Effect of annealing temperature on the electrical properties of Au/Ta2O5/n-GaN metal–insulator–semiconductor (MIS) structure

We report on the effect of an annealing temperature on the electrical properties of Au/Ta₂O₅/n-GaN metal–insulator–semiconductor (MIS) structure by current–voltage (I–V) and capacitance–voltage (C–V) measurements. The measured Schottky barrier height (Φ _bo) and ideality factor n values of the as-deposited Au/Ta₂O₅/n-GaN MIS structure are 0.93 eV (I–V) and 1.19. The barrier height (BH) increases to 1.03 eV and ideality factor decreases to 1.13 upon annealing at 500 ^°C for 1 min under nitrogen ambient. When the contact is annealed at 600 ^°C, the barrier height decreases and the ideality factor increases to 0.99 eV and 1.15. The barrier heights obtained from the C–V measurements are higher than those obtained from I–V measurements, and this indicates the existence of spatial inhomogeneity at the interface. Cheung’s functions are also used to calculate the barrier height (Φ _bo), ideality factor (n), and series resistance (R _s ) of the Au/Ta₂O₅/n-GaN MIS structure. Investigations reveal that the Schottky emission is the dominant mechanism and the Poole–Frenkel emission occurs only in the high voltage region. The energy distribution of interface states is determined from the forward bias I–V characteristics by taking into account the bias dependence of the effective barrier height. It is observed that the density value of interface states for the annealed samples with interfacial layer is lower than that of the density value of interface states of the as-deposited sample.     

Electrical properties and conduction mechanism of an organic-modified Au/NiPc/n-InP Schottky barrier diode

The effect of nickel phthalocyanine (NiPc) organic interlayer on the electronic parameters of Au/n-InP Schottky contacts has been investigated using current–voltage (I–V) and capacitance–voltage (C–V) measurements. Measurements showed that the barrier heights and ideality factors are 0.58 eV (I–V), 0.69 eV(C–V) and 1.32 for Au/n-InP Schottky contact and 0.80 eV (I–V), 1.12 eV (C–V) and 1.73 for Au/NiPc/n-InP Schottky contact, respectively. Experimental results show that the interfacial layer of NiPc increases the effective barrier height by the influence of the space charge region of the Au/n-InP Schottky junction. Further, Cheung’s and modified Norde functions are used to extract the barrier height, series resistance and ideality factors. The discrepancy between barrier heights estimated from I–V to C–V methods is also explained. Moreover, the energy distribution of interface state density is determined from the forward bias I–V data. Results show that the interface states and series resistance play an important role on electrical properties of the structures studied. The reverse leakage current conduction mechanism is investigated. Results reveal that the Schottky conduction mechanism is found to be dominant in the Au/n-InP Schottky contact. However, in the case of Au/NiPc/n-InP Schottky contact, the Schottky conduction mechanism is found to be dominant in the higher bias region, while Poole–Frenkel conduction is found to be dominant in the lower bias region.     

Effect of annealing on the electronic parameters of Au/poly(ethylmethacrylate)/n-InP Schottky diode with organic interlayer

A thin poly(ethylmethacrylate) (PEMA) layer is deposited on n-InP as an interlayer for electronic modification of Au/n-InP Schottky structure. The electrical properties of Au/PEMA/n-InP Schottky diode have been investigated by current–voltage (I–V) and capacitance–voltage (C–V) measurements at different annealing temperatures. Experimental results show that Au/PEMA/n-InP structure exhibit a good rectifying behavior. An effective barrier height as high as 0.83 eV (I–V) and 1.09 eV (C–V) is achieved for the Au/PEMA/n-InP Schottky structure after annealing at 150 °C compared to the as-deposited and annealed at 100 and 200 °C. Modified Norde's functions and Cheung method are also employed to calculate the barrier height, series resistance and ideality factors. Results show that the barrier height increases upon annealing at 150 °C and then slightly decreases after annealing at 200 °C. The PEMA layer increases the effective barrier height of the structure as this layer creates a physical barrier between the Au metal and the n-InP. Terman's method is used to determine the interface state density and it is found to be 5.141 × 10¹² and 4.660 × 10¹² cm^?2 eV^?1 for the as-deposited and 200 °C annealed Au/PEMA/n-InP Schottky diodes. Finally, it is observed that the Schottky diode parameters change with increasing annealing temperature.     

