ZnO纳米线二极管发光器件制备及特性研究

运用液相法生长成ZnO纳米线薄膜，并利用肖特基型异质结的发光原理，构造成功肖特基型ZnO纳米线二极管发光器件.在大于6V直流电压驱动下，观察到近紫外波段392nm处和可见光波段525nm的发射谱带.从单向导电特性及ZnO纳米线材料的能带结构等方面探讨了该种器件的电致发光机理.     

ZnO纳米线双绝缘层结构电致发光器件制备及特性研究

在利用液相法生长ZnO纳米线薄膜的基础上，构造成功基于ZnO纳米线双绝缘层结构的交流电致发光器件.此器件呈现出良好的阻容特性，在室温下以一定频率的交流电压驱动，可观察到近紫外波段387 nm处和可见光波段552 nm处的发射谱带.从阻容结构的导电特性及ZnO纳米线材料的能带结构等方面探讨了这种器件的电致发光机理及频率特性.     

聚苯胺/ZnO纳米线薄膜材料作为发光层的柔性光电器件 及其发光机理

综合氧化锌纳米线(ZnO NWs)的光学活性与聚苯胺(PANI)的空穴传输特性,设计并制备了一种聚合物/ZnO纳米线电致发光材料,并对其发光特性进行了研究。通过高分子络合软模板法,将有序的单晶ZnO NWs均匀生长在覆有铟锡氧化物(ITO)涂层的柔性聚乙烯对苯二甲酸乙二醇酯(PET)衬底上并嵌入PANI薄膜,获得了电致发光薄膜材料和有机/无机异质结实验器件ITO/(ZnO NWs-PANI)。有机/无机异质结器件电致发光可调,在相对低的开启电压下呈现室温蓝紫外发光,并且ZnO NWs表面覆盖PANI增加了蓝紫外发光的强度和稳定性;而无PANI的ZnO NWs阵列具有450 nm处的缺陷发射峰,这可能是电子从扩展态锌间隙Zn_i到价带的跃迁引起的。这些结果表明,基于PANI/ZnO纳米线的复合材料在柔性光电器件方面的应用极具潜力。     

氧化锌纳米颗粒薄膜的近紫外电致发光特性研究

利用溶胶-凝胶法(sol-gel method)制备了ZnO纳米颗粒薄膜(ZnO nanoparticle film),并以此为发光层制备了结构为ITO/ZnO nanoparticle/MEH-PPV/LiF/Al的电致发光器件.通过调整器件发光层厚度,对器件的发光光谱和电学特性进行测试研究,发现该器件在一定的直流电压下可以得到以ZnO近紫外(中心波长390 nm)发光为主的电致发光光谱,显示出较好的ZnO近紫外电致发光特性.对该器件的发光机理进行了一定的研究,认为该器件的发光是基于载流子隧穿.     

基于氧化锌纳米线的紫外发光二极管

构建了基于n-ZnO纳米线/p-Si异质结的紫外发光二极管.ZnO纳米线准阵列采用水热法生长于重掺p型Si片上.此法简易，反应温度低，易于大规模生产；其产物ZnO纳米线结晶良好，以c轴为优势取向，光激发下的紫外荧光发射很强.二极管的电学接触采用聚合物填充的In阴极或以氧化铟锡(ITO)玻璃紧压形成阴极.它们的I-V特性体现出良好的二极管性质.在正向偏置电压驱动下，构建的发光二极管可稳定发射波长在387nm的较强的近紫外光和较弱的绿光. 关键词： ZnO纳米线 异质结 电致发光 水热法     

纳米ZnO薄膜对有机电致发光器件性能的影响

由于有机电致发光器件(Organic light-emitting devices,OLEDs)的主动发光、高亮度等优点,在显示和照明领域有极大的应用前景。报道了纳米ZnO薄膜对这种发光器件性能的影响。在普通有机电致发光器件空穴传输层和发光层之间直接蒸镀一层纳米ZnO薄膜,当纳米ZnO薄膜的厚度为1nm时,器件的电流效率可达3.26cd/A,是没有纳米ZnO薄膜同类器件的1.24倍。适当厚度的纳米ZnO薄膜降低了发光层空穴的浓度,提高了电子和空穴的平衡,从而提高了器件的效率。     

MEH-PPV/ZnO纳米晶无机有机复合电致发光器件的研究

以Ⅱ一Ⅵ族无机半导体ZnO纳米颗粒为电子传输层,MEH-PPV为空穴传输层兼发光层,得到的电致发光器件比单层MEH-PPV器件的发光亮度和效率都明显提高。器件结构为ITO／MEH-PPV／ZnO／Al的电致发光光谱同单层PPV器件的光谱出现了不同,在620nm处出现了一个小的发光峰,应该是ZnO的发光。另外,双层结构器件的启亮电压由单层器件的9V降到了4V左右。由I-V曲线及发光光谱可判断出发光区域应在MEH-PPV／ZnO界面处,并且复合区域可能随着电压的变化而变化。     

