中子辐照对掺镱光纤材料光学特性的影响

采用改进型化学气相沉积法结合稀土螯合物掺杂制备了系列掺镱光纤预制棒及光纤,并测试了光纤(预制棒)辐照、退火前后的光学性能.结果表明:中子辐照后掺镱光纤材料中与Al相关的缺陷浓度增多,导致光纤材料在可见光区域吸收损耗增加.Ce离子的掺杂可缓减铝氧空位中心(Al-OHC)等色心缺陷的增加,从而有效抑制掺镱光纤的辐致暗化效应.热退火可降低中子辐致色心缺陷的浓度从而降低光纤材料的吸收,在一定程度上消除暗化效应.     

氮掺杂金刚石{100}晶面的缺陷发光特性

氮是金刚石中最常见的杂质之一, 其对金刚石的缺陷发光具有重要的影响. 氮可以与金刚石中的本征缺陷形成复合缺陷. 本文首先利用阴极射线发光照片(CL)对一个高温高压合成的氮掺杂金刚石进行表征, 发现{100}晶面为蓝色, 然后利用透射电子显微镜(TEM)对该晶面进行电子辐照及后续退火处理, 以引入本征点缺陷进而形成含氮的复合缺陷, 并利用低温光致发光光谱(PL光谱)表征其缺陷发光特性, 发现该晶面主要以氮-空位复合缺陷(NV中心)发光为主, 并伴随着较弱的503 nm发光. 关键词： 金刚石 缺陷 发光     

GaAs的中子嬗变掺杂

硅的中子嬗变掺杂(NTD)已经得到了广泛应用,在制备大功率整流器、可控硅、硅靶摄像管、核探测器和集成电路等方面巳被公认是一个好的方法[1-3].NTD硅的优点是掺杂十分均匀,浓度偏差可在±5%之内,而且它的掺杂精度很高,能够准确地达到所要求的浓度. 1971年苏联的 Sh.M.Mirishvili等人[4]报道了GaAs的中子嬗变掺杂,在这以后,一些作者进一步研究了热中子辐照GaAs的原理、光致发光性质及其应用[5-8]. 用常规掺杂方法在砷化棕中引入施主杂质时,总是伴随着受主浓度的增加.在掺杂浓度较低时,n型GaAs具有明显的补偿,。。/。。一般超过0.3,而在…     

退火对ZnS纳米晶结构相变及发光的影响

采用共沉淀法制备了ZnS及ZnS：Eu纳米晶粉末,并对其在不同温度进行了退火处理。通过X射线粉末衍射(XRD)技术及差热分析实验(DTA)对ZnS纳米粒子在退火过程中的从立方到六角晶相的结构相变进行了研究。实验结果表明,同体材料相比,由于ZnS纳米晶具有较大的表面活性,其相变温度大大降低了。在由纳米粉末退火制备的样品中,观察到峰值位于460nm和520nm的两个发光带。前者是ZnS的自激活发光;后者归因于纳米晶制备过程中引入的缺陷或者在退火过程中形成了杂质能级。在退火温度低于800℃条件下,由纳米粒子制备的样品和由商用生粉制备的荧光粉相比较,前者的发光明显较强。铕的掺杂并没有形成新的发光中心,但却极大的增强了ZnS的缺陷发光。     

热退火、激光束和电子束等作用对纳米硅制备及其局域态发光特性的影响

在纳米晶体硅制备的过程中, 晶化处理是影响和提高纳米硅发光效率的重要制备环节. 热退火、激光退火和电子束辐照是使纳米硅样品晶化的不同方式. 实验表明: 选取适当的晶化方式和参量对制备纳米硅晶体结构至关重要, 特别是在制备硅量子点和量子面的过程中控制好参量, 可以得到较高的发光效率. 有趣的是, 在实验中发现: 当晶化时间较短(如低于20 min)时, 可以获得较好的纳晶硅结构(如量子点结构), 对应于较好的纳晶硅光致发光(PL)和掺杂局域态发光; 当晶化时间较长(如超过30 min)时, 纳米晶体硅结构被破坏, 致使PL谱逐渐减弱与消失. 结合热退火、激光退火和电子束辐照对纳米硅晶化过程, 本文建立起晶化时间对纳米硅局域态发光影响机理的物理模型, 解释了晶化时间对纳米硅局域态发光的影响.     