Effects of ageing on the electrical characteristics of Cd/CdS/n-Si/Au–Sb structure deposited by SILAR method

Cd/CdS/n-Si/Au–Sb structure has been fabricated by the Successive Ionic Layer Adsorption and Reaction (SILAR) method and the influence of the time dependent or ageing on the characteristic parameters are examined. The current–voltage (I–V), capacitance–voltage (C–V) and capacitance–frequency (C–f) characteristics of the structure have been measured immediately, 1, 3, 5, 15, 30, 45, 60, 75, 90, 105, 120, 135, 150 and 165 days after fabrication of the structure. The characteristic parameters of the structure such as barrier height, ideality factor, series resistance are calculated from the I–V measurements and the barrier height, carrier concentration values are calculated from reverse bias C^?2–V measurements at 500 kHz and room temperature. Furthermore, the density distribution and time constant of the interface states have been calculated from the C–f measurements using the Schottky Capacitance Spectroscopy method as a function of ageing time. It has been seen that the changes of characteristic parameters such as barrier height, ideality factor and series resistance of Cd/CdS/n-Si/Au–Sb structure have lightly changed with increasing ageing time. At the same time, the rectifying ratio of the device increases with ageing time. It can be clearly said that the I–V characteristics of device get better with time.     

Investigation of electrical and photovoltaic properties of Au/poly(propylene glycol)-b-polystyrene/n-Si diode at various illumination intensities

Electrical and photovoltaic properties of Au/poly(propylene glycol)-b-polystyrene/n-Si diode were investigated under various illumination intensities. Field emission scanning electron microscope micrographs of the interfacial polymer layer were provided for verification of the nano-fibre pattern. The current–voltage (I–V) measurements of the diode in the dark and under various illumination intensities (50–250?mW/cm²) were carried out and the main electrical parameters of the diode such as leakage current (I₀), ideality factor (n), zero-bias barrier height (Φ_B0), series and shunt resistance (R_s and R_sh), density of surface states (N_ss), open circuit voltage (V_oc) and short-circuit current (I_sc) were obtained in these conditions.     

Analysis of current–voltage and capacitance–voltage characteristics of perylene-monoimide/n-Si Schottky contacts

The electrical and interface state properties of Au/perylene-monoimide (PMI)/n-Si Schottky barrier diode have been investigated by current–voltage (I–V) and capacitance–voltage (C–V) measurements at room temperature. A good rectifying behavior was seen from the I–V characteristics. The series resistance (R_s) values were determined from I–V and C–V characteristics and were found to be 160 Ω and 53 Ω, respectively. The barrier height (Φ_b) of Au/PMI/n-Si Schottky diode was found to be 0.694 eV (I–V) and 0.826 eV (C–V). The ideality factor (n) was obtained to be 4.27 from the forward bias I–V characteristics. The energy distribution of interface state density (N_ss) of the PMI-based structure was determined, and the energy values of N_ss were found in the range from E_c ? 0.508 eV to E_c ? 0.569 eV with the exponential growth from midgap toward the bottom of the conduction band. The values of the N_ss without R_s are 2.11 × 10¹² eV^?1 cm^?2 at E_c ? 0.508 eV and 2.00 × 10¹² eV^?1 cm^?2 at E_c ? 0.569 eV. Based on the above results, it is clear that modification of the interfacial potential barrier for metal/n-Si structures has been achieved using a thin interlayer of the perylene-monomide.     

Analysis of interface states and series resistance for Al/PVA:n-CdS nanocomposite metal–semiconductor and metal–insulator–semiconductor diode structures

This paper presents the fabrication and characterization of Al/PVA:n-CdS (MS) and Al/Al₂O₃/PVA:n-CdS (MIS) diode. The effects of interfacial insulator layer, interface states (N _ss ) and series resistance (R _s ) on the electrical characteristics of Al/PVA:n-CdS structures have been investigated using forward and reverse bias I–V, C–V, and G/w–V characteristics at room temperature. Al/PVA:n-CdS diode is fabricated with and without insulator Al₂O₃ layer to explain the effect of insulator layer on main electrical parameters. The values of the ideality factor (n), series resistance (R _s ) and barrier height (? _b ) are calculated from ln(I) vs. V plots, by the Cheung and Norde methods. The energy density distribution profile of the interface states is obtained from the forward bias I–V data by taking into account the bias dependence ideality factor (n(V)) and effective barrier height (? _e ) for MS and MIS diode. The N _ss values increase from mid-gap energy of CdS to the bottom of the conductance band edge for both MS and MIS diode.     

