超强激光与固体气体复合靶作用产生高能氦离子

激光氦离子源产生的MeV能量的氦离子因有望用于聚变反应堆材料辐照损伤的模拟研究而得到关注.目前激光驱动氦离子源的主要方案是采用相对论激光与氦气射流作用加速高能氦离子,但这种方案在实验上难以产生具有前向性和准单能性、数MeV能量、高产额的氦离子束,而这些氦离子束特性是材料辐照损伤研究中十分关注的.不同于上述激光氦离子产生方法,我们提出了一种利用超强激光与固体-气体复合靶作用产生氦离子的新方法.利用这种方法,在实验上,采用功率密度5×10~(18)W/cm~2的皮秒脉宽的激光脉冲与铜-氦气复合靶作用,产生了前向发射的2.7 MeV的准单能氦离子束,能量超过0.5 MeV的氦离子产额约为10~(13)/sr.二维粒子模拟显示,氦离子在靶背鞘场加速和类无碰撞冲击波加速两种加速机理共同作用下得到加速.同时粒子模拟还显示氦离子截止能量与超热电子温度成正比.     

氦、氘对纯铁辐照缺陷的影响

在核聚变堆的辐照环境中, 核嬗变产物氢、氦对结构材料的抗辐照性能将产生很大的影响. 本实验采用离子注入和电子辐照模拟研究了氦和氘对具有体心立方结构的纯铁的影响. 采用离子加速器在室温分别对纯铁注入氦离子和氘离子, 经500℃时效1 h后在高压电镜下进行电子辐照.结果表明: 室温注氦和室温注氘的纯铁在500℃时效后分别形成间隙型位错环和空位型位错环. 在电子辐照下, 间隙型位错环吸收间隙原子而不断长大, 而空位型位错环吸收间隙原子不断缩小. 通过计算位错环的变化速率发现, 空位型位错环比间隙型位错环吸收了更多的间隙原子, 即室温注氘纯铁的位错偏压比室温注氦纯铁的偏压参量大, 这意味着相同实验条件下空位型位错环对辐照肿胀的贡献大于间隙型位错环对辐照肿胀的贡献. 利用氦-空位复合体和氘-空位复合体的结构, 分析了注氦和注氘后在纯铁中形成不同类型位错环的原因. 关键词： 氦 氘 辐照损伤 位错环     

Effect of bombardment with iron ions on the evolution of helium,hydrogen, and deuterium blisters in silicon

The effect of bombardment with iron ions on the evolution of gas porosity in silicon single crystals has been studied. Gas porosity has been produced by implantation hydrogen, deuterium, and helium ions with energies of 17, 12.5, and 20 keV, respectively, in identical doses of 1 × 10¹⁷ cm^–2 at room temperature. For such energy of bombarding ions, the ion doping profiles have been formed at the same distance from the irradiated surface of the sample. Then, the samples have been bombarded with iron Fe¹⁰⁺ ions with energy of 150 keV in a dose of 5.9 × 10¹⁴ cm^–2. Then 30-min isochoric annealing has been carried out with an interval of 50°C in the temperature range of 250–900°C. The samples have been analyzed using optical and electron microscopes. An extremely strong synergetic effect of sequential bombardment of silicon single crystals with gas ions and iron ions at room temperature on the nucleation and growth of gas porosity during postradiation annealing has been observed. For example, it has been shown that the amorphous layer formed in silicon by additional bombardment with iron ions stimulates the evolution of helium blisters, slightly retards the evolution of hydrogen blisters, and completely suppresses the evolution of deuterium blisters. The results of experiments do not provide an adequate explanation of the reason for this difference; additional targeted experiments are required.     

Effect of simultaneous helium implantation on the microstructure evolution of Inconel X-750 superalloy during dual-beam irradiation

This study focuses on investigation into the effect of helium implantation on microstructure evolution in Inconel X-750 superalloy during dual-beam (Ni⁺/He⁺) irradiation. The 1 MeV Ni⁺ ions with the damage rate of 10^?3 dpa/s as well as 15 keV He⁺ ions using rate of 200 appm/dpa were simultaneously employed to irradiate specimens at 400 °C to different doses. Microstructure characterization has been conducted using high-resolution analytical transmission electron microscopy (TEM). The TEM results show that simultaneous helium injection has significant influence on irradiation-induced microstructural changes. The disordering of γ′ (Ni₃ (Al, Ti)) precipitates shows noticeable delay in dose level compared to mono heavy ion irradiation, which is attributed to the effect of helium on promoting the dynamic reordering process. In contrast to previous studies on single-beam ion irradiation, in which no cavities were reported even at high doses, very small (2–5 nm) cavities were detected after irradiation to 5 dpa, which proved that helium plays crucial role in cavity formation. TEM characterization also indicates that the helium implantation affects the development of dislocation loops during irradiation. Large 1/3 〈1?1?1〉 Frank loops in the size of 10–20 nm developed during irradiation at 400 °C, whereas similar big loops detected at higher irradiation temperature (500 °C) during sole ion irradiation. This implies that the effect of helium on trapping the vacancies can help to develop the interstitial Frank loops at lower irradiation temperatures.     