金刚石中GR1中心的光致发光特性研究

金刚石中空位存在中性、负电及正电三种状态, 且空位-空位、空位-杂质之间可以形成更多复合缺陷. 利用低温光致发光光谱研究了金刚石经辐照产生的中性空位的发光特性, 对进一步研究其他复合缺陷的发光性能提供了重要的指导意义. 关键词： 金刚石 中性空位 GR1中心     

中子辐照GaAs快速退火行为的低温光荧光研究

用低温（１０Ｋ）光荧光（ＰＬ）的方法对中子辐照砷化镓中的缺陷及及嬗变掺杂进行了研究，结果表明：低温ＰＬ实验可观察到中子掺杂效应，嬗变掺杂使近导带旋主增加从而使与ＣＡＳ有关的跃迁峰向低低能移动，辐照剂量较低时，嬗变原子Ｇｅ占居Ｇａ位；当辐照剂量较大时，部分嬗变原子Ｇｅ占居Ａｓ全，在高剂量辐照情况下，经８００℃（２０秒）退火，仍有反位缺陷ＧａＡＳ（Ｅｖ＋２００ｍｅＶ）和复合缺陷ＩＧａ－ＶＡｓ存在，在低     

Eu3+:Y态效应2O3纳米微粒的尺寸效应和表面的研究

通过相同掺杂浓度但不同颗粒尺寸的Eu:Y2O3纳米晶,和相同颗粒尺寸但掺杂浓度不同的纳米晶的发光衰减曲线研究了表面态和限域作用对能量传递的影响.纳米晶与体材料相比,有更高的猝灭浓度,分析了纳米材料中发光中心的猝灭浓度提高的原因.由于纳米材料与体材料相比,纳米晶中的缺陷密度很小,纳米晶中有较少的体猝灭中心.选择合适的颗粒尺寸并对其进行表面修饰,将获得较高发光效率和较高的猝灭浓度.     

α-Al2O3: Mn单晶的三维热释发光谱研究

测量了α-Al2O3: Mn单晶中子辐照前后的三维热释发光谱.观察到α-Al2O3: Mn:Mn单晶γ射线照射后测量的三维热释发光谱中，峰温在350℃波长为680nm处有一宽发光峰，这可能与Mn2+离子有关；波长为695nm峰温在170℃和350℃的线状光谱，叠加在680nm宽发光峰上，是Cr3+离子的发光谱线,其中可能有Mn4+离子的贡献.与纯α-Al2O3单晶的热释发光谱相比，掺入Mn杂质后，γ射线照射的三维热释发光谱中完全地抑制了波长为416nm的α-Al2O3的F心发光峰.经1017cm-2中子注量辐照和退火后，γ射线照射后测量的三维热释发光谱中，在150℃出现了波长为416和695nm的发光峰，以及在250℃波长为680和695nm的发光峰，其中695nm新发光峰的强度略超过了中子辐照前α-Al2O3:Mn在350℃波长为695nm的发光峰，说明中子辐照产生了大量浅陷阱能级和F心.然而，经1018cm-2中子注量辐照和退火后，γ射线照射后测量的三维热释发光谱中，出现了峰温150℃，190℃和250℃波长为520nm的Mn2+离子发光峰，以及300℃波长为680和695nm的Cr3+（或Mn4+）的发光峰，表明增高中子注量的辐照，产生了温度为190℃，250℃和300℃深陷阱能级和F心，并使Mn2+离子发光峰明显加强. 关键词： α-Al2O3:Mn 三维发光谱 缺陷结构 发光机理     

Ni2+掺杂和卤素空位填充协同抑制CsPbBr3纳米晶体中的离子迁移

卤化铅钙钛矿(LHPs)由于具有优异的光电性能和制备成本低等优点,已成为新一代光电器件的有力候选材料。然而,缺陷造成的离子迁移会导致LHPs纳米晶的晶体结构解离分解。因此,稳定性成为LHPs实际应用中亟待解决的问题。本文旨在研究镍离子替位掺杂及卤素空位填补对CsPbBr3纳米晶中的离子迁移抑制作用。通过离子迁移活化能的测定和高分辨透射电镜的原位观察,分析了前驱体掺杂剂对加强LHPs稳定性的作用原理。首先,选用乙酰丙酮镍和溴化镍作为掺杂剂,合成了掺杂LHPs纳米晶。其次,通过吸收-荧光光谱,X射线衍射,X射线光电子衍射,透射电子显微镜等测试手段对掺杂样品的光学及化学组成进行分析。最后,通过纳米晶薄膜电导率的温度依赖关系计算出其离子迁移活化能,并结合高分辨电镜原位观察纳米晶在高能电子束辐照下的形貌演变过程,揭示了不同掺杂剂对合成掺杂LHPs稳定性的影响。实验结果表明:Ni²⁺掺杂CsPbBr3样品的离子迁移活化能相较本征CsPbBr3样品(0.07 eV)有显著提升,其中乙酰丙酮镍掺杂样品的离子迁移活化能为0.238 eV,溴化镍掺杂样品的离子迁移活化能为0.487 eV。另外,电子束辐照测试表明溴化镍掺杂钙钛矿晶体表现出更高的结构稳定性,这主要归因于掺杂的Ni²⁺对卤素的强结合和卤素填补空位缺陷的协同钝化作用。Ni²⁺掺杂和卤素空位填充协同可以有效抑制卤化物钙钛矿纳米晶体中的离子迁移。     