Investigation of current–voltage and capacitance–voltage characteristics of Ag/perylene-monoimide/n-GaAs Schottky diode

Ag/perylene-monoimide(PMI)/n-GaAs Schottky diode was fabricated and the current–voltage (I–V) characteristics at a wide temperature range between 75 and 350 K and also the capacitance–voltage (C–V) characteristics at room temperature for 1 MHz have been analyzed in detail. The measured I–V characteristics exhibit a good rectification behavior at all temperature values. By using standard analysis methods, the ideality factor and the barrier height are deduced from the experimental data and also the variations of these parameters with the temperature are analyzed. In addition, by means of the Cheung and Cheung method, the series resistance and some other electrical properties are calculated for the diode. Finally, capacitance–voltage characteristics of device have been analyzed at the room temperature. From analyzing the capacitance measurements, Schottky barrier height is determined and then compared with the value which calculated from the I–V measurements at room temperature. Also, the concentration of ionized donors, built-in potential and some other parameters of diode are found using C–V characteristics.     

Fabrication and electrical characterization of Au/p-Si/STO/Au contact

Au/STO/p-Si/Au structure is fabricated using pulsed laser deposition technique at room temperature. The current–voltage (I–V) characteristics of the device show rectification behavior. Various junction parameters such as ideality factor, barrier height and series resistance is determined using conventional forward bias I–V characteristics, Cheung method and Norde’s function. Au/STO/p-Si/Au structure shows non-ideal diode characteristics with the value of ideality factor of ∼5.1 and barrier height of ∼0.40 eV.     

Effect of series resistance and interface states on the I-V, C-V and G/ω-V characteristics in Au/Bi-doped polyvinyl alcohol (PVA)/n-Si Schottky barrier diodes at room temperature

The forward and reverse bias current-voltage (I-V), capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the Au/PVA (Bi-doped)/n-Si Schottky barrier diodes (SBDs) have been investigated at room temperature by taking the interface states (N_ss) and series resistance (R_s) effects into account. The voltage dependent profiles of resistance (R_i) were obtained from both the I-V and C/G-V measurements by using Ohm’s Law and Nicollian methods. The obtained values of R_i with agreement each other especially at sufficiently high bias voltages which correspond the value of R_s of the diode. Therefore, the energy density distribution profile of N_ss was obtained from the forward bias I-V data taking the bias dependence of the effective barrier height (BH) Φ_e and R_s into account. The high value of ideality factor (n) was attributed to high density of N_ss and interfacial polymer layer at metal/semiconductor (M/S) interface. In order to examine the frequency dependence of some of the electrical parameters such as doping donor concentration (N_D), Φ_e, R_s and N_ss values, C-V and G/ω-V measurements of the diode were performed at room temperature in the frequency range of 50 kHz-5 MHz. Experimental results confirmed that the N_ss, R_s and interfacial layer are important parameters that influence electrical characteristics of SBD.     

Comparison of electrical parameters of Zn/p-Si and Sn/p-Si Schottky barrier diodes

In this study, current-voltage (I-V) and capacitance-voltage (C-V) characteristics of metal-semiconductor (MS) Zn/p-Si and Sn/p-Si Schottky diodes, with high resistivity silicon structures, are investigated. The parameters of series resistance (R_S), the ideality factor (n) and the barrier height (Φ_b) are determined by performing different plots from the forward bias current-voltage (I-V) and reverse bias capacitance-voltage (C-V) characteristics. Thus, the barrier heights (Φ_b) for the Si Schottky diodes obtained between 0.725 and 1.051 eV, the ideality factor (n) between 1.043 and 1.309, and the series resistance (R_S) between 12.594 and 12.950 kΩ. The energy distribution of interface states density was determined from the forward bias I-V characteristics by taking into account the bias dependence of the effective barrier height. It was concluded that the density of interface states in the considered energy range are in close agreement with each other values obtained for Zn/p-Si and Sn/p-Si Schottky diodes.     

Molecular control over Ag/p-Si diode by organic layer

Electrical transport properties of Ag metal-fluorescein sodium salt (FSS) organic layer-silicon junction have been investigated. The current-voltage (I-V) characteristics of the diode show rectifying behavior consistent with a potential barrier formed at the interface. The diode indicates a non-ideal I-V behavior with an ideality factor higher than unity. The ideality factor of the Ag/FSS/p-Si diode decreases with increasing temperature and the barrier height increases with increasing temperature. The barrier height (φ_b=0.98 eV) obtained from the capacitance-voltage (C-V) curve is higher than barrier height (φ_b=0.72 eV) derived from the I-V measurements. The barrier height of the Ag/FSS/p-Si Schottky diode at the room temperature is significantly larger than that of the Ag/p-Si Schottky diode. It is evaluated that the FSS organic layer controls electrical charge transport properties of Ag/p-Si diode by excluding effects of the SiO₂ residual oxides on the hybrid diode.     

