在300~600℃之间,充氚样品正电子寿命值的降低以及He的跃迁概率的计算结果,说明He原子通过热迁移至晶界;退火温度大于600℃时,热平衡空位浓度的计算结果以及正电子寿命值的增加说明热平衡空位开始发挥作用.     

二氧化钒薄膜的低温制备及其性能研究

针对VO₂薄膜在微测辐射热计上的应用，采用射频反应溅射法，在室温下制备氧化钒薄膜；研究了氧分压对薄膜沉积速率、电学性质及成分的影响.通过调节氧分压，先获得成分接近VO₂的非晶化薄膜，再在400℃空气中氧化退火，便可制得高电阻温度系数，低电阻率的VO₂薄膜，电阻温度系数约为-4%/℃，薄膜方块电阻为R_□为100—300kΩ；薄膜在室温下沉积，400℃下退火的制备方法与微机电加工(micro electromechanic 关键词： 二氧化钒 电阻温度系数 氧分压 射频反应溅射法     

快速热退火和氢等离子体处理对富硅氧化硅薄膜微结构与发光的影响

采用microRaman散射、傅里叶变换红外吸收谱和光致发光谱研究了快速热退火及氢等离子体处理对等离子体增强化学气相沉积法200℃衬底温度下生长的富硅氧化硅(SRSO)薄膜微结构和发光的影响.研究发现,在300—600℃范围内退火,SRSO薄膜中非晶硅和SiOx∶H两相之间的相分离程度随退火温度升高趋于减小;而在600—900℃范围内退火,其相分离程度随退火温度升高又趋于增大;同时发现SRSO薄膜发光先是随退火温度的升高显著加强,然后在退火温度达到和超过600℃后迅速减弱;发光峰位在300℃退火后蓝移,此后随退火温度升高逐渐红移.对不同温度退火后的薄膜进行氢等离子体处理,发光强度不同程度有所增强,发光峰位有所移动,但不同温度退火样品发光增强的幅度和峰位移动的趋势不同.分析认为退火能够引起薄膜中非晶硅颗粒尺度、颗粒表面结构状态以及氢的存在和分布等方面的变化.结果表明不仅颗粒的尺度大小,而且颗粒表面的结构状态都对非晶硅颗粒能带结构和光生载流子复合机理发挥重要影响 关键词： 富硅氧化硅 微结构 发光 快速热退火     

退火温度对溶胶-凝胶法制备锌锡氧化物薄膜晶体管的影响

采用溶胶-凝胶法制备了非晶锌锡氧化物(ZTO)薄膜晶体管(TFT),通过热重-差热分析(TG-DTA)对ZTO胶体中的化学反应进行了分析,研究了不同退火温度对ZTO TFTs性能的影响。结果表明:当退火温度在300~500℃范围内时,薄膜为非晶态结构,薄膜表面致密、平整。当退火温度达到400℃时,薄膜在可见光范围内具有高透过率(>85%)。随着退火温度的升高,器件阈值电压明显降低,由15.85 V降至3.76 V,载流子迁移率由0.004 cm²·V^-1·s^-1提高到5.16 cm²·V^-1·s^-1,开关电流比达到10⁵。退火温度的升高明显改善了ZTO TFT的电学性能。     

AlGaN/GaN异质结Ni/Au肖特基表面处理及退火研究

采用O₂等离子体及HF溶液对AlGaN/GaN异质结材料进行表面处理后，Ni/Au肖特基接触特性比未处理有了明显改善，反向泄漏电流减小3个数量级.对制备的肖特基接触进行200—600℃ 5min的N₂气氛退火，发现退火冷却后肖特基反向泄漏电流随退火温度增大进一步减小.N₂气中600℃退火后肖特基二极管C-V特性曲线在不同频率下一致性变好，这表明退火中Ni向材料表面扩散减小了表面陷阱密度；C-V特性曲线随退火温度增大向右移动，从二维电子气耗尽电压绝对值减小反映了肖特基势垒的提高. 关键词： AlGaN/GaN 肖特基接触 表面处理 退火     

退火对非故意掺杂4H-SiC外延材料386 nm和388 nm发射峰的影响

10 K条件下,采用光致发光(PL)技术研究了不同退火处理后非故意掺杂4H-SiC外延材料的低温PL特性.结果发现,在370—400 nm范围内出现了三个发射峰,能量较高的峰约为3.26 eV,与4H-SiC材料的室温禁带宽度相当.波长约为386 nm和388 nm的两个发射峰分别位于~3.21 eV和~3.19 eV,与材料中的N杂质有关.当退火时间为30 min时,随退火温度的升高,386 nm和388 nm两个发射峰的PL强度先增加后减小,且退火温度为1573 K时,两个发射峰的PL强度均达到最大. 关键词： 光致发光 退火处理 能级 4H-SiC     

