裂纹与夹杂物的互作用

本文求解了一个圆形夹杂物对裂纹尖端应力场的影响,计算了反平面切变问题经典的应力场和应力强度因数,进而求得了非局域应力场,得到非奇异的裂纹尖端应力的解析表达式,讨论了解的应用。 关键词：     

夹杂理论及其在断裂研究中的应用

利用无限介质中的格林函数,本文首先导出一般形状的夹杂所产生的拘束应力场,夹杂中的无应力应变ε_ij^*可以是位置的函数,在此基础上,给出了平面问题的全部计算公式,文中把裂纹或空腔看做是其弹性常数为零的一种特殊的异性夹杂,在物体受到外加应力场的作用时,计算了与椭圆空腔等效的夹杂的无应力应变,对于扁平形状的夹杂,在其端点附近显示出与裂纹完全类似的r^-1/2式应力奇点,算出了相应的应力强度因子,对于本文结果的一些应用做了讨论,例如椭圆空腔与外加应力场的交互作用,马氏体转变和形变孪晶所伴随形成的微观裂纹等。 关键词：     

边界元法分析二维线弹性裂纹扩展

用边界元法研究裂纹扩展过程.首先将尖端区域Williams渐近展开的特征分析法与边界积分方程结合,解出切口尖端附近应力奇异性区域的各应力场渐近展开项系数,获得平面切口/裂纹结构完整的位移和应力场.再基于考虑非奇异应力项贡献的最大周向应力脆性断裂准则,运用边界元法分析边缘含裂纹半圆形弯曲试样在荷载作用下的启裂方向,对裂纹扩展过程给出自动跟踪方法,通过算例证明边界元法模拟裂纹扩展过程的正确性和有效性.     

α-Fe纯I型裂纹扩展中位错形成过程的三维分子动力学模拟

通过分子动力学方法模拟了三维 α-Fe I型裂纹的单向拉伸实验中的裂纹扩展过程。研究了在不同温度下裂纹扩展时位错的形成过程和断裂机理。计算结果表明,裂纹扩展过程是位错不断发射的过程。 裂纹尖端附近先形成无位错区和层错,当裂纹处应力增加到KI=0.566 MPam1/2时,裂纹尖端附近的某一层原子会逐渐分叉形成两层原子,分层后的原子层继续分离形成位错;当应力KI 达到0.669MPam1/2时第一个位错发射。随着温度的升高,临界应力强度因子逐渐降低,同时位错发射也相应地加快。     

α-Fe纯I型裂纹扩展中位错形成过程的三维分子动力学模拟

通过分子动力学方法模拟了三维 α-Fe I型裂纹的单向拉伸实验中的裂纹扩展过程。研究了在不同温度下裂纹扩展时位错的形成过程和断裂机理。计算结果表明,裂纹扩展过程是位错不断发射的过程。 裂纹尖端附近先形成无位错区和层错,当裂纹处应力增加到KI=0.566 MPam1/2时,裂纹尖端附近的某一层原子会逐渐分叉形成两层原子,分层后的原子层继续分离形成位错;当应力KI 达到0.669MPam1/2时第一个位错发射。随着温度的升高,临界应力强度因子逐渐降低,同时位错发射也相应地加快。     

碳纤维布补强梁裂尖奇异性的光学焦散线实验研究

通过光学焦散线方法对碳纤维布加固含裂纹梁进行三点弯荷载下的静荷载和冲击实验,研究了其断裂特性。在静态实验研究中,记录了不同载荷状态下裂纹的焦散斑光学图像,计算了与之对应的裂纹尖端的应力强度因子,分析了试件在粘贴加固不同长度的碳纤维布情况下焦散斑和应力强度因子演化规律。在动态实验中,记录了裂纹扩展的过程和在此过程中不同时刻的焦散斑和裂纹扩展的路线。通过各瞬间的焦散斑图像,分析裂纹的扩展长度及速度,并得到各时刻的动态应力强度因子。     

片状切变型夹杂导致的脆性开裂

片状切变型夹杂可以表现一些重要物理过程的力学特征,例如在晶体材料中形成的滑移带、形变孪晶带以及片状马氏体等。这些过程与材料的断裂密切相关。本文采用位错连续分布方法,导出了位于片状夹杂端部的裂纹的应力强度因子的解析表达式。根据本文的结果,我们讨论了片状夹杂所导致的微裂纹扩展的特征。由夹杂理论可以得到多晶体孪晶脆断应力的Hall-Petch关系,理论计算与实验结果符合得好。 关键词：     