Silica luminescence induced by fast light ions

Silica luminescence induced by hydrogen and helium ions of 200 keV–2.4 MeV was experimentally studied in the near ultraviolet and visible wavelength ranges. The luminescence spectrum consists of three asymmetric wide bands with maxima at wavelengths of 282, 456 and 644–648 nm. For nonirradiated silica, it was shown that the spectral shape depends on observation angle, ion species and energy. The changes in the spectra and relations between light intensity of luminescence and both absorption dose and observation angle were determined. Differences in ionoluminescence spectra measured for molecular and atomic hydrogen ions were observed, i.e. the so-called “molecular effect” was found. The influence of different beam parameters (incidence angle, ion species and energy) on indicatrix at a wavelength of 456 nm was found for nonirradiated silica. The applications of ionoluminescence measurements for distant monitoring of silica irradiation processes are discussed.     

Stimulation of secondary negative ion emission by implantation of alkaline ions into the surface layer of a solid followed by heating

A new method of stimulating secondary negative ion emission is suggested that is based on implantation of alkaline ions into the surface layer of a solid with subsequent heating to a temperature providing optimal coverage of the surface (about half a monolayer) by activator (alkaline) ions. It is shown that, by appropriately selecting the implantation dose (10¹⁸–10¹⁹ cm⁻³) and surface temperature (500–900°C), one can reach such a degree of coverage of the sample surface by activator ions that its work function eφ becomes minimal: 1.9 eV for molybdenum and 2.1 eV for copper. It is found that, with the implantation (irradiation) dose and surface temperature chosen properly, one can, by means of outdiffusion of cesium atoms, achieve such a degree of surface coverage that remains unchanged during the continuous sputtering of the surface by a cesium ion beam.     

Modernized setup for studying the interaction of ions with energies to 40 keV with the surface

A modernized setup for studying the ion-surface interaction is briefly described. The main ion channel implemented on the “Large MEPhI mass monochromator” with an ion energy range of 1–40 keV makes it possible to obtain ion beams with (EM/Z) ≤ 4000 keV × a.m.u. Operation with intermediate-energy hydrogen ions allows obtaining information on the thickness of layers of atoms with masses differing from substrate atoms, by analyzing energy spectra of protons scattered from two- or three-layer targets. The use of new digital power units and relevant control programs also allows automation of the ion beam control and makes it possible to perform ion-beam experiments using preliminarily developed irradiation programs.     

氦离子显微镜对钨中氦行为的实验研究

针对热核聚变面向等离子体钨材料中氦泡形成、演变以及机理研究的需求,克服目前常用离子注入、电子扫描显微镜和透射电子显微镜等离线研究手段存在的不足,提出氦离子显微镜对钨中氦的上述行为原位实时在线研究方法.借助氦离子显微镜的离子注入、显微成像和聚焦离子束纳米加工功能,它可以提供能量为0.5—35 ke V、束流密度可达10~(25) ions/(m~2·s)以上的氦离子束,在该设备上进行钨中氦的注入实验.同时在注入过程,实时在线监测钨中氦泡形成、演变过程以及钨材料表面形貌的变化,原位在线分析钨材料表面氦泡的大小、迁移合并以及其诱发的钨表面和近表面的微观损伤.实验结果表明:氦离子显微镜是研究钨中氦行为演变过程及其微观机理研究的新的研究手段和强有力的实验工具.     

Sputter damage in Si surface by low energy Ar+ ion bombardment

The damage distributions in Si(1 0 0) surface after 1.0 and 0.5 keV Ar⁺ ion bombardment were studied using MEIS and Molecular dynamic (MD) simulation. The primary Ar⁺ ion beam direction was varied from surface normal to glancing angle. The MEIS results show that the damage thickness in 1.0 keV Ar ion bombardment is reduced from about 7.7 nm at surface normal incidence to 1.3 nm at the incident angle of 80°. However, the damage thickness in 0.5 keV Ar ion bombardment is reduced from 5.1 nm at surface normal incidence to 0.5 nm at the incident angle of 80°. The maximum atomic concentration of implanted Ar atoms after 1 keV ion bombardment is about 10.5 at% at the depth of 2.5 nm at surface normal incidence and about 2.0 at% at the depth of 1.2 nm at the incident angle of 80°. However, after 0.5 keV ion bombardments, it is 8.0 at% at the depth of 2.0 nm for surface normal incidence and the in-depth Ar distribution cannot be observable at the incident angle of 80°. MD simulation reproduced the damage distribution quantitatively.     

