用SiCl4-H2低温沉积多晶硅薄膜微结构的Raman分析

用拉曼散射谱研究以SiCl4 H2 为气源 ,用射频辉光放电等离子体增强化学气相沉积技术 ,在 2 0 0℃低温下沉积多晶硅薄膜的微结构特征 .结果表明 ,薄膜表层包含有大量微晶相的纳米硅晶粒和非晶相的硅聚合物 ,随射频功率增加 ,晶相结构的成分增大 .另一方面 ,深度拉曼谱分布的研究也显示薄膜的晶化度和晶粒尺度随纵向深度的增加逐渐增大 .因此可以认为 ,在多晶硅薄膜生长的最初阶段 ,空间反应过程对低温晶化起重要作用 .     

电子助进化学气相沉积金刚石中发射光谱的蒙特卡罗模拟

采用蒙特卡罗方法，对源料气体为CH4/H2混合气的电子助进化学气相沉积（EACVD）中 的氢原子(H)、碳原子(C)以及CH基团的发射过程进行了模拟.研究了CH4浓度、反应室气压 和衬底偏压等工艺参数对发射光谱及成膜的影响.研究发现，CH基团可能是有利于金刚石薄 膜生长的活性基团，而碳原子不是；偏压的升高可提高电子平均温度及衬底表面附近氢原子 的相对浓度；通过氢原子谱线可测定电子平均温度并找到最佳成膜实验条件.该结果对EACVD 生长金刚石薄膜过程中实时监测电子平均温度，有效控制工艺条件，生长出高质量的金刚石 薄膜具有重要的意义. 关键词： 蒙特卡罗模拟 金刚石薄膜 发射光谱     

用SiCl4/H2气源沉积多晶硅薄膜光照稳定性的研究

对以SiH4/H2及SiCl4/H2为源气体、采用等离子体增强化学气相沉积技术制备的非晶硅薄膜和多晶硅薄膜进行了光照稳定性的研究.实验表明,制备的多晶硅薄膜并没有出现非晶硅中的光致衰减现象,其光电导、暗电导在光照过程中没有下降反而有所上升且电导率变化快慢受氢稀释度的制约.多晶硅薄膜的光照稳定性可能来源于高的晶化度及Cl元素的存在.     

螺旋波等离子体化学气相沉积纳米硅薄膜的光学发射谱研究

利用光学发射谱技术对螺旋波等离子体化学气相沉积纳米硅薄膜的等离子体内活性粒子的光发射特征进行了原位测量.研究了薄膜沉积过程中各实验参量对活性基团SiH^*， H^β以及H^α的发射谱强度的影响.实验结果表明，静态磁场的加入可显著提高反应气体 的解离效率 ；适当的氢稀释可以提高氢活性粒子的浓度，而过高的氢稀释比将使含硅活性基团浓度显著 减小；提高射频馈入功率整体上可以使各活性粒子的浓度增加，并有利于提高到达衬底表面 氢活性粒子的相对比例.结合螺旋波等离子体色散关系和等离子体特点对以上结果进行了分 析.该结果为螺旋波等离子体沉积纳米硅薄膜过程的理解及制备工艺参数的调整提供了基础 数据. 关键词： 光学发射谱 螺旋波等离子体化学气相沉积 纳米硅薄膜     

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利用微波电子回旋共振等离子体增强型化学气相沉积(ECR-PECVD)采用一步法直接在K9玻璃上低温沉积制备了多晶硅薄膜.研究了不同实验参数对薄膜沉积的影响,采用X射线衍射(XRD)、拉曼光谱、扫描电子显微镜(SEM)等实验分析方法对不同条件下制备的样品进行了晶体结构和表面形貌分析,并讨论了多晶硅薄膜沉积的最佳条件.实验结果表明,玻璃衬底上多晶硅薄膜呈柱状生长,并有一定厚度的非晶孵化层;较高氢气比例和衬底温度有利于结晶,薄膜的结晶率达到了62％;晶粒团簇的最大尺寸约为500nm.     