钛金属应力腐蚀机理电子理论研究

为从理论上揭示钛金属应力腐蚀行为的本质，建立了α钛晶粒及位错塞积形成的微裂纹原子 集团模型，利用递归法(recursion)计算了裂纹及晶粒内的电子结构参量(费米能级、结构能 、表面能、团簇能、环境敏感镶嵌能). 计算结果表明：氢在裂纹处的环境敏感镶嵌能较低 ，易于偏聚在裂纹处，且氢在钛金属裂纹处团簇能为正值不能形成团簇，具有有序化倾向， 趋于形成氢化物. 氢在裂纹处偏聚降低裂纹的表面能，使裂纹容易扩展. 裂纹尖端处费米能 级高于裂纹其他区域，使电子从裂纹尖端流向裂纹其他区域造成电位差，在电解质作用下裂 关键词： 递归法 电子结构 钛 应力腐蚀     

陶瓷材料中圆形夹杂的本征应变导致的微开裂

由夹杂转变引起的微开裂与陶瓷材料的断裂和增韧机制密切相关。本文采用位错连续分布的方法,导出圆形夹杂发生本征应变时在母体材料中形成的微裂纹的位错密度函数、张开位移及应力强度因子的解析表达式,并据本文得到的结果进行了分析和讨论。 关键词：     

相干梯度敏感干涉测量技术及在静态断裂力学实验中的应用

介绍了相干梯度敏感(CGS)干涉测量技术的基本原理及其在静态Ⅰ型断裂实验中的应用,验证了该方法对裂纹尖端局部变形场和断裂特性进行定量研究的可行性。给出了代表静态Ⅰ型裂纹尖端奇异场光力学信息的CGS控制方程,模拟并分析了Ⅰ型裂纹尖端的CGS条纹模式,对静态Ⅰ型裂纹尖端变形场和断裂特性进行了三点弯曲的CGS试验,并提取了应力强度因子KⅠ。结果表明,试验结果与理论分析结果相吻合。     

Elastic analysis of a mode Ⅱ crack in an icosahedral quasicrystal

Based on the displacement potential functions, the elastic analysis of a mode II crack in an icosahedral quasicrystal is performed by using the Fourier transform and dual integral equation theory. By the solution, the analytic expressions for the displacement field and stress field are obtained. The asymptotic behaviours of the phonon and phason stress fields around the crack tip indicate that the stresses near the crack tip exhibit a square root singularity. The most important physical quantities of fracture theory, crack stress intensity factor and energy release rate, are evaluated in an explicit version.     

Evolution of the concentration of point defects at the tip of a crack

The evolution of the distribution of interstitial impurity atoms in the plastic zone around the tip of a tension crack is analyzed. The transport of point defects is determined by: 1) the hydrostatic component of the elastic stress at the crack tip, created by the superposition of the elastic fields of the crack and dislocations; 2) the elastic field of moving dislocations (“sweeping out” of interstitial impurity atoms); 3) the dislocation-driven transport of point defects present in the dislocation cores. The contributions of each mechanism of transport of point defects to the crack tip are calculated over the entire time from the start of loading of a sample containing a crack until an equilibrium distribution of plastic deformation is established after the cessation of loading. Numerical calculations are carried out for interstitial hydrogen atoms dissolved in an α-Fe crystal. Fiz. Tverd. Tela (St. Petersburg) 39, 1580–1585 (September 1997)     

Shielding effect and emission criterion of a screw dislocation near an interfacial blunt crack

Shielding effect and emission criterion of a screw dislocation near an interfacial blunt crack are dealt with in this paper. Utilizing the conformal mapping technique, the closed-form solutions are derived for complex potentials and stress fields due to a screw dislocation located near the interfacial blunt crack. The stress intensity factor on the crack tips and the critical stress intensity factor for dislocation emission are also calculated. The influence of the orientation of the dislocation and the morphology of the blunt crack as well as the material elastic dissimilarity on the shielding effect and the emission criterion is discussed in detail. The results show that positive screw dislocations can reduce the stress intensity factor of the interfacial blunt crack tip (shielding effect). The shielding effect increases with the increase of the shear modulus of the lower half-plane, but it decreases with the increase of the dislocation azimuth angle. The critical loads at infinity for dislocation emission increases with the increase of emission angle and curvature radius of blunt crack tip, and the most probable angle for screw dislocation emission is zero. The present solutions contain previous results as special cases.     