Optical characterization and laser damage of fused silica optics after ion beam sputtering

The sputtering process of fused silica bombarded by Ar ion beam is simulated with the SRIM software. The effects of ion beam energy and incident angle on sputtering yield and surface damage are computed. Since ion beam sputtering will result in defects in fused silica, such as E′ color centers and other lattice defects and probably Argon bubbles, the optimized sputtering energy is selected below 1 keV so that the projected range of Ar ions is less than 10 Å. The experimental results show that the scratches in subsurface of fused silica can be smoothed obviously and better surface can be obtained as the optimized parameters are used for ion beam sputtering. The laser induced damage threshold of fused silica increases by about 18% after ion beam sputtering.     

Hollow beam formation in the intense multi-component heavy ion beam caused by beam self-field

The simulation of the hollow beam formation in the intense multi-component ion beam from ECR source is fulfilled. The influence of the helium and hydrogen beam current on the argon and calcium ions dynamics has been studied.     

Measurement of lattice damage caused by ion-implantation doping of semiconductors†

Two new techniques have been used to measure the lattice damage produced in gallium arsenide by the implantation of 60 keV cadmium ions. In one of these methods, optical reflection spectra of the ion-implanted samples were measured in the wavelength range from 2000 to 4600Å. The decrease in reflectivity resulting from ion- implantation was used to determine the relative amount of lattice damage as a function of ion dose. The second technique employed the scanning electron microscope. Patterns very similar in appearance to Kikuchi electron diffraction patterns are obtained when the secondary and/or backscattered electron intensity is displayed in the scanning electron microscope as a function of the angle of incidence of the electron beam on a single crystal surface. The degradation of these ‘Coates-Kikuchi’ patterns resulting from ion implantation was used to obtain a quantitative measure of the lattice damage caused by the implantation process. The results of measurements made by both of the methods described have been compared with each other, and with data obtained by the more established method of measuring lattice damage by Rutherford scattering of 1 MeV helium ions.     

Radiation damage by implanted ions in GaAs and GaP

Abstract

The production of lattice disorder in GaAs and GaP by Te ions up to 40 keV has been investigated. For GaAs the build up of damage with implanted ion dose is linear until a saturation level is reached. For Gap, two linear regions are evident; a slow build up of damage to ?15 per cent of the saturation level, followed by a faster rate of increase up to the final 100 per cent level. Radiation annealing, for GaP samples, both by the heavy ion beam during implantation and by the helium beam during back-scattering measurements has been observed. The annealing temperatures required for re-ordering the lattice depend on the percentage of damage present. Samples damaged up to the saturation level require annealing at ?500°C, whilst 300°C is sufficient for samples damaged to ?50 per cent of the saturation value.     

Surface defects,stress evolution,and laser damage enhancement mechanism of fused silica under oxygen-enriched condition

Oxygen ions (O⁺) were implanted into fused silica at a fixed fluence of 1×10¹⁷ ions/cm² with different ion energies ranging from 10 keV to 60 keV. The surface roughness, optical properties, mechanical properties and laser damage performance of fused silica were investigated to understand the effect of oxygen ion implantation on laser damage resistance of fused silica. The ion implantation accompanied with sputtering effect can passivate the sub-/surface defects to reduce the surface roughness and improve the surface quality slightly. The implanted oxygen ions can combine with the structural defects (ODCs and E' centers) to reduce the defect densities and compensate the loss of oxygen in fused silica surface under laser irradiation. Furthermore, oxygen ion implantation can reduce the Si-O-Si bond angle and densify the surface structure, thus introducing compressive stress in the surface to strengthen the surface of fused silica. Therefore, the laser induced damage threshold of fused silica increases and the damage growth coefficient decreases when ion energy up to 30 keV. However, at higher ion energy, the sputtering effect is weakened and implantation becomes dominant, which leads to the surface roughness increase slightly. In addition, excessive energy aggravates the breaking of Si-O bonds. At the same time, the density of structural defects increases and the compressive stress decreases. These will degrade the laser laser-damage resistance of fused silica. The results indicate that oxygen ion implantation with appropriate ion energy is helpful to improve the damage resistance capability of fused silica components.     