Characterization of Al/Si junctions on Si(100) wafers with chemical vapor deposition-based sulfur passivation

Chemical vapor deposition-based sulfur passivation using hydrogen sulfide is carried out on both n-type and p-type Si(100) wafers. Al contacts are fabricated on sulfur-passivated Si(100) wafers and the resultant Schottky barriers are characterized with current–voltage (I–V), capacitance–voltage (C–V) and activation-energy methods. Al/S-passivated n-type Si(100) junctions exhibit ohmic behavior with a barrier height of <0.078 eV by the I–V method and significantly lower than 0.08 eV by the activation-energy method. For Al/S-passivated p-type Si(100) junctions, the barrier height is ~0.77 eV by I–V and activation-energy methods and 1.14 eV by the C–V method. The discrepancy between C–V and other methods is explained by image force-induced barrier lowering and edge-leakage current. The I–V behavior of an Al/S-passivated p-type Si(100) junction remains largely unchanged after 300 °C annealing in air. It is also discovered that heating the S-passivated Si(100) wafer before Al deposition significantly improves the thermal stability of an Al/S-passivated n-type Si(100) junction to 500 °C.     

Photovoltaic characteristics of Au/PVA (Bi-doped)/n-Si Schottky barrier diodes (SBDs) at various temperatures

The charge conduction properties of the Au/PVA (Bi-doped)/n-Si Schottky barrier diodes (SBDs) were investigated using current–voltage–temperature (I–V–T) measurements in dark and under various illumination levels. For this purpose, the main diode parameters such as reverse-saturation current (I_o), zero-bias barrier height (Φ_Bo), ideality factor (n), series resistance (R_s) and shunt resistance (R_sh) of diode were obtained as function of temperature and illumination level. Experimental results show that all of these electrical parameters are strong functions of illumination and temperature. The change in all electrical parameters becomes more important at low temperatures and illumination levels. While the n value decreases with increasing temperature and illumination level, Φ_Bo value increases. The fill factor (FF = V_m·I_m/V_oc·I_sc) values were obtained as 0.34 at 80 K and 0.40 at 320 K under 50 W and these values are near to a photodiode. Therefore, the fabricated diode can be used as a photodiode in optoelectronic applications. The forward bias I–V characteristics of the diode have also been explained by the space charge limited current (SCLC) model.     

Temperature dependence and the effect of hydrogen peroxide on ITO/poly-ZnO Schottky diodes fabricated by laser evaporation

Transparent and efficient poly-ZnO ultraviolet Schottky diodes grown at different temperatures with indium-tin-oxide (ITO) as the metallic contact layer were fabricated with hydrogen peroxide (H₂O₂) applied as a surface treatment at 70 °C for 20 min. Analysis via field-emission scanning electron microscopy (FESEM) and X-ray photoelectron spectroscopy (XPS) demonstrated that the ZnO films underwent gradual oxidation and that H₂O₂ treatment resulted in an interfacial ZnO₂ layer that covered the ZnO surface. I–V measurements indicated that the ideality factor and the Schottky barrier height improved with increasing shunt resistance, and the trade-off between film quality and the degree of oxidation revealed that films grown at 400 °C exhibited the best diode characteristics.     

Two diodes model and illumination effect on the forward and reverse bias I–V and C–V characteristics of Au/PVA (Bi-doped)/n-Si photodiode at room temperature

The forward and reverse bias current–voltage (I–V), capacitance/conductance–voltage (C/G–V) characteristics of the fabricated Au/PVA (Bi-doped)/n-Si photodiode have been investigated both in dark and under 250 W illumination intensity at room temperature. The energy density distribution profile of N_ss was extracted from the forward bias I–V measurements by taking the voltage dependence of effective barrier height (Φ_e) and R_s for photodiode both in dark and under 250 W illumination cases. The exponential growth of the N_ss from midgap toward the bottom of the conductance band is very apparent for two cases. The obtained high value of n and R_s were attributed to the particular distribution of N_ss at metal/PVA interface, surface and fabrication processes, barrier inhomogeneity of interfacial polymer layer and the form of barrier height at M/S interface. While the values of C and G/w increase R_s and R_sh decrease under illumination, due to the illumination induced electron–hole pairs in depletion region. The voltage dependent N_ss profile was also obtained from the dark and illumination capacitance at 1 MHz and these values of N_ss are in good agreement. In addition, the fill factor (FF) under 250 W illumination level was found as 28.5% and this value of FF may be accepted sufficiently high. Thus, the fabricated Au/PVA (Bi-doped)/n-Si structures are more sensitive to light, proposing them as a good candidate as a photodiode or capacitance sensor for optoelectronic applications in modern electronic industry.     