多晶硅薄膜低温生长中的表面反应控制

报道用SiF₄和H₂的间接微波等离子体化学气相沉积方法低温生长多晶硅(poly-Si)薄膜.实验发现,等离子体中的离子、荷电集团对薄膜生长表面的轰击是影响薄膜结晶质量的重要因素之一.通过外加偏压抑制这些荷电粒子的动能是控制表面生长反应、制备高质量ploy-Si薄膜的有效方法.在合适的外加偏压下制备的poly-Si薄膜,氢含量仅约为0.9at%,中心位于520cm^-1的Raman特征峰半高宽约为4.4cm^-1. 关键词： 多晶硅薄膜 低温生长 表面生长反应 外加偏压     

GaSb基PECVD法制备SiO2薄膜的应力研究

为了实现在GaSb衬底上获得低应力的SiO₂薄膜，研究了等离子体增强化学气相沉积法（PECVD）在晶格失配较大的GaSb衬底上沉积SiO₂薄膜的应力情况。通过改变薄膜沉积时的工艺条件，如反应温度、射频功率、反应压强、气体流量比，并基于曲率法模型，对镀膜前后的曲率半径进行了实验测量，利用Stoney公式计算相关应力值并绘制应力变化曲线。详细讨论了PECVD工艺条件的改变对SiO₂薄膜应力所产生的影响。同时通过在Si衬底上沉积SiO₂薄膜，对比分析了导致薄膜应力产生的因素及变化过程。实验结果表明，在沉积温度为300℃、射频功率为20 W、腔体压强为90 Pa、气体流量比SiH₄/N₂O为125/70 cm³·min^-1的工艺参数下，PECVD法在GaSb衬底上沉积的SiO₂薄膜应力相对较小。     

微晶硅薄膜高速沉积及电学性质的研究

采用甚高频等离子体增强化学气相沉积（VHF-PECVD）技术在高功率密度和高压强条件下,通过改变硅烷浓度和气体总流量对薄膜沉积参数进行了两因素优化,最终在硅烷浓度为45%,气体总流量为100 sccm条件下,获得沉积速率142 nm/s,电导激活能047 eV的优质硅薄膜;同时,通过单因素优化制备出沉积速率为21 nm/s的微晶硅薄膜.利用晶粒间界势垒模型和费米能级统计偏移模型对薄膜的电学特性和传导行为分别进行了研究分析,同时初步分析了“后氧化”对薄膜电学性能的影响. 关键词： μc-Si:H 甚高频等离子体增强化学气相沉积 高速沉积 电学特性     

热丝法气相沉积纳米金刚石薄膜

纳米金刚石薄膜的沉积实验在自行研制的热丝化学气相沉积系统上完成。基体为金刚石微粉研磨和酸蚀后的硬质合金片，反应气体为CH4和H2混合气，V（CH4）：V（H2）=1％-4％，基体温度800-1000℃，沉积时气压为0．8～2．0kPa。SEM观察表明，影响金刚石膜的表面形貌及粗糙度的关键参量是基体温度、反应气压及含炭气体的浓度，这些参数都会影响到薄膜的纯度、结晶习性和晶面完整性。沉积纳米金刚石薄膜工艺是通过高密度形核以及抑制金刚石膜在沉积过程中的晶粒长大来实现的。     

甚高频高速沉积微晶硅薄膜的研究

采用甚高频化学气相沉积(VHF-PECVD)技术制备了系列微晶硅(μc-Si:H)薄膜样品，重点研究了硅烷浓度、功率密度、沉积气压和气体总流量对薄膜沉积速率和结晶状态的影响,绘制了沉积气压和功率密度双因素相图. 以0.75nm/s的高速沉积了器件质量级的微晶硅薄膜，并以该沉积速率制备出了效率为5.5%的单结微晶硅薄膜电池. 关键词： 微晶硅薄膜 高速沉积 甚高频化学气相沉积     

Spatial distribution of SiCln （n=O-2） in SICl4 plasma measured by mass spectroscopy