掺杂DCJTB聚合物电化学池（LEC）的发光性质

通过在聚合物电化学池(LEC)发光器件的发光材料MEH-PPV中掺杂红光染料DCJTB,对LEC器件的发光性质进行研究。基于器件结构为ITO/MEH-PPV PEO LiCF3SO3/Al的薄膜LEC器件,其电致发光峰在570nm左右,通过在MEH-PPV与PEO的混合膜中掺杂不同比例的红光染料DCJTB,随着掺杂比例的增加,器件的发光峰由570nm向红光波段移动,通过控制DCJTB的掺杂比例制备了发光峰在570~650nm连续变化的LEC电致发光器件。对其分析认为从LEC主体发光聚合物MEH-PPV到染料DCJTB间发生了良好的能量传递。     

Ag/ZnO纳米结构的荧光增强效应

利用化学合成方法制备了Ag纳米线和ZnO量子点。对这两种纳米结构的表面形貌、晶体结构和光学性质分别进行了研究。结果表明：Ag纳米线和ZnO量子点均为单晶结构,平均直径分别为160 nm和5 nm左右。将Ag纳米线混入ZnO量子点可以使其紫外荧光显著增强,其中位于345 nm和383 nm 的荧光分别增强30倍和12倍。这与Ag纳米线和ZnO量子点混合体系的局域表面等离子体共振耦合吸收峰位相一致,说明该体系存在两种共振耦合模式。该研究结果为将来开发ZnO基纳米发光器件提供了一条新的途径。     

n-ZnO/i-MgO/p-GaN异质结发光二极管

用等离子体辅助分子束外延的方法生长了n-ZnO/i-MgO/p-GaN异质结发光二极管。I-V测量表明其具有典型的二极管整流特性。电致发光峰位于382nm,通过与n型ZnO和p型GaN的光致发光谱比较,其发光峰位与线形都与ZnO的自由激子发射一致,表明该电致发光来自于ZnO的自由激子发射。通过Anderson模型比较了n-ZnO/i-MgO/p-GaN和n-ZnO/p-GaN异质结的能带示意图,证明了由于MgO层的插入抑制了ZnO向GaN层中的电子注入,且有利于空穴向ZnO层注入,从而实现了ZnO层中的电注入发光。     

组合材料方法研究膜厚对Ni/SiC电极接触性质的影响

采用组合材料方法研究了金属Ni膜厚对Ni/SiC接触性质的影响.16个膜厚均为18 nm的Ni/SiC电极具有较为一致的肖特基接触性质;膜厚从10 nm增加到160 nm,肖特基接触的电流-电压（I-V）曲线随膜厚发生显著变化.分析表明这种变化源于膜厚对理想因子n和有效势垒高度Ф_B的影响.1000℃快速退火后,这些肖特基接触都转变为欧姆接触,Ni₂Si是主要的生成物.I-V曲线测 关键词： 碳化硅 肖特基接触 欧姆接触 组合材料方法     

Temperature accelerated dielectric breakdown of PECVD low-k carbon doped silicon dioxide dielectric thin films

The dielectric breakdown strength of carbon doped silicon dioxide thin films with thickness d from 32 nm to 153 nm is determined at 25 °C, 50 °C, 100 °C, 150 °C and 200 °C, using I–V measurements with metal-insulator-semiconductor (MIS) structures. It is found that the dielectric breakdown strength, E_B, decreases with increasing temperature for a given film thickness. In addition, a film thickness dependence of breakdown is also observed, which is argued to show an inverse relation to thickness d in the form of E_B∝(d-d_c)^-n. The exponential parameter n and critical thickness limit d_c also exhibit temperature dependent behavior, suggesting a temperature accelerated electron trapping process. The activation energy for the temperature acceleration was shown to be thickness dependent, indicating a thickness dependent conduction mechanism. It is thereafter demonstrated that for relatively thick films (thickness >50 nm), the conduction mechanism is Schottky emission. For relatively thin films (thickness <50 nm), the Schottky conduction mechanism was obeyed at low field region while FN tunnelling was observed as a prevail one in the high field region. PACS 73.40.Qv     

Thermal annealing behaviour of Al/Ni/Au multilayer on n-GaN Schottky contacts

Recently GaN-based high electron mobility transistors (HEMTs) have revealed the superior properties of a high breakdown field and high electron saturation velocity. Reduction of the gate leakage current is one of the key issues to be solved for their further improvement. This paper reports that an Al layer as thin as 3 nm was inserted between the conventional Ni/Au Schottky contact and n-GaN epilayers, and the Schottky behaviour of Al/Ni/Au contact was investigated under various annealing conditions by current-voltage (I-V ) measurements. A non-linear fitting method was used to extract the contact parameters from the I-V characteristic curves. Experimental results indicate that reduction of the gate leakage current by as much as four orders of magnitude was successfully recorded by thermal annealing. And high quality Schottky contact with a barrier height of 0.875 eV and the lowest reverse-bias leakage current, respectively, can be obtained under 12 min annealing at 450 C in N2 ambience.     