Spatial distribution profiles of defects in cadmium-mercury-tellurium after ion implantation

Defect spatial distributions are investigated after implantation of ions in Cd_xHg_1−xTe under various sets of conditions (radiation dose, type and energy of ions, ion current density, and dose absorption rate). Distribution profiles of electrically active radiation-induced defects are calculated with allowance for the generation of defect complexes of vacancion nature. Defect profiles are determined in experiments after implantation of hydrogen and iron ions at constant low ion current densities, and after implantation of copper, tungsten, and aluminum ions in the case of pulsed bombardment at high ion current densities. Secondary-ion mass spectrometry, electron-positron annihilation, Rutherford backscattering of ions, and differential Hall measurements are used to obtain distribution profiles of interstitial ions, vacancion and extended defects, and electrically active defects, respectively. The profiles of these defects are analyzed for various ion-implantation conditions. V. D. Kuznetsov Siberian Physicotechnical Institute at Tomsk State University Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 1, pp. 101–116, January, 1998.     

Influence of electron irradiation of the NOVER-1 vacuum resist on its resistance to ionbeam etching

The influence of electron irradiation on the resistance of the NOVER-1 resist to ion-beam etching is studied. Etching is carried out by argon ions with energies between 300 and 2500 eV. It is found that, depending on the energy and angle of incidence of the ions on the surface of the resist, electron irradiation may either speed up or slow down the NOVER-1 etching. A clear correlation is observed between the penetration depth of the ions in the resist and the influence of the electron irradiation on the resistance of the resist to etching. At ion energies higher than 500 eV (ion penetration depth ≳3.5 nm) the resistance decreases, passes through a minimum at low electron irradiation doses, and returns to the etching rate of the initial resist at high doses. For glancing etching angles (∼ 70° to the surface normal) and low ion energies (300 eV), i.e., small ion penetration depths (≲2.5 nm), an electron-irradiated resist is etched more slowly than the initial resist at all the electron irradiation doses studied. This effect may be used to enhance the resistance of resist structures whose height exceeds their width, which in this case is determined mostly by the rate of etching of the inclined facets. Zh. Tekh. Fiz. 68, 140–142 (January 1998)     

Sputtering yields for light ions as a function of angle of incidence

The sputtering yield of Ni, Mo, and Au have been measured at oblique angles of incidence for H⁺-, D⁺-, and⁴He⁺-ion irradiation in the energy region from 1 to 8 keV. The yields were determined from the weight loss of the targets. For Ni and Mo the dependence of the sputtering yield on the angle of incidence was found to be much stronger for H⁺- and D⁺-ion than for⁴He⁺-ion irradiation. In all cases the maximum in the yield was found at angles of incidence ϑ≧80°, where ϑ is the angle measured from the surface normal. Furthermore the ratio of the maximum yield to the yeild at normal incidence increases with increasing surface binding energy of the target material as well as with increasing ion energy in the energy region inveestigated. The results are discussed qualitatively in view of a model for the sputtering mechanism for light ions.     

Channeling of charged particles in crystals as an effective tool for studying Mo-Re alloys

The crystal structure of Mo-Re alloys is investigated by channeling of helium ions at an energy of 1.8 MeV in the concentration range in which the electronic topological transition was previously revealed from an analysis of the superconducting and normal properties. It is found that, for Mo-Re alloys containing 11 and 32 at. % Re, the dependences of the yield Y of backscattered particles on the angle θ between the particle beam and the 〈110〉 crystallographic direction exhibit a specific feature in the form of an additional maximum at the half-width (θ = 0.8°). It is assumed that the observed feature is associated with the formation of a superstructure due to the electronic topological transition in Mo-Re alloys.     

Correlation between implantation defects and dopants in Fe-implanted SiC

SiC single crystals were implanted with Fe ions and the effects of implantation temperature, Fe concentration, and subsequent swift heavy ion irradiation on both dopant and damage depth distributions were evaluated by using RBS and channelling techniques. It is found that an increase of the implantation temperature above the threshold temperature for amorphization can lead to the formation of a broad layer (∼50 nm) containing a large concentration of implanted Fe atoms (∼2 at.%) but almost free of implantation defects. This particular configuration is likely due to dynamic annealing during implantation combined with defect annihilation at the surface. It is only observed when the implanted species concentration does not exceed a critical value (which lies between 2 and 5 at.% in the present system). Post-implantation swift heavy ion irradiation leads to a further decrease of the damage level, while the Fe distribution is not affected. The Fe substitutional fraction has been evaluated in the different tested conditions. A maximum value of ∼50% is found when implantation is performed at the temperature above that required to prevent amorphization (470 K in the present system). Swift-heavy ion irradiation seems to induce Fe atoms relocation at substitutional positions.