For a better understanding of the deposition mechanism of thin films in SiCl4 source gas, we have measured the spatial distributions of SiCln （n=0-2） radicals in SICl4 radio frequency glow discharge plasma utilizing a mass spectrometer equipped with a movable gas sampling apparatus. The experimental results demonstrate that the relative densities of SiCln （n=0-2） radicals have peak values at the position of 10 mm above the powered electrode along the axial direction; the relative densities of the Si and SiCIn （n=1, 2） radicals have peak values at the positions of 27mm and 7 mm away from the axis along the radial direction, respectively. Generally speaking, in the whole SICl4 plasma bulk region, the relative density of Si is one order of magnitude higher than that of SICl, and the relative density of SiCl is several times higher than that of SICl2. This reveals that Si and SiCl may be the primary growth precursors in forming thin films.     

Low-temperature plasma enhanced atomic layer deposition of large area HfS_2 nanocrystal thin films

Hafnium disulfide(HfS2) is a promising two-dimensional material for scaling electronic devices due to its higher carrier mobility, in which the combination of two-dimensional materials with traditional semiconductors in the framework of CMOS-compatible technology is necessary. We reported on the deposition of HfS2 nanocrystals by remote plasma enhanced atomic layer deposition at low temperature using Hf(N(CH3)(C2H5))4 and H2S as the reaction precursors. Selflimiting reaction behavior was observed at the deposition temperatures ranging from 150℃ to 350℃, and the film thickness increased linearly with the growth cycles. The uniform HfS2 nanocrystal thin films were obtained with the size of nanocrystal grain up to 27 nm. It was demonstrated that higher deposition temperature could enlarge the grain size and improve the HfS2 crystallinity, while causing crystallization of the mixed HfO2 above 450℃. These results suggested that atomic layer deposition is a low-temperature route to synthesize high quality HfS2 nanocrystals for electronic device or electrochemical applications.     

Silicon grain arrays prepared using a pattern crystallization technique of pulsed-excimer laser irradiation

Silicon grain arrays were prepared using a pattern crystallization technique of pulsed KrF excimer laser irradiation. The precursor material was hydrogenated amorphous silicon (a-Si:H) thin films deposited on single crystal Si wafers by plasma-enhanced chemical vapor deposition. It was shown that Si grains with a uniform size and a well-defined periodicity embedded in the a-Si:H matrix were obtained by this simple technique. The grain size was less than 2 μm. Relativly strong photo-luminescence with two peaks at 720 and 750 nm was observed at room temperature. We expect to reduce Si grain sizes by optimizing the growth conditions of a-Si:H thin films and controlling the temperature distribution in the film during laser irradiation. Received: 21 November 2000 / Accepted: 12 December 2000 / Published online: 9 February 2001     

Study of the gas-phase parameters affecting the silicon-oxide film deposition induced by an ArF laser

A study of the gas-phase parameters involved in ArF laser induced chemical vapour deposition of silicon-oxide thin films is presented. A complete set of experiments has been performed showing the influence of the concentration of the precursor gases, N₂O and SiH₄, and their influence on total and partial pressures on film growth and properties. In this paper we demonstrate the ability of this LCVD method to deposit silicon oxide films of different compositions and densities by appropriate control of gas composition and total pressure. Moreover, a material specific calibration plot comprising data obtained using different preparation techniques is presented, allowing determination of the stoichiometry of SiO _x films by using FTIR spectroscopy independently of the deposition method. For the range of processing conditions examined, the experimental results suggest that chemical processes governing deposition take place mainly in the gas phase.     

Preparation of hydrogenated microcrystalline silicon films with hot-wire-assisted MWECR-CVD system

Intrinsic hydrogenated microcrystalline silicon （μc-Si：H） films have been prepared by hot-wire-assisted microwave electron-cyclotron-resonance chemical vapour deposition （HW-MWECR-CVD） under different deposition conditions, Fourier-transform infrared spectra and Raman spectra were measured. Optical band gap was determined by Tauc plots, and experiments of photo-induced degradation were performed. It was observed that hydrogen dilution plays a more essential role than substrate temperature in microcrystalline transformation at low temperatures. Crystalline volume fraction and mean grain size in the films increase with the dilution ratio （R=H2/（H2＋SiH4））. With the rise of crystallinity in the films, the optical band gap tends to become narrower while the hydrogen content and photo-induced degradation decrease dramatically. The samples, were identified as μc-Si：H films, by calculating the optical band gap. It is considered that hydrogen dilution has an effect on reducing the crystallization activation energy of the material, which promotes the heterogeneous solid-state phase transition characterized by the Johnson-Mehl-Avrami （JMA） equation. The films with the needed structure can be prepared by balancing deposition and crystallization through controlling process parameters.     