Effects of chemical treatment on barrier height and ideality factors of Au/GaN Schottky diodes

We have studied Au/n-GaN Schottky barrier diodes. GaN surfaces have been prepared by cleaning in HCl and (NH₄)₂S prior to metal deposition. The zero-biased barrier heights and ideality factors obtained from the current-voltage characteristics differ from diode to diode, although all the samples were prepared identically. The statistical analysis for the reverse bias C-V data yielded mean value of (1.35±0.04) eV for Schottky barrier height of HCl treated sample and (1.20±0.03) eV for (NH₄)₂S sample, where 9 dots were considered from each cleaning method. It was found that the barrier height values obtained from the C⁻²-V (1.43 eV) and I-V characteristics (0.89 eV) are different from each other by 0.54 eV. The inhomogeneous barrier heights were found to be related to the effect of the high series resistance on diode parameters (Akkiliç et al., 2004) [1].     

Electrical characterization of Au/poly (linoleic acid)-g-poly(methyl methacrylate) (PLiMMA)/n-Si diode in dark and under illumination

In this study, poly (linoleic acid)-g-poly(methyl methacrylate) (PLiMMA) graft copolymer is used as an interfacial layer in a Schottky diode for the first time. Au/poly (linoleic acid)-g-poly(methyl methacrylate) (PLiMMA)/n-Si diode was fabricated and main electrical characteristics of the diode were investigated using I–V measurements in dark and under illumination at room temperature. Ideality factor (n), barrier height (Φ_B0) and serial resistance (R_s) values of the diode were found as 2.8, 0.87 eV and 8096 Ω for dark, and 6.3, 0.71 eV and 676 Ω for 100 mW/cm² illumination intensity. Also, the reasons of deviation from ideal thermionic emission theory were investigated using Cheung&Cheung method and Card&Rhoderick's function which are used for calculating voltage dependence of barrier height (Φ_B(V)), series resistance (R_s) and number of surface states (N_ss) of the Au/PLiMMA/n-Si diode.     

Electronic and interface state density distribution properties of Ag/p-Si Schottky diode

Electronic and interface state distribution properties of Ag/p-Si Schottky diode have been investigated. The diode indicates non-ideal current-voltage behavior with an ideality factor greater than unity. The capacitance-voltage (C-V) characteristic is linear in reverse bias indicating rectification behavior and charge density within depletion layer is uniform. From I-V and C-V characteristics, junction parameters such as diode ideality factor and barrier height were found as 1.66 and ?_B(I-V) = 0.84 eV (?_B(C-V) = 0.90 eV), respectively. The interface state density N_ss and relaxation time τ of the Schottky diode were determined by means of Schottky capacitance spectroscopy method. The results show the presence of thin interfacial layer between the metal and semiconductor.     

Effect of series resistance on the performance of silicon Schottky diode in the presence of tin oxide layer

The current–voltage (I–V) characteristics of Al/SnO₂/p-Si (MIS) Schottky diodes prepared by means of spray deposition method have been measured at 80, 295 and 350 K. In order to interpret the experimentally observed non-ideal Al/SnO₂/p-Si Schottky diode parameters such as, the series resistance R_s, barrier height Φ_B and ideality factor n, a novel calculation method has been reported by taking into account the applied voltage drop across interfacial oxide layer V_i and ideality factor n in the current transport mechanism. The values obtained for V_i were subtracted from the applied voltage values V and then the values of R_s were recalculated. The parameters obtained by accounting for the voltage drop V_i have been compared with those obtained without considering the above voltage drop. It is shown that the values of R_s estimated from Cheung’s method were strongly temperature-dependent and decreased with increasing temperature. It is shown that the voltage drop across the interfacial layer will increase the ideality factor and the voltage dependence of the I–V characteristics. The interface state density N_ss of the diodes has an exponential growth with bias towards the top of the valance band for each temperature; for example, from 2.37 × 10¹³ eV⁻¹ cm⁻² in 0.70−E_v eV to 7.47 × 10¹³ eV⁻¹ cm⁻² in 0.62−E_v eV for 295 K. The mean N_ss estimated from the I–V measurements decreased with increasing the temperature from 8.29 × 10¹³ to 2.20 × 10¹³ eV⁻¹ cm⁻².