二氧化钛薄膜的制备及退火对其形貌、结构的影响

利用磁控溅射技术,在石英基片上沉积Ti膜,分别在400、600、700、900℃的大气中退火获得TiO2薄膜。采用这种制备方式获得的TiO2薄膜呈现不同的颜色,退火温度为400℃的样品为暗紫红色,600℃时为黑色,而在700℃和900℃时均为黄色。采用X射线衍射、扫描电子显微镜（SEM）以及Raman光谱等手段研究了退火温度对TiO2薄膜的结构和形貌的影响。结果表明：退火温度为400℃时,TiO2薄膜为锐钛矿相,温度升高至600℃时,几乎转变为金红石晶相,但仍存在微量锐钛矿相,温度升高至700℃以上,则完全转变为金红石晶相。由XRD衍射图可知退火温度为700℃和900℃时,薄膜的金红石相沿（101）晶面择优取向。     

Bi/Pb比和退火温度对Bi-Pb-Sr-Ca-Cu-O系超导材料的T_c(R=0)和高T_c相形成的影响

采用三步反应法制备 BiPbSrCaCuO 超导材料,研究了 Bi/Pb 比和退火温度对高 T_c 相形成和零电阻温度的影响.实验结果表明 Bi/Ph 最佳比例在1.8∶0.3附近,最优退火温度区间为845—855℃.较高的退火温度易形成一种变异的高 T_c 相,它是110K 的同结构相,其零电阻温度随着退火温度的升高而下降.     

Incorporation of the transition metal Hf into GaN

The perturbed angular correlation (PAC) technique was applied to study the incorporation of the transition metal Hf into GaN after implantation. To this end the PAC probe ¹⁸¹Hf(¹⁸¹Ta) was implanted into epitaxial Wurtzite GaN layers (1.3 μm on sapphire) with an energy of 160 keV and doses of 7× 10¹² at/cm². PAC spectra were recorded during an isochronal annealing programme, using rapid thermal annealing (RTA) and furnace annealing, in the 300–1000oC temperature range. After implantation the spectra show a damped oscillation corresponding to a quadrupole interaction frequency (QIF) of ν_Q= 340 MHz for 30% of the probe nuclei. Annealing up to 600oC reduces the damping of this frequency without an increase of the probe atom fraction f_s in these sites. Above 600oC f_s grows rapidly until after the 900oC RTA step more than 80% of the Hf probes experience a well defined QIF due to the incorporation of Hf on undisturbed sites of the hexagonal GaN wurtzite lattice. An interaction frequency of ν_Q= 340 MHz is derived. RTA and furnace annealing yield similar results for annealing up to 800oC, where the undisturbed fraction reaches about 60%. Then RTA at higher temperatures increases this fraction, while furnace annealing leads to a decrease down to 22% after annealing at 1000oC. To our knowledge this is the first time that a transition metal probe like Hf is incorporated to such a large extent into a semiconductor lattice. This revised version was published online in August 2006 with corrections to the Cover Date.     

Effects of rapid thermal annealing on the morphology and optical properity of ultrathin InSb film deposited on SiO2/Si substrate

Ultrathin InSb thin films on SiO₂/Si substrates are prepared by radio frequency (RF) magnetron sputtering and rapid thermal annealing (RTA) at 300, 400, and 500℃, respectively. X-ray diffraction (XRD) indicates that InSb film treated by RTA at 500℃, which is higher than its melting temperature (about 485℃), shows a monocrystalline-like feature. High-resolution transmission electron microscopy (HRTEM) micrograph shows that melt recrystallization of InSb film on SiO₂/Si(111) substrate is along the (111) planes. The transmittances of InSb films decrease and the optical band gaps redshift from 0.24 eV to 0.19 eV with annealing temperature increasing from 300℃ to 500℃, which is indicated by Fourier transform infrared spectroscopy (FTIR) measurement. The observed changes demonstrate that RAT is a viable technique for improving characteristics of InSb films, especially the melt-recrystallized film treated by RTA at 500℃.     

Synthesis and charge storage properties of double-layered NiSi nanocrystals

Based on bidirectional diffusion of Ni atoms, double-layered nickel silicide (NiSi) nanocrystals (NCs) for multilevel charge storage were fabricated, and their charge storage properties were examined. The double layer was produced by long-term thermal annealing (for 4 h at 900 °C) of a sandwich structure comprised of a thin Ni film of 0.3 nm sandwiched between two silicon-rich oxide (SiO_1.36) layers. Transmission electron microscopic image clearly exhibits a distinct NiSi nanocrystal double layer with a gap of about 7 nm between the mean positions of particle distribution in each NC layer. Capacitance–voltage measurements on the metal/oxide/semiconductor (MOS) capacitors with the double-layered NiSi nanocrystals are shown to have the apparent two plateaus of charge storage, the large memory window of about 9 V and the improved charge retention stability.     