The Raman spectroscopy of neutron transmutation doping isotope Germanium nanocrystals embedded in SiO2 matrix

We have succeeded in doping arsenic (As) impurities into isotope germanium nanocrystals (nc-⁷⁴Ge) uniformly dispersed in a SiO₂ matrix by using the neutron transmutation doping (NTD) method. The samples’ inner structural transmutation is studied by combining Raman scattering, X-ray fluorescence (XRF), X-ray photoelectron spectroscopy (XPS) and Transmission electron microscope (TEM) methods. The Raman spectrum of the doped sample exhibits a relative intensity increase of the low frequency tail, blue shift of the main Raman peak (∼300 cm⁻¹) and a high frequency tail, while the undoped sample does not. Together with the XRF, XPS and TEM, we believe that the relative intensity increase of the low frequency tail arises from an increase of amorphous ⁷⁴Ge (a-⁷⁴Ge) induced by the irradiation damage. The blue shift of the main Raman peak comes from the mismatch of the crystal lattice which arose from the As impurity introduction. And the high frequency tail is due to transmuted-impurities (As) in the nc-⁷⁴Ge which was introduced by NTD.     

Effect of As doping on the photoluminescence of nanocrystalline Ge embedded in SiO2 matrix

Samples of nanocrystalline ⁷⁴Ge embedded in amorphous SiO₂ film were prepared by ⁷⁴Ge ion implantation and subsequent primary thermal annealing. These samples were irradiated by neutron flux in a nuclear reactor then the second annealing followed. Irradiation with thermal neutrons leads to doping of nanocrystalline ⁷⁴Ge with As impurities due to nuclear transmutation of isotope ⁷⁴Ge into ⁷⁵As. Transmission electron microscope, X-ray fluorescence, X-ray photoelectron spectroscopy, laser Raman scattering and photoluminescence of the obtained samples were measured. It was observed that with the increase in As-donors concentration, photoluminescence intensity first increased but then significantly decreased. An explanatory model of this non-monotonic behavior was discussed.     

Electron paramagnetic resonance in neutron-transmutation-doped semiconductors with a changed isotopic composition

Potential applications of electron paramagnetic resonance (EPR) for investigating and controlling the process of neutron transmutation doping (NTD) of semiconducting germanium, silicon, and silicon carbide are discussed. It is shown that EPR enables one to control the process of annealing of radiation-induced defects in semiconductors subject to neutron irradiation and to detect the shallow donors restored in the process of annealing of donor-compensating defects by observing EPR signals from these donors. EPR can be used to separately detect isolated donors and clusters of two, three, and more exchange-bound donor atoms and thereby determine the degree of nonuniformity of the impurity distribution over the crystal. Neutron transmutation doping is demonstrated to produce a fairly uniform arsenic-donor distribution in a germanium crystal. It is argued that semiconductors enriched in the selected isotopes should be used for NTD. The results of an investigation of phosphorus donors in silicon carbide are presented.     

Neutron transmutation doping in semiconductors: Science and applications

Different aspects of neutron transmutation doping (NTD) of silicon and germanium are considered, with a special emphasis on the contribution by scientists of the Ioffe Physicotechnical Institute, Russian Academy of Sciences, to the solution of these problems. Fundamental studies related to determination of the cross sections of thermal-neutron capture by isotopes of semiconducting materials, annealing of radiation defects produced by fast reactor neutrons, and the use of NTD for probing the structure of the Ge impurity band are reviewed. Problems involved in industrial-scale production of NTD-Si, application of NTD-Si and NTD-Ge to fabrication of power thyristors, nuclear-particle and IR detectors, deep-cooled thermistors, and bolometers are discussed. The paper concludes with a consideration of prospects in the application of NTD-Si and NTD-Ge based on the use of materials with a controlled isotopic composition. Fiz. Tverd. Tela (St. Petersburg) 41, 794–798 (May 1999)     

Neutron transmutation doping of GaP: optical studies

An unambiguous proof for successful neutron transmutation doping (NTD) of GaP is presented on the basis of optically detected magnetic resonance (ODMR). GaP:S samples grown by the liquid encapsulated Czochralski method were irradiated with thermal neutrons and subsequently annealed at 800°C. In the ODMR experiments the transmuted Ge substitutional on Ga sites was detected. The NTD process was also found to create deep acceptors, the nature of which will be tentatively discussed.     