A model of a belt chamber cracking based on crack profiles calculations

Abstract

The problem of a Belt chamber matrix cracking is presented. The influence of crack surface quality on the effective values of near crack tip stress is discussed. It is shown that under working conditions of the vessel, the existing shear friction between upper and lower crack surfaces caused by crack surface roughness can prevent the crack surface sliding displacement. Therefore, the control variable for matrix cracking is the value of stress intensity factor K_I corresponding to normal node of loading only. The calculations are performed by finite element method within the range of linear elastic fracture mechanics.     

Elastic behaviour of an edge dislocation near a sharp crack emanating from a semi-elliptical blunt crack

The interaction between an edge dislocation and a crack emanating from a semi-elliptic hole is dealt with. Utilizing the complex variable method, closed form solutions are derived for complex potentials and stress fields. The stress intensity factor at the tip of the crack and the image force acting on the edge dislocation are also calculated. The influence of the morphology of the blunt crack and the position of the edge dislocation on the shielding effect to the crack and the image force is examined in detail. The results indicate that the shielding or anti-shielding effect to the stress intensity factor increases acutely when the dislocation approaches the tip of the crack. The effect of the morphology of the blunt crack on the stress intensity factor of the crack and the image force is very significant.     

Dynamic caustics and its applications

For the study of elastodynamic problems of propagating cracks it is necessary to evaluate the dynamic stress intensity factor K^d_I which depends on the form of expressions for the stress components existing at the running crack tip at any instant of the propagation of the crack and the corresponding dynamic mechanical and optical properties of the material of the specimen under identical loading conditions. In this paper the distortion of the form of the corresponding reflected caustic from the lateral faces of a dynamically loaded transparent and optically inert specimen containing a transverse crack running under constant velocity was studied on the basis of complex potential elasticity theory and the influence of this form on the value of the dynamic stress intensity factor was given. The method was applied to the study of a propagating Mode I crack in a PMMA specimen under various propagation velocities and the corresponding dynamic stress intensity factor K^d_I evaluated. Also, crack propagation behaviour of notched composites in dynamic loading modes are reviewed and evaluated. A relatively large data base using metal-epoxy particulates, rubber-toughened poly(methyl methacrylate), and Sandwich plates are given. In all cases, a combination of high-speed photography and the optical method of dynamic caustics has been used. Results on the dynamic crack propagation mode, fracture toughness and crack propagation velocities of several rubber-modified composite models are presented. The composite models studied include specimens with one and/or two ‘complex’ two-stage inclusions, i.e. PMMA round inclusions surrounded by concentric rubber rings, one and/or press-fifting inclusions without rubber interface, all under dynamic loading. In all cases both qualitative and quantitative results were obtained. Also, results on crack propagation mode, crack propagation velocity, stress intensity factors and on the influence of the sandwich phases on crack propagation mode are presented.     

Effect of microcracking on electric-field-induced stress intensity factors in dielectric ceramics

This paper gives a quantitative analysis of the effect of near-tip microcracks on electric-field-induced stress intensity factors in isotropic elastic dielectrics. Nucleation of the microcracks is assumed to be governed by the electric-field-induced mean stress or the maximum normal stress. Based on the solutions for the effect of a single microcrack on the local electric field at the main crack, simple formulae are derived for the electric-field-induced stress intensity factors in the presence of the microcracks. It is found that the relative change in the stress intensity factor due to the microcracks for a conducting crack is equal and opposite to that for an insulating crack provided that the distribution of microcrack orientations is random. In particular, the microcracking zone is found to amplify the electric-field-induced stress intensity factor in some cases, especially for stationary insulating cracks, while the microcracking zone wake has an antishielding effect for sufficiently grown conducting cracks. These results are in sharp contrast with the well-known toughening effects of microcracks in elastic media under pure mechanical loads. This is attributed to the fact that the interaction between the microcracks and the main crack in elastic dielectrics under electrical loading is governed essentially by electrostatics, while the shape of the microcracking zone is determined by the electric field induced elastic stress field.     

Thermal stress cleaving of silicon wafer by pulsed Nd：YAG laser

The applied laser energy absorbed in a local area in laser thermal stress cleaving of brittle materials using a controlled fracture technique produces tensile thermal stress that causes the material to separate along the moving direction of the laser beam. The material separation is similar to crack extension, but the fracture growth is controllable. Using heat transfer theory, we establish a three-dimensional （3D） mathematical thermoelastic calculational model containing a pre-existing crack for a two-point pulsed Nd：YAG laser cleaving silicon wafer. The temperature field and thermal stress field in the silicon wafer are obtained by using the finite element method （FEM）. The distribution of the tensile stress and changes in stress intensity factor around the crack tip are analyzed during the pulse duration. Meanwhile, the mechanism of crack propagation is investigated by analyzing the development of the thermal stress field during the cleaving process.