B+注入HgCdTe快速热退火的研究

借助二次离子质谱和俄歇电子能谱对B⁺注入HgCdTe有无ZnS膜包封在快速热退火条件下表层的Hg损失进行了深入的分析-快速热退火温度为300，350和400℃，退火时间为10s-ZnS膜厚度为160nm-结果表明，300℃，10s快速热退火后，有ZnS膜包封的HgCdTe表层没有Hg损失-对B⁺注入HgCdTe N⁺-P结快速热退火工艺流程进行了优化-结果表明，快速热退火放在光刻金属电极之后进行，可以改善结的特性- 关键词：     

增强型AlGaN/GaN高电子迁移率晶体管高温退火研究

深入研究了两种增强型AlGaN/GaN高电子迁移率晶体管(HEMT)高温退火前后的直流特性变化.槽栅增强型AlGaN/GaN HEMT在500 ℃ N₂中退火5 min后,阈值电压由0.12 V正向移动到0.57 V,器件Schottky反向栅漏电流减小一个数量级.F注入增强型AlGaN/GaN HEMT在 400 ℃ N₂中退火2 min后,器件阈值电压由0.23 V负向移动到-0.69 V,栅泄漏电流明显增大.槽栅增强型器件退火过程中Schottky有效势垒     

氮化硅介质中双层纳米硅薄膜的两级电荷存储

研究镶嵌在超薄非晶氮化硅(a-SiN_x)层之间的双层纳米硅(nc-Si)的电荷存储现象.利用等离子体增强化学气相淀积(PECVD)技术在硅衬底上制备a-SiN_x/a-Si/a-SiN_x/a-Si/a-SiN_x多层薄膜结构.采用常规热退火方法使非晶硅(a-Si)层晶化，形成包含双层nc-Si的金属-氮化物-半导体(MIS)结构.通过电容电压(C-V)特性测量，观测到该结构中由于电荷存储引起的C-V回滞现象，并在室温下成功观察到载流子基于Fowler-Nordheim(F-N)隧穿注入到第一层、第二层nc-Si的两级电荷存储状态.结合电流电压(I-V)特性的测量，对电荷存储的机理进行了深入分析. 关键词： 纳米硅 氮化硅 电容电压法 电流电压法     

直拉单晶硅中洁净区形成后铜沉淀行为的研究

本文研究了直拉单晶硅中形成洁净区后过渡族金属杂质铜的沉淀行为. 样品经过高低高三步常规热处理形成洁净区后, 在不同温度下引入杂质铜, 然后对样品分别进行普通热处理和快速热处理, 通过腐蚀和光学显微镜研究发现, 在700 ℃引入铜杂质后经过普通热处理和快速热处理都不会破坏洁净区, 在900 ℃和1100 ℃引入铜杂质后经过普通热处理不会破坏洁净区, 而经过快速热处理会破坏洁净区. 研究表明, 快速热处理可以使硅片体内产生大量的空位, 空位的外扩散是破坏洁净区的主要原因. 关键词： 直拉单晶硅 铜沉淀 洁净区     

Quantum states in fabricating poly-Si films

The quantum states are presented in these processions of fabricating poly-Si films. Amorphous silicon films prepared by PECVD has been crystallized by conventional furnace annealing (FA) and rapid thermal annealing (RTA), respectively. It is found that the thin films grain size present quantum states with the increasing of the gas flow ratios of SiH₄, H₂ mixture, substrate temperatures, frequency power, annealing temperature and time.     

Thermal stability and electrical properties of Zr silicate films for high-k gate-dielectric applications, as prepared by pulsed laser deposition

Zirconium silicate films with high thermal stability and good electrical properties have been prepared on n-Si(100) substrates and commercially available Pt-coated Si substrates to fabricate metal–insulator–metal (MIM) structures by the pulsed laser deposition (PLD) technique using a Zr_0.69Si_0.31O_2- ceramic target. Rapid thermal annealing (RTA) in N₂ was performed. X-ray diffraction indicated that the films annealed at 800 °C remained amorphous. Differential thermal analysis revealed that amorphous Zr silicate crystallized at 830 °C. X-ray photoelectron spectroscopy showed that RTA annealing of Zr silicate films at 900 °C led to phase separation. The dielectric constant has been determined to be about 18.6 at 1 MHz by measuring the Pt/Zr silicate/Pt MIM structure. The equivalent oxide thicknesses (EOTs) and the leakage-current densities of films with 6-nm physical thickness deposited in O₂ and N₂ ambient were investigated. An EOT of 1.65 nm and a leakage current of 31.4 mA/cm² at 1-V gate voltage for the films prepared in N₂ and RTA annealed in N₂ at 800 °C were obtained. An amorphous Zr-rich Zr silicate film fabricated by PLD looks to be a promising candidate for future high-k gate-dielectric applications. PACS 77.55.+f; 81.15.Fg; 73.40.Qv