Electro-optical characterization and analysis of CuPc-based solar cells with high photovoltage

Organic solar cells using the CuPc and PTCBI semiconductor layers were studied. A high open circuit voltage of 1.15 V was obtained in a device with ITO/PEDOT:PSS/CuPc (15 nm)/PTCBI (7 nm)/Al structure. Results were interpreted in terms of a modified CuPc-Al Schottky diode for the thin PTCBI case and a CuPc-PTCBI heterojunction for the thick PTCBI case. Also, the formation of a thin aluminum oxide layer under the aluminum electrode was postulated. This layer has a beneficial aspect wherein shunting losses are reduced and a high photovoltage is enabled. However, it adds greatly to the series resistance to a point where the short circuit current density is reduced. CuPc Schottky diodes with an ITO/PEDOT:PSS/CuPc/Al structure yielded a high V _oc of 900 mV for a CuPc layer of thickness 140 nm. The V _oc increased with increase in CuPc layer thickness.     

Au/TiO2 nanorod‐based Schottky‐type UV photodetectors

TiO₂ nanorods (NRs) were synthesized on fluorine‐doped tin oxide (FTO) pre‐coated glass substrates using hydrothermal growth technique. Scanning electron microscopy studies have revealed the formation of vertically‐aligned TiO₂ NRs with length of ～2 µm and diameter of 110–128 nm, homogenously distributed over the substrate surface. 130 nm thick Au contacts using thermal evaporation were deposited on the n‐type TiO₂ NRs at room temperature for the fabrication of NR‐based Schottky‐type UV photodetectors. The fabricated Schottky devices functioned as highly sensitive UV photodetectors with a peak responsivity of 134.8 A/W (λ = 350 nm) measured under 3 V reverse bias. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Barrier-height non-uniformities of PtSi/Si(111) Schottky diodes

The forward current-voltage characteristics of PtSi Schottky contacts on epitaxial n-type Si (111) is studied in the temperature range from 100 to 300 K. A current contribution in excess to that predicted by thermionic emission diffusion theory is caused by a few thousand patches of reduced Schottky barrier height in a device area of 3.14 mm². The typical lateral extent of these patches is 70–250 nm. It correlates with the size of surface bumps observed. The number of patches is reduced upon increasing the silicidation temperature up toT _siI=550°C. Possible non-uniformities of the typical crystallite grain size of 20 nm are not resolved due to effective pinch-off.     

Thermal stability of tungsten and tungsten nitride Schottky contacts to AlGaN/GaN

Thin tungsten nitride (WNx) films were produced by reactive DC magnetron sputtering of tungsten in an Ar-N2 gas mixture. The films were used as Schottky contacts on AlGaN/GaN heterostructures. The Schottky behaviours of WNx contact was investigated under various annealing conditions by current-voltage (I-V ) measurements. The results show that the gate leakage current was reduced to 10-6 A/cm2 when the N2 flow is 400 mL/min. The results also show that the WNx contact improved the thermal stability of Schottky contacts. Finally, the current transport mechanism in WNx/AlGaN/GaN Schottky diodes has been investigated by means of I-V characterisation technique at various temperatures between 300 K and 523 K. A TE model with a Gaussian distribution of Schottky barrier heights (SBHs) is thought to be responsible for the electrical behaviour at temperatures lower than 523 K.     

Electrical performance of gallium nitride nanocolumns

The electrical characterization of gallium nitride (GaN) nanocolumns with a length up to 1 μm and a diameter of about 30–80 nm grown on doped silicon is a challenge for nano analytics. To determine the conductivity of these nanocolumns, I–V characteristics were recorded by atomic force microscopy (AFM). To measure the conductivity of a single nanocolumn, a conductive AFM tip was placed at the top of the nanocolumn. The measured current/voltage characteristic of a single nanocolumn shows the typical performance of a Schottky contact, which is caused by the contact between the metallic AFM tip and the semiconductor material of the nanocolumn. The height of the Schottky barrier is dependent on the work function of the AFM tip metal used. The linear part of the curve was used to calculate the differential resistance, which was found to be about 13 Ω cm and slightly dependent on the diameter.     

Analysis of thermionic emission from electrodeposited Ni–Si Schottky barriers

Ni–Si Schottky barriers are fabricated by electrodeposition using n on n+ Si substrates. I–V, C–V and low temperature I–V measurements are presented. A high-quality Schottky barrier with extremely low reverse leakage current is revealed. The results are shown to fit an inhomogeneous barrier model for thermionic emission over a Schottky barrier proposed by Werner and Guttler [J.H. Werner, H.H. Guttler, Barrier inhomogeneities at Schottky contacts, J. Appl. Phys. 69 (3) (1991) 1522–1533]. A mean value of 0.76 V and a standard deviation of 66 mV is obtained for the Schottky barrier height at room temperature with a linear bias dependence. X-ray diffraction and scanning electron microscopy measurements reveal a polycrystalline Ni film with grains that span from the Ni–Si interface to the top of the Ni layer. The variation in Ni orientation is suggested as a possible source of the spatial distribution of the Schottky barrier height.