Electrical and ellipsometry study of sputtered SiO2 structures with embedded Ge nanocrystals

SiO₂ layer structures with a middle layer containing Ge nanocrystals were prepared by sputtering on n- and p-type Si substrates, and by consecutive annealing. Ge content in the middle layer was varied in the range of 40-100%. Most of the structures exhibited low breakdown voltages. The current through the structures became Schottky-like after breakdown. However, some p-type samples showed a considerable memory effect. It was obtained by spectroscopic ellipsometry that the middle layer contains amorphous Ge phase as well. The results also suggest intermixing of the layers during the sputtering and/or the annealing process.     

Violet luminescence in Ge nanocrystals/Ge oxide structures formed by dry oxidation of polycrystalline SiGe

Nanocrystals of Ge surrounded by a germanium oxide matrix have been formed by dry thermal oxidation of polycrystalline SiGe layers. Violet (3.16 eV) luminescence emission is observed when Ge nanocrystals, formed by the oxidation of the Ge segregated during the oxidation of the SiGe layer, are present, and vanishes when all the Ge has been oxidized forming GeO₂. Based on the evolution of the luminescence intensity and the structure of the oxidized layer with the oxidation time, the recombination of excitons inside the nanocrystals and the presence of defects in the bulk oxide matrix are ruled out as sources of the luminescence. The luminescence is attributed to recombination in defects at the Ge sub-oxide interface between the Ge nanocrystals and the surrounding oxide matrix, which is GeO₂.     

中子辐照高掺硅砷化镓的光致发光研究

研究了高掺硅的n型GaAs在中子辐照前后和150℃-500℃等时热退火以后的光致发光光谱。观察到在中子辐照后积分发光强度降低为辐照前的1/36。在退火温度超过250℃时,积分发光强度显著增长,当退火温度达400℃以上时,在带边峰的低能侧出现能量为1.35eV、1.30eV和1.26eV的发光峰。假设250℃退火阶段对应于较大的空位团分解为较小的空位团,400℃退火阶段对应于较小的空位团分解出VGa,可以较好地解释实验现象。     

Synthesis of Ge nanocrystals by atom beam sputtering and subsequent rapid thermal annealing

Ge nanocrystals embedded in an SiO₂ matrix were prepared by the atom beam co-sputtering (ABS) method from a composite target of Ge and SiO₂. The as-deposited films were rapid thermally annealed at the temperatures 700 and 800 °C in nitrogen ambience. The structure of the films was evaluated by using X-ray diffraction (XRD) and Raman spectroscopy. XRD results reveal that as-deposited films are amorphous in nature whereas annealed samples show crystalline nature. Raman scattering spectra showed a peak of Ge–Ge vibrational mode shifted downwards to 297 cm^?1, presumably caused by quantum confinement of phonons in the Ge nanocrystals. Rutherford backscattering spectrometry has been used to measure the thickness and Ge composition of the composite films. Size variation of Ge nanocrystals with annealing temperature has been discussed. The advantages of ABS over other methods are highlighted.     

Fabrication of multilayered Ge nanocrystals embedded in SiOxGeNy films

Multilayered Ge nanocrystals embedded in SiO_xGeN_y films have been fabricated on Si substrate by a (Ge + SiO₂)/SiO_xGeN_y superlattice approach, using a rf magnetron sputtering technique with a Ge + SiO₂ composite target and subsequent thermal annealing in N₂ ambient at 750 °C for 30 min. X-ray diffraction (XRD) measurement indicated the formation of Ge nanocrystals with an average size estimated to be 5.4 nm. Raman scattering spectra showed a peak of the Ge-Ge vibrational mode downward shifted to 299.4 cm⁻¹, which was caused by quantum confinement of phonons in the Ge nanocrystals. Transmission electron microscopy (TEM) revealed that Ge nanocrystals were confined in (Ge + SiO₂) layers. This superlattice approach significantly improved both the size uniformity of Ge nanocrystals and their uniformity of spacing on the ‘Z’ growth direction.