化学沉淀法制备硒化铅薄膜

采用化学沉淀的方法沉淀PbSe薄膜,分别加入缓冲剂联氨(方法A)和碘化钾(方法B)。对反应原理进行了分析,对制备过程进行了优化,分别制备出了高质量的PbSe薄膜。采用XRD、SEM、EDS以及红外光谱测试对所制备样品进行了分析。结果表明,两种方法制备均为PbSe多晶薄膜,方法A制备薄膜结晶质量更好,择优生长方向明显;薄膜颗粒度、表面粗糙度都小于方法B;两种薄膜的Pb元素与Se元素比例接近化学计量比,方法B含有少量I元素;两种方法制备样品的吸收边相对带边跃迁都发生蓝移。     

The structural properties of Al doped ZnO films depending on the thickness and their effect on the electrical properties

In this study, the structural and electrical properties of AZO films with different film thickness deposited by r.f. magnetron sputtering were interpreted in relation with film growth process. The result shows that the grain size increases during film growth, which is accompanied by decrease of compressive stress, indicating the enhancement of crystallinity. The relationship between grain size and compressive stress follows the same tendency for the samples regardless of deposition temperature, which implies the strong dependencies between the grain size and the compressive stress. The XPS analysis shows that the defects such as chemisorbed oxygen and segregated Al₂O₃ cluster at grain boundary are reduced with increase of film thickness or deposition temperature, leading to increase of carrier concentration and mobility. The mobility increase is accompanied by grain size increase and compressive stress reduction, indicating the influences of grain boundary and crystallinity on the mobility.     

a-C:F薄膜的热稳定性与光学带隙的关联

以CF4和C6H6的混合气体作为气源,在微波电子回旋共振化学气相沉积(ECRCVD)装置中制备了氟化非晶碳薄膜(aC:F),并在N2气氛中作了退火处理以考察其热稳定性.通过傅里叶变换红外吸收谱和紫外可见光谱获得了薄膜中CC双键的相对含量和光学带隙,发现膜中CC键含量与光学带隙之间存在着密切的关联,在高微波功率下沉积的氟化非晶碳膜具有低的光学带隙和较好的热稳定性. 关键词： 氟化非晶碳膜 光学带隙 退火温度 热稳定性     

Surface modification without desorption: recycling of Cl on Si(100)-(2 x 1)

We demonstrate chlorine-induced modification of Si(100)-(2 x 1) under conditions where Cl is recycled rather than desorbed as SiCl2. A dimer with 2 Cl atoms, 2SiCl, converts to SiCl2+Si, allowing the bare Si atom to escape onto the terrace. At temperatures below the desorption threshold, the SiCl2 unit decays through Cl diffusion, allowing the second Si atom to escape. The result is a dimer vacancy, terrace regrowth structures, and Cl that is able to participate in another pitting event. Access to this unexpected roughening pathway is controlled by the Cl concentration and temperature. This previously overlooked process represents an important component of Si(100) surface processing.     

FTIR监测金刚石薄膜生长的研究

用电子回旋共振等离子体(ECR)系统,在气压、衬底温度以及微波功率等外界条件不变的情况下,仅改变甲烷浓度制备金刚石薄膜,利用傅里叶红外吸收光谱仪(FTIR)对甲烷浓度为6%的ECR系统进行实时监测,分析研究了不同沉积时间条件下,甲烷和氢气产生的等离子体对薄膜早期成核、生长过程以及衬底的影响,并结合Raman光谱X射线衍射(XRD)和扫描电镜(SEM)对金刚石薄膜进行了分析。